DE102009049639A1 - Circuit arrangement i.e. surface mounted component, for use in magnetic camera for determining direction and magnitude of magnetic field vector, has carrier including connecting contacts on which arrangement is connected to external device - Google Patents

Abstract

The arrangement (5) has a three-dimensional carrier (10) i.e. metallic lead frame, including conducting paths (40), where the carrier is made from a single flexible circuit board material. An evaluation system (60) is arranged on the carrier, and two sensors (30, 70) i.e. hall sensor, are orthogonally arranged to each other at the carrier and electrically connected with the evaluation system. The carrier includes connecting contacts (100, 110, 120) on which the arrangement is connected to an external device. The carrier is formed as an angle element with two base surfaces (12, 14). An independent claim is also included for a method for manufacturing a circuit arrangement for determining direction and magnitude of a vector field.

Description

The invention relates to a circuit arrangement for determining the direction and magnitude of a field vector, in particular a magnetic field vector, and a method for producing such a circuit arrangement.

In order to detect the direction of a magnetic field in all three spatial coordinates, magnetic 3D sensors are used, for example in the form of Hall sensors. A field of application for such Hall sensors, for example, the position and orientation of objects. An existing from several sensor elements Hall sensor is for example from DE 10 2006 037 226 B4 known. A magnetic field sensor with a Hall element for determining the direction of a magnetic field is further from the US 6,278,271B1 known.

The invention is based on the object, known 3D sensors add a further, novel solution in the form of a circuit arrangement for detecting directed fields, which is characterized among other things by a high resolution, flexible structure and by a good adaptation to different applications.

A core idea of the invention can be seen in constructing a 3D circuit arrangement, preferably of discrete, parametrically similar sensors, which determine the field components for at least two spatial axes and their magnitude. The sensors are arranged orthogonally on a flexible, carrier-carrying carrier and can be mounted at a very small distance, preferably less than 5 mm, to each other. A further advantageous aspect of the invention is to be seen in that, in addition to the sensors, evaluation electronics are arranged on the carrier, which carries out preprocessing of the sensor signals. Thereby, the wiring of the circuit arrangement can be simplified to the outside. A further advantage of the invention is that optimized technologies and manufacturing processes can be selected for the evaluation electronics and the sensors, with which a low-noise, high-resolution, field-sensitive and / or robust circuit arrangement can be created for a wide variety of applications.

The above technical problem is solved by the features of claim 1.

Accordingly, a circuit arrangement for determining the direction and the amount of a field vector, in particular a magnetic field vector is provided. The circuit arrangement comprises a three-dimensional, conductor tracks having carrier, on which an evaluation device and at least two sensors are arranged. The carrier is made of a single flexible material, i. H. out of one piece. The sensors are mounted orthogonal to each other on the three-dimensional support. The evaluation device and the sensors are electrically connected both to one another and to the carrier. Furthermore, the three-dimensional support has connection contacts, via which the circuit arrangement can be connected to an external device.

Preferably, the circuit arrangement may be formed as an SMD component, which via contact balls z. B. may be connected to a separate circuit board.

In order to achieve a compact circuit arrangement, at least one sensor can be arranged on the evaluation device.

In the production of the circuit arrangement, the assembly and wiring effort can be reduced if the evaluation device are formed together with at least one arranged on the evaluation sensor as an integrated circuit.

With further sensors arranged orthogonally in the circuit arrangement and / or on the evaluation device, field vectors can also be applied in several spatial points z. B. be determined to increase the spatial resolution. Depending on the design of the evaluation device, such a multiple detection can also be used to perform an adjustment, a check or a correction.

A cost-effective and compact design results when the three-dimensional support is an angular element with two mutually perpendicular base surfaces.

Alternatively, the three-dimensional support may also have a plurality of base surfaces which form a closed or at least one sided open cuboid, preferably cubes.

Depending on requirements and application, the evaluation device and the sensors can be arranged on the inside and / or outside of the respective base.

The circuit arrangement makes it possible for the sensors, when mounted on the inside of the base surfaces, to be arranged orthogonally relative to one another in such a way that their vertical center axes can be reproduced reproducibly in a zone preferably on the surface of the sensor on the evaluation unit is arranged, in such a way that the dimension of the zone is smaller than the dimension of the sensors. In this way, a circuit arrangement can be constructed with which three-dimensional inhomogeneous magnetic fields can be determined in a defined spatial point within the circuit arrangement. If a plurality of circuit arrangements arranged in a planar or line-shaped manner, a magnetic camera with a homogeneous resolution can be constructed in accordance with the spatial dimension of the circuit arrangements or the measuring points realized therein.

It should be noted at this point that the side lengths of the bases of the three-dimensional support can be less than 5 mm. Preferably, the side length is in the range of 1 to 2 mm, so that the base is only a few square millimeters in size.

The sensors and the evaluation device are expediently designed as chips.

In order to produce the circuit arrangement in a simple and cost-effective manner, the three-dimensional support can be made of a flexible printed circuit board material. As a flexible printed circuit board material provided with conductor tracks films are used, the excellent, z. B. perforated lines according to the desired shape of the three-dimensional support can be bent. It is also conceivable that the flexible support is at least partially reinforced.

Alternatively, the three-dimensional support can also be formed from a metallic leadframe, that is to say a leadframe or chip carrier.

As sensors Hall sensors can be used, which serve to determine the direction and the amount of a magnetic field vector.

Such a three-dimensional circuit arrangement can be used, for example, in a magnetic line scan camera or in material science for the detection of defects.

The above technical problem is also solved by the method steps of claim 9.

• – Bereitstellen eines planaren, flexiblen und Leiterbahnen aufweisenden Trägers;
• – Anordnen mehrerer Sensoren und einer Auswerteeinrichtung an vorbestimmten Stellen des planaren, flexiblen Trägers;
• – Kontaktieren der Sensoren und der Auswerteeinrichtung miteinander sowie mit dem planaren, flexiblen Träger und
• – Biegen des flexiblen Trägers derart, dass die Sensoren orthogonal zueinander angeordnet sind.

Accordingly, a method of manufacturing a circuit arrangement for determining the direction and magnitude of a field vector is provided. The method comprises the following steps:

• - Providing a planar, flexible and conductor tracks having carrier;
• Arranging a plurality of sensors and an evaluation device at predetermined locations of the planar, flexible carrier;
• - Contacting the sensors and the evaluation device with each other and with the planar, flexible support and
• - Bending the flexible support such that the sensors are arranged orthogonal to each other.

In an expedient manner, the sensors and the evaluation device are electrically connected to one another and to the flexible carrier by means of wires and / or using the flip technology.

If a printed circuit board foil is used as the flexible carrier, it is advantageous for the flexible carrier to be fixed accordingly after bending. This ensures that the sensors remain aligned with each other in the specified position. Also, in the event that a leadframe is used as a flexible carrier, it is expedient to fix the flexible carrier after bending.

For fixing can serve a fixing element, which is positioned at a predetermined position of the flexible support. Conveniently, the fixing element can already be positioned at the corresponding location before the flexible support is bent. It is also conceivable, however, that the fixing element is inserted into the flexible support only after the completed bending process. The flexible support is bent around the fixing element and then fixed thereto. For this purpose, the flexible support can be glued, for example, at predetermined locations of the fixing. As a fixing element can serve a bias element, which can generate a reference magnetic field.

To facilitate bending of the flexible support, the bending edges may be embossed or perforated.

The circuit arrangement according to the invention is suitable for being manufactured in an automated process on the initially planar support. For this purpose, only the sensors and the evaluation must be mounted at the predetermined locations on the first planar support and electrically connected to each other. Subsequently, the flexible support is bent according to the predetermined shape and optionally fixed.

The invention will be described below with reference to two embodiments in conjunction with the attached drawings explained in more detail. Show it:

1 a circuit arrangement comprising evaluation electronics and two Hall sensors which are arranged on a flexible carrier having tracks,

2 in the 1 shown circuitry, wherein the flexible support is formed into an angular element,

3 an alternative circuit arrangement comprising an evaluation and three Hall sensors, which are arranged on a flexible, conductor tracks carrier, and

4 in the 3 shown circuitry, wherein the flexible support is formed into a box open on one side.

In 1 is an exemplary circuit arrangement 5 represented, which is also referred to below as 3D sensor component. With the 3D sensor component 5 For example, directional fields, for example two of the three spatial coordinates, and their magnitude of a magnetic field vector can be determined. This includes the 3D sensor component 5 a conductor tracks having carrier 10 which is made of a single flexible material. The flexible material may be, for example, a foil, a leadframe, a plastic plate or a metal plate which is coated with a dielectric material. In this example, there are four traces 40 on the flexible carrier 10 applied. The flexible carrier 10 preferably has a perforated bending edge 20 on to the wearer 5 in an angle element, like it 2 shows, to be able to bend. The bending edge 20 divides the flexible carrier 10 in a base area 12 and in a base area 14 , On the ground 12 is a sensor 30 assembled. The sensor 30 has for example four contact surfaces 35 on. Every contact surface 35 is over a bonding wire 50 with a corresponding trace 40 connected. On the ground 14 is an evaluation electronics 60 assembled. The evaluation electronics 60 has four contact surfaces 90 on, over the bonding wires 80 with the respective tracks 40 are electrically connected. The 3D sensor component 5 has a second sensor 70 on, in the present example preferably on the transmitter 60 is mounted. The sensor 70 has four contact surfaces 75 on, each via a bonding wire 170 (please refer 2 ) with a separate contact surface 98 the transmitter 60 are connected. It should be noted at this point that it is the sensors 30 and 70 can act as Hall sensors. Both the sensors 30 and 70 as well as the evaluation electronics 60 are realized in chip form.

On the flexible carrier 10 are contact surfaces 100 . 110 and 120 provided, each via a separate bonding wire 160 . 150 respectively. 140 (please refer 2 ) with a separate contact surface 96 . 94 respectively. 92 the transmitter 60 are connected. About the contact surfaces 100 . 110 and 120 can the 3D sensor component 5 with further components and / or conductor tracks on the carrier 10 (not shown) and / or electrically connected to an external device (not shown). The external device may be a further 3D sensor component or also a printed circuit board.

2 shows that in 1 illustrated 3D sensor component 5 , where now the flexible carrier 10 is formed into an angle element. In this way it is achieved that the two sensors 30 and 70 orthogonal to each other on the flexible support 10 are arranged.

It should be noted at this point that the sensor 30 on the inside of the base 12 and the transmitter 60 and thus the sensor 70 on the inside of the base 14 of the carrier 10 are arranged. This is merely an exemplary arrangement. It is also conceivable, the sensor 30 and the transmitter 60 and thus the sensor 70 on the outsides of the two bases 12 and 14 to arrange. Any arrangement of the transmitter and the sensors is conceivable as long as the two sensors 30 and 70 are arranged orthogonal to each other.

At the in 2 shown representation capture the two sensors 30 and 70 a zone within that of the angled support 10 defined space, which is smaller than the dimension of the respective sensors. In this way, the 3D sensor device 5 determine two orthogonal components of a three-dimensional inhomogeneous magnetic field and their amounts in a defined spatial point within the 3D sensor component.

As in 2 are shown on the outside of the base 14 of the carrier 10 several contact balls arranged over which the 3D sensor component 5 can be electrically connected to an external device. The contact balls form so-called solder deposits In 3 is an alternative 3D sensor device 205 represented, with which all three coordinates of a field vector and its amount can be determined. The 3D sensor element 205 is different from the one in 1 illustrated 3D sensor component 5 in that instead of two sensors now three sensors are used and that is chosen as a flexible support an output shape that is shapeable to a one-sided open cuboid. As a flexible, Track having carrier is a one-piece, cross-shaped carrier 210 used. The carrier 210 has five bases 211 to 215 and four bending edges on which the base area 215 limit. The outer surfaces 211 . 212 . 213 us 214 can be bent around these bending edges at right angles to a box open on one side, as in 4 is shown.

At a predetermined location on the inside of the base 211 is a sensor 230 arranged. At a predetermined location on the inside of the base 212 is another sensor 280 arranged. On the ground 215 is an evaluation electronics 260 arranged on which a sensor 270 is mounted. In the present example, the sensors 230 and 280 as well as the evaluation electronics 260 each in the middle of the respective base areas 211 . 212 respectively 215 arranged. Also the sensor 270 can be centered on the transmitter 260 be arranged.

The flexible carrier 210 has four tracks 240 on, over which the sensor 230 with the transmitter 260 connected is. For this purpose, the sensor points 230 four contact surfaces 235 on, each using a separate bonding wire 250 with one of the ladder 240 are connected. Similarly, the transmitter has 260 four contact surfaces 334 on, each using a separate bonding wire 290 with the respective leader 240 are connected. The flexible carrier 210 has another four tracks 300 on, over which the sensor 280 with the transmitter 260 connected is. For this purpose, the sensor points 280 four contact surfaces 285 on, each using a separate bonding wire 310 with a separate track 300 are connected. Similarly, the transmitter has 260 four contact surfaces 336 on, each using a separate bonding wire 292 with a separate track 300 are connected.

The sensor 270 has four contact surfaces 275 (please refer 4 ), each using a separate bonding wire 350 with a separate contact area 360 (please refer 4 ) of the transmitter 260 are connected. To the 3D sensor component 205 to an external device, such as a circuit board (not shown) to connect, are at the base 215 of the carrier 210 contact surfaces 320 and 322 arranged. The evaluation electronics 260 has contact surfaces 330 and 332 on, each using a separate bonding wire 294 respectively. 296 with a corresponding contact surface 320 respectively. 322 are connected.

In 4 is that in 3 illustrated 3D sensor component 205 shown in perspective, wherein the carrier 210 is shaped to a unilaterally open cuboid. In the 3 schematically illustrated wiring is in 4 also to see. For the sake of better illustration, not all reference numbers are made 3 in 4 been inserted.

As in 4 shown, are the sensors 230 . 270 and 280 as well as the evaluation within the unidirectional open cuboid, wherein the three sensors are all arranged orthogonal to each other. The sensors 230 . 270 and 280 "Emit" a volume element within the space, which by the cuboidal carrier 210 is defined, wherein the dimension of the illuminated volume element may be smaller than the dimension of the respective sensors.

Similar to the one in 2 shown 3D sensor component 5 are at the bottom of the base 215 of the carrier 210 Contact balls 340 provided via which the 3D sensor component 205 can be electrically connected to an external device.

It should be noted at this point that the in 2 and 4 shown 3D sensor component 5 respectively. 205 Part of a magnetic camera can be. For this purpose, a plurality of 3D sensor components can be arranged on a predetermined surface or row.

Hereinafter, the method for manufacturing a 3D sensor device with respect to the in 2 shown 3D sensor component 5 explained in more detail.

First, the in 1 shown planar, flexible carrier 10 including tracks 40 and contact surfaces 120 . 110 and 100 for example, be positioned on a table. Then the sensor becomes 30 at the predetermined location on the surface 12 of the carrier 10 , the transmitter 60 between the contact surfaces 100 . 110 and 120 on the ground 14 and the sensor 70 on the transmitter 60 arranged.

After that, the contact surfaces 35 of the sensor 30 by means of the bonding wires 50 with the respective tracks 40 electrically connected. The tracks 40 Be over the bonding wires 80 with the corresponding contact surfaces 90 the transmitter 60 connected. The contact surfaces 120 Be over the bonding wires 140 with the contact surfaces 92 the transmitter 60 connected while the contact surfaces 110 over the bonding wires 51 with the contact surfaces 94 the transmitter 60 get connected. In addition, the contact surfaces 100 over the bonding wires 160 with the contact surfaces 96 the transmitter 60 connected. The sensor 70 is by means of bonding wires 170 with the transmitter 60 electrically connected. Further components can now, for example, be called SMD Components are mounted on the planar support and electrically connected. After mounting the sensors 30 and 70 as well as the evaluation electronics 60 and the electrical wiring of the sensors 30 and 70 with the transmitter 60 and the wiring of the transmitter 70 with the contact surfaces of the carrier 10 becomes the carrier element 10 to the in 2 bent angle element shown, so that the two sensors 30 and 70 are arranged orthogonal to each other. After the bending process, the angle-shaped support 10 be fixed by appropriate measures, so that the relative arrangement of the sensors 30 and 70 persists.

Will as a carrier 10 A foil can use the footprints 12 and 14 be reinforced by appropriate stiffeners such that the angle shape can be stably maintained.

Used as a flexible carrier 10 a plastic plate is used, so the carrier 10 first at the bending edge 20 heated and then bent to the angle element. Angled fixation elements can be used to precisely bend the carrier 90 °.

QUOTES INCLUDE IN THE DESCRIPTION

This list of the documents listed by the applicant has been generated automatically and is included solely for the better information of the reader. The list is not part of the German patent or utility model application. The DPMA assumes no liability for any errors or omissions.

Cited patent literature

• DE 102006037226 B4 [0002]
• US 6278271 B1 [0002]

Claims (15)

Circuit arrangement ( 5 ; 205 ) for determining the direction and magnitude of a field vector comprising: a three-dimensional, printed circuit traces ( 40 ; 240 . 300 ) ( 10 ; 210 ), which is made of a single flexible material, one on the support ( 10 ; 210 ) arranged evaluation device ( 60 ; 260 ), at least two sensors ( 30 . 70 ; 230 . 270 . 280 ) orthogonal to each other on the three-dimensional support ( 10 ; 210 ) and with the evaluation device ( 60 ; 260 ) are electrically connected, wherein the three-dimensional support ( 10 ; 210 ) Connection contacts 100 . 110 . 120 ; 320 . 322 ), via which the circuit arrangement ( 5 ; 205 ) can be connected to an external device. Circuit arrangement according to Claim 1, characterized in that the three-dimensional support ( 10 ) an angle element with two mutually perpendicular bases ( 12 . 14 ). Circuit arrangement according to Claim 1, characterized in that the three-dimensional support ( 210 ) several bases ( 211 . 212 . 213 . 214 . 215 ), which form a closed or at least one side open cuboid. Circuit arrangement according to one of the preceding claims, characterized in that at least one of the sensors ( 70 ; 270 ) are arranged on the evaluation device ( 60 ; 260 ) are. Circuit arrangement according to Claim 4, characterized in that the evaluation device ( 60 ; 260 ) and the at least one arranged on the evaluation sensor ( 70 ; 270 ) form an integrated circuit. Circuit arrangement according to one of the preceding claims, characterized in that the three-dimensional support ( 10 ; 210 ) is made of a flexible printed circuit board material. Circuit arrangement according to one of Claims 1 to 6, characterized in that the three-dimensional support ( 10 ; 210 ) is a metallic leadframe. Circuit arrangement according to one of the preceding claims, characterized in that the sensors ( 30 . 70 ; 230 . 270 . 280 ) Hall sensors for determining the direction and the amount of a magnetic field vector are. Circuit arrangement according to one of the preceding claims, characterized by a flexible carrier ( 10 ; 210 ) arranged bias element. Circuit arrangement according to claim 9, characterized in that the biasing element as fixing element for the flexible support ( 10 ; 210 ) serves. Method for producing a circuit arrangement ( 5 ; 205 ) for determining the direction and magnitude of a field vector, comprising the steps of: providing a planar, flexible, tracked carrier ( 10 ; 210 ); Arranging multiple sensors ( 30 . 70 ; 230 . 270 . 280 ) and an evaluation device ( 60 ; 260 ) at predetermined locations of the planar flexible support ( 10 ; 210 ) Contacting the sensors ( 30 . 70 ; 230 . 270 . 280 ) and the evaluation device ( 60 ; 260 ) with each other and with the planar, flexible support ( 10 ; 210 ); and bending the flexible support) 10 ; 210 ) such that the sensors are arranged orthogonal to each other. A method according to claim 11, characterized in that the step of contacting comprises the steps of: electrically connecting the sensors ( 30 . 70 ; 230 . 270 . 280 ) and the evaluation device ( 60 ; 260 ) with each other and with the flexible support ( 10 ; 210 ) using wires and / or using flip-chip technology. Method according to claim 11 or 12, characterized in that the flexible support ( 10 ; 210 ) is fixed after bending. A method according to claim 13, characterized in that a fixing element, in particular a biasing element, at a predetermined position of the flexible support ( 10 ; 210 ), and that the flexible support is bent around and fixed to the fixing member. Magnetic camera comprising a plurality of circuit arrangements (areally and / or arranged in a row) ( 5 ; 205 ) according to one of claims 1 to 10.

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