DE102010027438A1 - Producing connection point and/or connection region on and/or in surface of substrate, comprises removing material to obtain periodic deep structure on and/or in surface by laser interference, and partially filling deep structure - Google Patents

Abstract

Producing a connection point and/or a connection region on and/or in a surface of a substrate, comprises carrying out material removal leading to a periodic deep structure (2) on and/or in the surface of the substrate by laser interference, and at least partially filling the deep structure introduced in the surface of the substrate with an appropriate intermediary material (3) for material-fit connection. Independent claims are also included for: (1) a substrate (1) with a joint and/or a connection region produced in at least one of its surface; and (2) a component with the substrate and an element disposed with the substrate or laminating material associated with the substrate, preferably a lamination layer produced by the above mentioned method.

Description

The present invention relates to a method for producing a joint and / or a bonding region on and / or in a surface of a substrate. The substrate can be any material whose wetting and / or adhesion properties are to be improved.

From the prior art z. B. Laser pre-treatment of surfaces for the subsequent adhesive or Kaschiereinsatz using one-dimensional or two-dimensional laser scanner technology in combination with focusing optics known: The laser beam scans the surface quasi-simultaneously and hits, depending on the optics, vertically or at a position-dependent variable angle , on the sample surface.

The disadvantage here is that the scanning leads to an irregular energy input, which in turn leads to different deep structures and / or undefined patterns of introduced into the sample surface depth structure. In addition, the laser scanner methods have a high heat input into the processed sample material.

It is also known from the prior art to change the topography of a sample surface by sandblasting with corundum. If silicic acid-modified corundum is used, an SiO _x layer is deposited in addition to a roughening of the surface.

The disadvantage here is in particular that an additional cleaning process to be performed (which must then be carried out before and after the sandblasting) is necessary. The sandblasting also leads to inhomogeneities in the surface or in the achieved deep structuring of this surface, since a uniform machining is difficult to control. In addition, corundum blasting is unsuitable for thin parts to be joined and can not be integrated into production lines.

Based on the prior art, it is therefore an object of the present invention, a method for producing a joint and / or a connection region and / or a method for connecting a material (hereinafter also referred to as a substrate) with another material (hereinafter also as with to provide the substrate to be provided with the substrate or as to be bonded to the substrate lamination (laminating)), to improve the wetting and / or adhesion properties of the material and / or between the material and the element to be equipped with this material or laminating material and with which a high-strength connection between a suitable for bonding, applied to the substrate mediator material (which may be a bonding agent material or to be laminated to the substrate material) and the substrate surface and / or between the substrate and a to be equipped element is produced. With the method according to the invention, an improved adhesive or lamination behavior and a high-strength bond between the materials involved (substrate, adhesion promoter material and substrate or substrate to be provided with the substrate and mediator material in the form of a laminating material) should thus be achieved when applying the bonding material suitable for bonding.

The object of the invention is moreover to provide a corresponding substrate with a connection point and / or a connection region and a component with a substrate and an element arranged with this substrate or a material laminated onto the substrate.

The above object is achieved by a manufacturing method according to claim 1, by a substrate according to claim 10 and by a component according to claim 11. Advantageous embodiments can be found in each case the dependent claims.

In this case, the entire following description of the invention is made for a method for producing a connection point and / or a connection region in the form of a joint or a joining region, in which case the generated deep structure (see below) is at least partially covered by a bonding agent material (adhesive material) suitable for cohesive joining. is filled as mediator material. However, exactly the same procedure can be inventively realized for the formation of a joint or a connection region as a lamination or laminating: In this case, the depth structure is filled with a laminating material instead of a Haftvermittlermaterials or adhesive material.

Also, materials other than adhesive or laminating materials that are suitable for bonding can be incorporated into the depth structure.

All of the features described below for joining according to the invention are thus also disclosed according to the invention for the application of a laminating material or a laminating layer to the deep-structured substrate. The only difference then is that only the lamination material is filled into the deep structure of the substrate as a mediator material (and as a rule also applied, for example, as a planar lamination layer, for example): in this case only two different materials (substrate material and lamination) is required, which then required during joining (in addition to the substrate material and the adhesive or adhesive material) further, to be equipped with the substrate material (further element) is then eliminated.

In the context of the following description of the invention, the adhesion promoter material is alternatively also referred to as an adhesive, although it may in general be an arbitrary material, which after application and / or introduction on and / or in the surface of the substrate for forming a material connection of the Substrates or its surface is suitable with the element to be provided.

The invention will first be described in general terms, then by means of exemplary embodiments. The individual features described in combination with one another in the context of the exemplary embodiments do not have to be realized exactly in the configurations shown in the examples, but can also be realized in different combinations with one another in the context of the present invention. In particular, individual method steps described in the exemplary embodiments can also be omitted.

The basic idea of the present invention is based on structuring the surface of the substrate by means of laser interference, that is to produce a deep structure extending from the surface into the depth of the substrate (by means of the laser-related removal of material) and then a cohesive joining of the substrate with a substrate to introduce other material suitable adhesion promoter material in the wells of the depth structure. As a rule, these depressions are micrometer-sized structures, so that in the following, alternatively, micro-depressions or microstructures are also used.

According to the invention, for this purpose a flat or also precontoured (eg curved) surface of the substrate (or of the substrate and of the element to be provided therewith, ie both surfaces of the joining materials to be provided can be treated accordingly) by direct laser beam interference and or by using microlens arrays (see also below) and structured using a pulsed or continuous laser radiation in the UV range, in the visible range and / or in the infrared range structured with a micrometer or sub-micrometer structure.

The (deep) -structured joining materials (substrate and / or element) may be plastics, in particular fiber-reinforced plastics, ceramics, metals or alloys. However, the field of application of the present invention is not limited to the materials mentioned.

After the deep structuring of the surface of the substrate (or both joining materials), the order of the adhesive agent suitable for cohesive joining (adhesive application) is carried out for the subsequent cohesive joining process. Depending on which adhesive agent is used, it may be necessary to consider time constraints, which make it necessary to have the two joining materials within a predefined time interval.

Adhesive systems based on polyaddition (for example epoxides, polyurethanes and / or silicones), polycondensation (formaldehydes, polyamides and / or silicones), polymerization (eg acrylates or rubber polymers or also thermoplastic elastomers) and physically setting systems (US Pat. Hot melt adhesives, eg polyolefins). The adhesive systems mentioned must be mixed, metered and applied accordingly, that is to be introduced into the depressions, which may necessitate different process steps depending on the adhesion promoter materials used: Depending on the adhesion promoter materials and / or on the specific adhesive geometries of the substrate and / or element following are Method used: free-falling droplet application, screen printing process, stamping, needle application, brush application, spatula and / or racket, spraying, spraying, pouring and / or rolling. The curing conditions (temperature, if appropriate application of UV radiation,...) Of the adhesion promoter materials used depend on the crosslinking mechanisms of these materials.

A method according to the invention for producing joining regions on surfaces of substrates thus comprises a first step, in which a material removal from this surface takes place on and / or in the surface of the substrate by means of a laser beam interference method by laser irradiation of the surface of the substrate a deep structuring of this surface leads. Under such a deep structure, the introduction of usually micrometer to submicron sized structures, such as trenches or holes, in the usually formerly (at least locally) flat surface of the substrate understood. Preferably, periodic depth structures are introduced.

Subsequently, in a second step, the introduction of the material-locking joining suitable Haftvermittlermaterials in the introduced in the surface depth structure. Depending on the number, position, size and / or shape of these depressions and / or the shape of the surface prior to their deep structuring, the individual depressions of the deep structure must not necessarily be filled with all and / or complete with the adhesion promoter material, if necessary a partial one is sufficient Fill up.

In a first advantageous variant of the method, the irradiated laser light used for laser beam interference with locally varying laser light intensity is irradiated onto the surface of the substrate in such a way that a locally varying material removal results in the formation of a plurality of individual depressions of the deep structure.

In a further advantageous variant, the laser interference irradiation can be carried out by one or more laser beam (s) through one or more microlens array (s) (s) and thereby (in each case) is divided into several individual beams / are. These individual beams are then focused on a focus area. The surface of the substrate to be structured is then arranged behind the / the microlens array (s) at a predefined position in the laser beam direction: this position can be in front of the focus area, in the area of the focus area or behind the focus area, wherein preferably a positioning of the surface of the substrate takes place in the focus area.

Alternatively, or with a suitable arrangement of the individual system elements also in combination therewith, the laser interference-induced material removal can also take place as follows: Several coherent laser beams are brought into interference in a superposition area under predefined angle (s). The substrate surface is hereby positioned at a predefined position in this overlay area. The plurality of laser beams can be generated by means of one or more beam splitters (s) from a single laser beam emitted by a single laser and guided into the overlap area using beam deflectors such that interference of these laser beams occurs in this overlapping area.

The deep structure introduced into the substrate surface or its individual depressions may be one-dimensional or two-dimensional periodic structures. The spacings of the individual depressions, the periodicity of the deep structure, the depth of the individual depressions (perpendicular to the substrate surface), their lateral extent in the substrate surface and / or the aspect ratios (eg in the case of periodically introduced linear trenches with burrs remaining therebetween ) Advantageous to be realized orders of magnitude can be found in the dependent claims.

• • linienartige Muster mit periodischem Abstand d,
• • kreuzartige Muster, die durch Mehrfachbestrahlung mit Linienmustern mit einem spezifischen Rotationswinkel von beispielsweise 30°, 60° oder 90° erreicht werden,
• • kombinierte kreuzartige Muster mit unterschiedlichen Linienabständen d₁ und d₂,
• • verschiedene Anordnungen von Vertiefungen (Löchern) mit unterschiedlichen Abständen,
• • praktisch beliebige Formen von Vertiefungen, die mittels Mikrolinsenarrays über der Probe eingebracht werden können,
• • praktisch beliebige Formen von Vertiefungen, die über eine Verschiebung der Probe während der Laserbestrahlung durch ein/mehrere Mikrolinsenarray(s) eingebracht werden können,
• • praktisch beliebige Formen von Vertiefungen, die durch eine Verschiebung der Bestrahlungsoptik während der Bestrahlung mittels eines Mikrolinsenarrays einstrukturiert werden können,
• • linienartige Muster, die über Mikrolinsenarrays eingebracht werden können,
• • kreuzartige Muster, die durch eine Mehrfachbestrahlung mit Linienmustern mit Mikrolinsenarrays erzeugt werden können, oder
• • beliebige Kombinationen der vorstehend aufgezählten Varianten.

In particular, the depth structures introduced by laser interference may include the following variants:

• Line-like patterns with periodic spacing d,
• Cross-shaped patterns achieved by multiple irradiation with line patterns with a specific rotation angle of for example 30 °, 60 ° or 90 °,
• Combined cross-type patterns with different line distances d ₁ and d ₂ ,
• Various arrangements of depressions (holes) with different distances,
• Virtually any shape of wells that can be placed over the sample by means of microlens arrays;
• Virtually any shape of wells that can be introduced by a displacement of the sample during the laser irradiation by one / more microlens array (s),
• Practically any shapes of depressions which can be structured by a displacement of the irradiation optics during the irradiation by means of a microlens array,
• Line-like patterns that can be introduced via microlens arrays,
• Cross-shaped patterns, which can be generated by multiple irradiation with line patterns with microlens arrays, or
• Any combination of the above enumerated variants.

The laser irradiation can be pulsed or continuous, laser wavelengths in the visible, in the infrared and / or in the ultraviolet range can be used. Particular preference is given to using Nd: YAG pulsed lasers with wavelengths of 266 nm or 355 nm.

The key advantage of the present invention is the introduction of a precise periodic micrometer or sub-micrometer structure, which, in combination with the achieved by the introduction of the structure surface enlargement and the subsequent application of the Haftvermittlermaterials (adhesive), an optimized joining process can be achieved can.

The laser beam interference allows the processing of all types of surfaces and component geometries under natural environmental conditions. It enables the production of precisely defined periodic micro or sub-micrometer structures in a single process step. The high resolution that can be achieved is superior to other commercially used microstructuring methods.

Moreover, the direct laser interference patterning method according to the invention (without the use of microlens arrays) is characterized in particular by the fact that large areas can be structured on almost any material in a short time. No other method produces such a homogeneous and defined pattern on a joining part surface. The surface embossing or structuring by laser interference according to the invention can effectively improve the adhesive layer morphology and the structure-dependent, mechanical behavior of the substrate and / or element to be provided therewith.

The inventive laser beam interference method for component pretreatment for the subsequent introduction of the Haftvermittlermaterials, ie for the actual joining, also allows a very small joining or adhesive gap. In the case of low-viscosity adhesives, the surface structures produced can also interlock extremely effectively.

The present invention moreover encompasses the use of the methods according to the invention described above in the field of medical technology, optics, sensor technology and in areas in which surface distortions and undefined adhesive quantities have a decisive negative influence on the overall system. In addition, applications of the described methods are also possible in particular in other high-technology areas, such as in the field of electronics or in the field of aircraft construction.

The production process according to the invention and the substrates and components according to the invention formed by this process will be described below with reference to several exemplary embodiments.

Show it:

1 a sketch for a substrate with joint area, which can be produced according to the invention.

2 various depth structure shapes (hereinafter alternatively referred to as well structure shapes) of the present invention.

3 a microlens array configuration for carrying out a manufacturing method according to the invention.

4 different microlens arrays for the construction according to 3 ,

5 a direct laser interference structuring structure for a manufacturing method according to the present invention in two-beam configuration.

6 a corresponding structure as in 5 in three-beam configuration.

7 a corresponding structure as in 5 in four-beam configuration.

8th a schematic diagram for generating a recess structure according to the invention in a substrate base by a manufacturing method according to 5 to 7 ,

9 an inventive component consisting of a substrate with joining region and an element disposed with this substrate.

1 shows in a cross section perpendicular to the layer plane S of a substrate according to the invention 1 the structure of such a substrate. The substrate is here a flat copper plate of thickness 5 mm, which is to be glued high-strength with another element.

How about the 3 to 8th will be described in detail, first takes place a laser structuring of the still planar substrate, in which a (in the layer plane S of the substrate 1 seen locally varying intensity input into a surface 1a of the substrate 1 realized by that this surface 1a is irradiated with a large number of individual laser (partial) beams. The laser intensity is adjusted so that locally at the location of the impact of the individual laser beams, a material removal from the surface 1a or in the substrate 1 he follows.

The intensity of the laser beams (Nd: YAG pulsed laser with frequency tripling of wavelength 355 nm) is determined by superposition of several beams ( 3 to 8th ) adjusted so that the individual recesses realized by the material removal in the interference maximum 2a . 2 B , ... a depth h perpendicular to the layer plane S of about 5 microns obtained, so seen perpendicular to the layer plane about 1 / 1000th of the substrate locally removed (eg evaporated or melted) is.

By controlling the impact angle β of z. B. two laser beams ( 5 ), the periodicity p of the interference patterns can be varied (seen in the layer plane S). In this way, a plurality of individual, rectilinear, parallel to each other and at constant intervals d extending trenches as wells 2a . 2 B , ... in the surface 1a , The distance d of adjacent trenches (ie the periodicity p of the generated one-dimensional pit structure 5 ) is about 15 microns here. The generated trench width in the layer plane S and perpendicular to the trench longitudinal axes is about l = 7.5 microns. This results in an aspect ratio A = h / l = 5 / 7.5. Instead of the trenches but also columns or holes or hole pattern can be structured as wells.

After the laser structuring of the surface 1a becomes the substrate 1 with the deep structure 2 for the deposition of the adhesive material 3 in the generated wells 2a . 2 B subjected to a screen printing process. In the present case, one for bonding the Cu plate 1 suitable epoxy material in the wells 2a . 2 B , ... imprinted.

2 shows different periodic pit structures 3 , which by laser structuring and parallel to the layer plane S running in the surface 1a can be trained. So shows 2a) a one-dimensional deepening structure 2 in the form of a trench structure G1, in which a plurality of parallel trenches spaced from each other. The distance d of immediately adjacent trenches or the periodicity p in the direction R1 perpendicular to the trench longitudinal axes can be, for example, between 0.2 μm and 100 μm.

2 B) shows a superposition of two such trench structures at an angle α ≠ 0 ° (here: α = 70 °): For example, first using a cylindrical lens microlens array, the first trench structure G1 (trench distance d1) are generated in the direction of R1, before the substrate 1 is rotated by α, and then by renewed laser irradiation by the cylindrical lens microlens array (or with a line-like interference pattern) the second trench structure G2 (trench spacing d2) in the direction R2 (which is then rotated by α with respect to the direction R1) produce.

2c) shows the case 2 B) in which α = 90 °, that is two perpendicular to each other and in the substrate surface 1a formed trench structures G1, G2 (cross lattice).

2d) shows an example where the pit structure 2 is not formed in the form of one or more trench structure (s), but a plurality of individual holes 2a . 2 B , ... includes. The holes are arranged at the crossing points of a square lattice, so that a two-dimensional periodicity of the recess structure results in two mutually perpendicular directions R1 and R2 (the hole spacing or d1 in the direction R1 and the hole spacing or d2 in the direction R2 are identical here). For example, d1 = d2 = 20 μm and a hole diameter l in the layer plane of 5 μm and a hole depth h perpendicular to the layer plane of 5 μm are selected.

2e) shows another case of a periodic hole structure as in FIG 2d) However, here, however, the two directions R1 and R2, in which the individual holes are arranged in each case at periodic intervals in rows, not perpendicular to each other, but form an angle of α = 70 °.

3 shows a first structure for producing a substrate according to the invention 1 with one in its surface 1a introduced joining area 2 . 3 , The structure comprises a laser (not shown), for example a UV-emitting laser with a wavelength of λ = 266 nm. The laser beam 4 This laser is here in pulsed form (but it can also be a continuous laser beam are generated, the element 13 then omitted) first by a device 13 to control the number of pulses, here a mechanical shutter, blasted. Behind the mechanical shutter 13 is in the beam path of the laser beam 4 a homogenizer 14 arranged. The homogenizer consists of a system of optical elements, the z. B. generate a top-has beam profile. In the beam path 4 behind the homogenizer 14 is a telescope system 15 arranged to control or for adjusting a desired beam diameter. This follows in the beam path 4 a diaphragm (here: iris diaphragm) or also a rectangular diaphragm 16 before the laser beam 4 finally on a microlens array 5 meets. The aperture 16 is used to calculate the beam outline and beam diameter of the laser beam 4 to bring to a predetermined shape (eg, rectangular) and size. The order of the components 13 to 16 This can be different than in 3 be selected. If necessary, you can access the elements 13 to 16 be waived.

The microlens array 5 Here, a cylindrical lens microlens array with a plurality of in a plane parallel to each other and at constant distances from each other arranged cylindrical lenses (the longitudinal axes are arranged here perpendicular to the plane shown). The individual cylindrical lenses of the microlens array 5 have a focus distance f. Through the microlens array 5 becomes the laser beam 4 thus in a variety of individual sub-beams 4a . 4b . 4c , ..., split at a distance f behind the microlens array 5 on a flat surface 6 be focused.

By means of a movable in the three translational directions x, y and z of a Cartesian coordinate system moving table 17 is now the substrate 1 aligned so that the surface to be structured 1a (see. 1 ) parallel to the focus area 6 is aligned. In the case shown, the surface is falling 1a and the focus area 6 together so that the sub-beams 4a . 4b , ... are focused on this surface (focus distance f equals distance a of the array 5 from the surface 1a ). By a suitable choice of the beam parameters of the laser beam 4 become thus at the point of impact of the partial beams 4a . 4b , ... in the substrate 1 the above-described specialization structures 2 generated.

For setting the structure size of the recess structure 2 can the distance a between microlens array 5 and substrate base 1 To be changed: By moving the substrate base 1 by means of the sliding table 14 in + z-direction becomes the focal plane 6 behind the surface 1a into the interior of the substrate 1 postponed; it then becomes pits 2a . 2 B , ... with enlarged lateral extent 1 generated. The same happens in a method in -z direction, since the focal plane 6 then outside the substrate 1 and before that lies. In order to control the structure size of the recess structure, the distance a can thus be selected to be greater or smaller than the focal distance f. In addition, it is possible by translation of the substrate 1 in the x and / or y direction by means of the displacement table 17 create different well structure geometries of controlled size.

Instead of a sliding table (with or without rotation axis), a robot can be used. Here, both the components 5 and 13 to 16 as well as the substrate base 1 be coupled with the translation table and / or robot. When arranging the components 5 and 13 to 16 at a corresponding translation table or robot, it is advantageous to use fiber-coupled lasers.

4a) again sketched how about a change of the distance a relative to the focal distance f (variation of the distance of the surface 1a relative to the microlens array) the feature size that of the layer 3 is restructured, can be changed. 4b) to f) shows that different microlens arrays can be used: Line-generating microlens arrays with cylindrical ( 4b) ) Microlenses, dot-forming microlenses with crossed cylindrical ( 4c) ) Microlenses, with hexagonal ( 4d) ) or square ( 4e) ) Lens arrays and square microlens arrays ( 4f) ). All of these microlens arrays 5 from the 4b) to 4f) can thus be in 3 shown construction can be used.

When in the 3 and 4 shown construction can use different laser wavelengths. For pulsed lasers (with pulse lengths eg in the nanosecond, picosecond or femtosecond range), various processes such as erosion, reflow, phase transformation, local hardening, etc. can be used to form the well structure 2 in the surface 1a be achieved. Likewise, direct surface modifications are possible with a laser pulse. The number of laser pulses can be varied to suit the shape and depth of the surface modifications 2 to control. Also, the laser intensity can be varied to different geometries of the modifications 2 to obtain.

5 shows a structure for a direct laser interference patterning for the production of the deep structure 2 a substrate according to the invention prepared for joining 1 . 2 . 3 , A pulsed laser beam 7 with predefined intensity is first through a device 13 to control the number of pulses (here: mechanical shutter) blasted (alternatively, a continuous laser beam can be used, in this case, the device 13 possibly omitted). In the beam path after the device 13 is a homogenizer (here: a cylindrical or rectangular aperture) 14 arranged. The laser beam leaving the homogenizer is passed through a telescope system 15 , with which the beam diameter is brought to a predefined, desired size (eg 5 mm), blasted. The telescope system 12 follows an aperture (eg iris diaphragm) or a rectangular diaphragm 16 to arrive at a predefined desired shape (eg rectangular) and beam size, and to set a predefined beam profile.

In the beam path after the aperture 16 follows a first, here also the only beam splitter 10a with which the laser beam 4 in two partial beams 4a and 4b is separated. The first partial beam 4a is arranged over two beam deflectors arranged in the beam path in the form of mirrors 11a and 11b deflected and finally at a predefined angle to the surface 1a (not shown here). The substrate base 1 is here, similar to in 3 shown on a sliding table 17 arranged. The the beam splitter 10a leaving second partial beam 4b gets over another mirror 11c deflected and also at a defined angle to the surface 1a irradiated. The two aforementioned irradiation angle of the two partial beams 4a and 4b are formed so that the two partial beams at an angle β of z. B. 40 ° to each other and cross in a superposition area U or overlay. In this overlapping area U, in which the two partial beams 4a . 4b Cross, that is overlay, is the substrate 1 arranged in the surface of the recess structure 2 is to bring. The angle β between the two laser beams 4a . 4b can be varied to produce structures of different periodicity.

Using the sliding table 17 can be a shifting of the substrate 1 so that large, flat as well as non-planar (eg cylindrical) surfaces deep-structured 2 can be. The displacement may be orthogonal to the main beam axis (eg, lateral or vertical), or parallel to the main beam axis, and / or rotation of the element 1 consist. The lateral extent l and / or the depth h of the structures 2 can be set via the beam intensity, irradiation duration and / or number of pulses.

8th outlines the overlay area U 5 in detail: Both rays overlapping at the angle β 4a . 4b form in the overlay area U, where the surface 1a is arranged, an interference pattern (standing wave structure), at whose maxima a periodic deep structuring 2 of the substrate 1 (at the nodes of the interference structure lying between the maxima there is no deep structuring, since here the incident intensity is lower (possibly also zero)).

The in the 5 and 8th Thus, the direct laser beam interference patterning technique shown makes it possible to produce periodic two-dimensional or three-dimensional microstructures on all types of substrates to be prepared for joining and component geometries. To generate an interference structure, N (with N ≥ 2) become collimated and coherent laser beams 4a . 4b , ... on or under a surface 1a superimposed. This also results in particular the advantage that both flat, and not flat, curved surfaces can be structured, since the interference in the entire overlapping volume of the individual partial beams 4a . 4b , ... takes place.

6 and 7 show two further structures for direct laser interference patterning. These are basically like the ones in 5 shown construction, so that only the differences are described below: When in 6 shown construction is a three-beam structure, in which two successive in the beam path of the laser beam 4 introduced beam splitter 10a . 10b a split into three individual partial beams 4a . 4b and 4c done, then using appropriate mirror 11a to 11d from three different directions, ie at different angles to the surface 1a be irradiated. The three partial beams 4a to 4c thus also overlap in a superposition area U, in which the substrate 1 is arranged.

7 shows a corresponding four-beam arrangement, in which over three consecutive in the beam path of the laser radiation 4 arranged beam splitter 10a to 10c a splitting of the beam 4 in a total of four different partial beams 4a to 4d takes place, in turn, by means of differently arranged and aligned beam deflector 11a to 11e from four different directions on the arranged in the overlay area U surface 1a be irradiated. Here, too, all four individual rays intersect or overlap 4a to 4d in the overlay area U.

9 shows a component produced according to the invention, in which a on its surface 1a with a joining area 2 . 3 provided substrate 1 with a further element E has been.

At the substrate 1 it is a (before deep structuring) flat plastic plate, here on a metal base 1b is screwed on. After introducing a one-dimensional, periodic deep structure in the form of parallel trenches 2a . 2 B , ..., with constant trench spacing d of adjacent trenches (corresponding to the periodicity p of the deep structure 2 ) was using a doctor blade, an acrylate-based adhesion promoter material 3 in the trenches 2a . 2 B , ..., incorporated. The trenches in this case were complete, ie over their entire height h, and beyond with adhesion promoter material 3 filled up, so that on the metal plate 1b opposite side or over the surface 1a of the substrate 1 standing out a thin, closed adhesive layer 3 additionally trains.

Finally, that will work with the substrate 1 to be joined another element E, which is here another flat plastic plate, parallel to the surface 1a or to the layer plane S on the adhesive layer 3 hung up and with the elements 1 . 1b druckverpresst.

Claims (11)

Method for producing a joint and / or a bonding area on and / or in a surface ( 1a ) of a substrate ( 1 ), on and / or in the surface ( 1a ) of the substrate ( 1 ) by means of laser interference to a preferably periodic depth structure ( 2 ) leading material removal takes place before the surface ( 1a ) of the substrate ( 1 ) introduced deep structure ( 2 ) at least partially with a mediator suitable for material bonding ( 3 ) is refilled. Method according to the preceding claim, characterized in that the material removal by means of laser interference takes place by laser light ( 4 ) with in and / or tangentially to the surface ( 1a ) seen spatially varying laser light intensity on the surface ( 1a ) is irradiated thereby that on and / or in the surface ( 1a ) a locally varying material removal for the formation of depressions ( 2a . 2 B , ...) of the deep structure ( 2 ) leads. Method according to one of the preceding claims, characterized in that the material removal by means of laser interference takes place by at least one laser beam ( 4 ) through a microlens array ( 5 ) blasted and thereby into several Single beams ( 4a . 4b , ...), which is based on a preferably flat focus area ( 6 ) and the surface ( 1a ) seen in the laser beam direction behind the microlens array ( 5 ) at a predefined position in front of the focus area ( 6 ), in the area of the focus area ( 6 ) or behind the focus area ( 6 ), preferably in the focus area ( 6 ) is positioned. Method according to one of the preceding claims, characterized in that the material removal by means of laser interference takes place by several coherent laser beams ( 4a . 4b , ...) are brought into interference in a superposition area (U) under predefined angle (s) and in that the surface ( 1a ) is positioned at a predefined position in this overlay area (U), wherein preferably the multiple laser beams ( 4a . 4b , ...) by means of at least one beam splitter ( 10a . 10b , ...) from a single laser beam emitted by a laser ( 4 ) and using at least one beam deflector ( 11a . 11b , ...) into the overlay area (U). Method according to one of the preceding claims, characterized in that on and / or in the surface ( 1a ) a periodic depth structure ( 2 ), in particular a periodic deep structure in one direction (R1) ( 2 ) or in two mutually at an angle (α) of not equal to 0 °, preferably of 90 °, stationary directions (R1, R2) periodic depth structure ( 2 ), and / or that a plurality of depressions ( 2a . 2 B , ...) of the deep structure ( 2 ) is formed so that the distance d (d1, d2) of adjacent recesses ( 2a . 2 B , ...) and / or a periodicity p of the deep structure ( 2 ) in and / or tangentially to the surface ( 1a ) between 100 nm and 500 μm, preferably between 5 μm and 50 μm, the depth extent h of the depressions ( 2a . 2 B , ...) perpendicular to the surface ( 1a ) and / or a tangential surface thereof between 1 μm and 500 μm, preferably between 10 μm and 100 μm, that the lateral extent l of the recesses ( 2a . 2 B , ...) in and / or tangential to the surface ( 1a ) between 1 .mu.m and 500 .mu.m, preferably between 10 .mu.m and 100 .mu.m, and / or that the aspect ratio A = h / l of the above depth extent h and the protruding lateral extent l lies between 0.05 and 10, preferably between 0.3 and 3. Method according to the preceding claim, characterized in that as a periodic depth structure ( 2 ) one of a plurality of individual, linear, parallel to each other and each with a constant trench spacing (d, d1) extending trenches extending trench structure (G1) or a two such at an angle (α) of not equal to 0 °, preferably from 60 °, crossing Trench structures (G1, G2) with the same or different trench spacing (d1, d2) having structure is formed, and / or that as a periodic depth structure ( 2 ) one a variety of holes ( 2a . 2 B , ...) is formed, wherein preferably the holes of this hole structure in two at an angle (α) of not equal to 0 °, preferably between 45 ° and 90 ° including the boundaries of 45 ° and 90 °, standing directions (R1, R2) are each formed at periodic intervals (d1, d2). Manufacturing method according to one of the preceding claims, characterized in that the laser irradiation is pulsed or continuous and / or with at least one laser wavelength in the visible, in the infrared and / or ultraviolet range, preferably with laser light of a Nd: YAG pulsed laser of wavelength 266 nm or 355 nm, and / or that the substrate ( 1 ) made of plastic, in particular of fiber-reinforced plastic, of ceramic and / or of metal or comprises at least one of the aforementioned materials and / or that the mediator material ( 3 ) comprises a suitable for adhesion promotion by means of polyaddition, by means of polycondensation and / or by polymerization material and / or comprises an epoxide, a polyurethane, a silicone, a formaldehyde, a polyamide, an acrylate, a rubber polymer and / or a thermoplastic elastomer and / or that the mediator material ( 3 ) by free-falling droplet application, screen printing, stamping, needle application, brush application, spatula application, doctor blade application, spraying, spraying, casting and / or rolling into the depth structure ( 2 ) is introduced. Manufacturing method according to one of the preceding claims, characterized in that a joint or a joining region is produced as a connection point or region, in that the depth structure ( 2 ) at least partially with a bonding agent suitable for cohesive joining as a mediator material ( 3 ) or that a lamination site or area is produced as a joint or area by 2 ) at least partially with a laminating material as mediator material ( 3 ) is refilled. Manufacturing method according to the preceding claim, characterized in that the surface ( 1a ) of the substrate ( 1 ) and / or the adhesion promoter material ( 3 ) at the joint and / or the joint area after filling the depth structure with the adhesion promoter material ( 3 ) having a surface portion of one with the substrate ( 1 ) to be provided element (E) is brought into contact with the substrate with this element (E). Substrate ( 1 ) with a connection point and / or a connection region in at least one ( 1a ) of its surfaces, produced by a manufacturing method according to one of the preceding claims. Component with a substrate ( 1 ) and with one with this substrate ( 1 ) element or one with this substrate ( 1 ), in particular a laminating layer, produced by a production method according to one of the preceding claims.

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