DE102008036020A1 - Opto-electronic module and lighting device - Google Patents

Abstract

An optoelectronic module comprises in particular a connection carrier (2), an optoelectronic component (3) arranged on the connection carrier (2), a cooling element (9) on which the connection carrier (2) is arranged, a cover (6) which extends over the connection carrier (2) and an electrical, in particular electronic, control element (8) for controlling the optoelectronic component (3). A lighting device comprises in particular a module (1) and a base body (13) to which the module (1) is attached.

Description

The The invention relates to an optoelectronic module and a lighting device.

It An object of the invention is to specify an optoelectronic module, which can be used variably. In particular, an optoelectronic module in existing lighting devices, which do not need to be tuned to the optoelectronic module used can be. Furthermore, an object of the invention is a lighting device specify with an opto-electronic module.

These Tasks are solved by the subject matters of the independent claims. advantageous Embodiments and developments are the subject of the dependent claims.

With particular advantage can be created a module in which a or a plurality of functional units already integrated in the module is. Thus, a lighting device no longer has a significant Dimensions on the module will be tuned. Rather, an optoelectronic Module easily into an existing lighting device be installed without any conversion measures to the lighting device required are. The module can be used for general lighting, in particular for indoor or outdoor lighting, be provided. For example, the module in a street lamp, a tunnel lighting, a bus stop lighting or in an architectural lighting device, e.g. B. one Decorative lighting, a building lighting or a building illumination, be used.

• – Eines oder eine Mehrzahl von optoelektronischen Bauelementen, bevorzugt Lumineszenzdioden, besonders bevorzugt LED-Bauelementen. Mit besonderem Vorteil ist das jeweilige Bauelement als oberflächenmontierbares Bauelement (SMD: Surface Mountable Device) ausgebildet. Das jeweilige Bauelement ist zweckmäßigerweise zur Strahlungserzeugung, bevorzugt zur Erzeugung sichtbaren Lichts, z. B. mischfarbigen Lichts, insbesondere weißen Lichts, ausgebildet. Bevorzugt ist das jeweilige Bauelement als Hochleistungsbauelement, z. B. mit einer elektrischen Leistungsaufnahme von 1 W oder mehr, insbesondere von 2 W oder mehr, ausgebildet.
• – Eines oder eine Mehrzahl von optischen Elementen, insbesondere eine oder mehrere Linsen und/oder einen oder mehrere Reflektoren, zur Strahlformung. Dabei kann das jeweilige Bauelement bereits ein optisches Element aufweisen oder mit einem solchen bestückt sein. Mit besonderem Vorteil kann auf eine zusätzliche Optik, die dem Modul nachgeordnet werden müsste, verzichtet werden. Eine gewünschte Abstrahlcharakteristik des Moduls kann damit alleine durch Strahlformung an dem jeweiligen optischen Element erzielt werden. Dabei können die Strahlungsaustrittsfläche der jeweiligen Linse und/oder die Strahlungsaustrittsöffnung des jeweiligen Reflektors länglich, insbesondere mit einer ausgezeichneten Längsrichtung, zum Beispiel oval oder rechteckig, ausgebildet sein. Beispielsweise kann einem oder einer Mehrzahl von optoelektronischen Bauelementen eine Linse im Strahlengang des oder der optoelektronischen Bauelemente nachgeordnet sein. Weiterhin können alternativ oder zusätzlich zu einer oder mehreren Linsen, die einem oder mehreren optoelektronischen Bauelementen nachgeordnet sind, ein oder mehrere optoelektronische Bauelemente in einem Reflektor angeordnet sein. Der Reflektor kann dabei insbesondere als Hohlspiegel ausgeformt sein, der zumindest in Teilbereichen elliptisch, parabolisch und/oder hyperbolisch geformte reflektierende Flächen aufweist.
• – Einen Anschlussträger, bevorzugt eine Leiterplatte, insbesondere eine Metallkernleiterplatte, wie z. B. eine gedruckte Metallkernleiterplatte (MCPCB: Metal Core Printed Circuit Board). Das jeweilige optoelektronische Bauelement ist zweckmäßigerweise auf dem Anschlussträger angeordnet und insbesondere befestigt. Zweckmäßigerweise ist das jeweilige Bauelement mit einem oder einer Mehrzahl von Anschlussleitern, z. B. Leiterbahnen, des Anschlussträgers elektrisch leitend verbunden. Eine Metallkernleiterplatte eignet sich besonders für ein Hochleistungsbauelement. Im jeweiligen Bauelement anfallende Verlustwärme kann durch den Anschlussträger von dem Bauelement abgeleitet werden.
• – Einen Modulträger. Auf dem Modulträger ist bevorzugt der Anschlussträger angeordnet und insbesondere an diesem befestigt. Besonders bevorzugt ist der Anschlussträger elektrisch leitend mit dem Modulträger verbunden. Das jeweilige Bauelement kann auf der vom Modulträger abgewandten Seite des Anschlussträgers angeordnet sein. Der Modulträger ist vorzugsweise zur Wärmeableitung vorgesehen. Durch den Anschlussträger zum Modulträger geleitete Abwärme des jeweiligen Bauelements kann durch den Modulträger weiter von dem Bauelement weg geleitet werden. Hierzu enthält der Modulträger bevorzugt ein Metall, wie Aluminium und/oder Kupfer, oder besteht hieraus. Weiterhin können der Modulträger und der Anschlussträger auch als ein und derselbe Träger ausgeführt sein. Das kann insbesondere bedeuten, dass der Anschlussträger auch als Modulträger ausgeführt ist beziehungsweise dass der Modulträger auch als Anschlussträger ausgeführt ist. Dadurch kann der Träger eine oder mehrere Funktionen des Anschlussträgers, beispielsweise die elektrische Kontaktierung des oder der optoelektronischen Bauelemente, und eine oder mehrere Funktionen des Modulträgers, beispielsweise die Wärmeableitung von dem oder den optoelektronischen Bauelementen weg, erfüllen. Der Träger kann dabei eines oder mehrere Merkmale der vorab oder im Folgenden im Zusammenhang mit dem Anschlussträger und/oder mit dem Modulträger beschriebenen Merkmalen aufweisen.
• – Eines oder eine Mehrzahl von Befestigungsmitteln. Das jeweilige Befestigungsmittel ist bevorzugt zur Befestigung, z. B. zur Verschraubung, des Moduls in der Beleuchtungsvorrichtung ausgebildet. Das jeweilige Befestigungsmittel kann mit dem Modulträger verbunden und insbesondere an diesem befestigt sein.
• – Ein Kühlelement. Das Kühlelement ist zweckmäßigerweise zur Wärmeabgabe an die Umgebung des Moduls ausgebildet. Das Kühlelement kann mit dem Modulträger verbunden und insbesondere an diesem befestigt sein. Zweckmäßigerweise ist das Kühlelement auf der von dem Anschlussträger abgewandten Seite des Modulträgers angeordnet. Bevorzugt weist das Kühlelement ein Wärmeableitelement, z. B. ein Wärmerohr (Heatpipe), auf. Ein Wärmerohr kann beispielsweise ein im teilweise festen und teilweise flüssigen, teilweise festen und teilweise gasförmigen, nur flüssigem, nur gasförmigen, teilweise flüssigen und teilweise gasförmigen oder teilweise festen und teilweise flüssigen und teilweise gasförmigen Zustand vorliegendes Arbeitsmedium in einem abgeschlossenen Volumen aufweisen. Das Wärmerohr kann dabei beispielsweise im Falle eines im flüssigen und gasförmigen Zustand vorliegenden Arbeitsmediums, wie etwa Wasser und/oder Alkohol, durch Verdampfen des Arbeitsmediums an einem ersten Ende des Wärmerohrs Wärme beziehungsweise thermische Energie aus der Umgebung, zum Beispiel vom optoelektronischen Bauelement herrührende Abwärme, aufnehmen. Dies kann zu einem Phasenübergang oder einer Phasenumwandlung eines Teils des Arbeitsmediums führen, zum Beispiel von flüssig zu gasförmig. Der umgewandelte, zum Beispiel verdampfte, Anteil des Arbeitsmediums kann sich innerhalb des Wärmerohrs in einem dafür vorgesehenen Volumen beziehungsweise Hohlraum, beispielsweise aufgrund von Konvektion, zu einem zweiten Ende des Wärmerohrs bewegen (migrieren), wenn das zweite Ende eine niedrigere Temperatur als das erste Ende aufweist. Am zweiten Ende kann das Arbeitsmedium unter Abgabe von Wärme an die Umgebung des Wärmerohrs wieder in die ursprüngliche Phase überführt werden, also zum Beispiel kondensieren und in den flüssigen Zustand zurückkehren. Aufgrund einer rücktreibenden Kraft, wie etwa der Gravitationskraft und/oder einer Kapillarkraft oder -kräften, beispielsweise hervorgerufen durch einen Docht oder ein Netz im Wärmerohr kann sich das flüssige Arbeitsmedium zum ersten Ende zurück bewegen. Das Wärmeableitelement kann zur Ableitung der Abwärme des jeweiligen Bauelements von dem Anschlussträger bzw. dem Modulträger ausgebildet sein. Das Kühlelement kann, insbesondere zusätzlich zum Wärmeableitelement, eines oder eine Mehrzahl von Kühlteilen, z. B. Kühlrippen, Kühlfinnen und/oder Lamellen, aufweisen. Das Kühlteil ist bevorzugt zur Wärmeabgabe an die Umgebung des Moduls ausgebildet. Dem Kühlteil kann über das Wärmeableitelement die Abwärme des oder der Bauelemente, insbesondere vom Modulträger ausgehend, zur Abgabe an die Umgebung zugeführt werden. Mit Vorteil ist es dann bei dem Modul nicht erforderlich für einen zuverlässigen Betrieb in der Beleuchtungsvorrichtung eine externe Kühlvorrichtung vorzusehen. Dies ist bei Hochleistungsbauelementen, welche eine erhebliche Abwärme aber eben auch einen für Beleuchtungsvorrichtungen vorteilhaft hohen Lichtstrom erzeugen können, von besonderem Vorteil.
• – Eine Abdeckung, z. B. eine Kappe. Die Abdeckung kann an dem Modulträger und/oder an dem Anschlussträger befestigt sein. Die Abdeckung schützt das optoelektronische Bauelement oder die optoelektronischen Bauelemente bevorzugt vor schädlichen äußeren Einflüssen wie etwa mechanischen oder chemischen schädigenden Einflüssen.
• – Ein Dichtungsmittel. Dieses Dichtungsmittel kann zwischen der Abdeckung und dem Modulträger angeordnet sein. Das Dichtungsmittel, z. B. ein Dichtungsgummi oder ein Dichtungsgummiring, kann einen mittels der Abdeckung gebildeten Innenraum weitergehend abdichten. Weiterhin kann das Dichtungsmittel auch einen Klebstoff und/oder ein Harz, beispielsweise mit Silikon und/oder Epoxid, aufweisen. Dabei kann das Dichtungsmittel den Anschlussträger lateral umlaufen. Insbesondere kann der Innenraum staub- und/oder spritzwasserdicht ausgebildet sein. und/oder
• – Ein elektronisches Steuerelement. Das Steuerelement, das z. B. eine Treiberschaltung aufweist, ist zweckmäßigerweise zur Steuerung des oder der optoelektronischen Bauelemente ausgebildet. Das Steuerelement kann als Steuerchip, z. B. als IC-Chip, ausgebildet sein. Das Steuerelement kann innerhalb oder außerhalb des Innenraums der Abdeckung angeordnet sein. Eine Anordnung innerhalb bietet einen vorteilhaft hohen Schutz für das Steuerelement vor schädigenden Einflüssen wie etwa Staub, Feuchtigkeit und/oder mechanischen Belastungen. Eine Anordnung außerhalb erleichtert die Zugänglichkeit zum Steuerelement. Dies kann insbesondere dann von Vorteil sein, wenn das oder die optoelektronischen Bauelemente, wie z. B. bei einer Kühlung der Bauelemente, eine höhere Lebensdauer als das Steuerelement aufweisen. Der Austausch des Steuerelements kann dann ohne Öffnen der Abdeckung erfolgen.

The functional units may comprise one or more of the following elements:

• - One or a plurality of optoelectronic components, preferably light-emitting diodes, particularly preferably LED components. With particular advantage, the respective component is designed as a surface-mountable component (SMD: Surface Mountable Device). The respective component is expediently for generating radiation, preferably for generating visible light, for. As mixed-colored light, in particular white light formed. Preferably, the respective component is a high-performance component, for. B. with an electrical power consumption of 1 W or more, in particular 2 W or more formed.
• - One or a plurality of optical elements, in particular one or more lenses and / or one or more reflectors, for beam shaping. In this case, the respective component may already have an optical element or be equipped with such. With particular advantage can be dispensed with an additional optics, which would have to be subordinated to the module. A desired radiation characteristic of the module can thus be achieved solely by beam shaping at the respective optical element. In this case, the radiation exit surface of the respective lens and / or the radiation exit opening of the respective reflector may be elongated, in particular with an excellent longitudinal direction, for example oval or rectangular. For example, one or a plurality of optoelectronic components may be followed by a lens in the beam path of the optoelectronic component (s). Furthermore, as an alternative or in addition to one or more lenses which are arranged downstream of one or more optoelectronic components, one or more optoelectronic components may be arranged in a reflector. The reflector can be formed in particular as a concave mirror, which has elliptical, parabolic and / or hyperbolic shaped reflecting surfaces at least in some areas.
• - A connection carrier, preferably a printed circuit board, in particular a metal core circuit board, such. B. a printed metal core circuit board (MCPCB: Metal Core Printed Circuit Board). The respective optoelectronic component is expediently arranged on the connection carrier and in particular fixed. Conveniently, the respective component with one or a plurality of connecting conductors, for. B. traces, the connection carrier electrically connected. A metal core board is particularly suitable for a high performance device. Loss of heat generated in the respective component can be derived from the component by the connection carrier.
• - One module carrier. On the module carrier of the connection carrier is preferably arranged and in particular attached to this. Particularly preferably, the connection carrier is electrically conductively connected to the module carrier. The respective component can be arranged on the side facing away from the module carrier side of the connection carrier. The module carrier is preferably provided for heat dissipation. Waste heat conducted by the connection carrier to the module carrier of the respective component can be conducted further away from the component by the module carrier. For this purpose, the module carrier preferably contains or consists of a metal, such as aluminum and / or copper. Furthermore, the module carrier and the connection carrier can also be designed as one and the same carrier. This can be especially important th, that the connection carrier is also designed as a module carrier or that the module carrier is also designed as a connection carrier. As a result, the carrier can fulfill one or more functions of the connection carrier, for example the electrical contacting of the optoelectronic component (s), and one or more functions of the module carrier, for example the heat dissipation away from the optoelectronic component (s). The carrier may have one or more features of the features described in advance or hereinafter in connection with the connection carrier and / or with the module carrier.
• - One or a plurality of fasteners. The respective fastening means is preferably for attachment, for. B. for screwing, the module is formed in the lighting device. The respective fastening means may be connected to the module carrier and in particular attached thereto.
• - A cooling element. The cooling element is expediently designed for dissipating heat to the surroundings of the module. The cooling element can be connected to the module carrier and in particular attached to this. Conveniently, the cooling element is arranged on the side facing away from the connection carrier side of the module carrier. Preferably, the cooling element has a heat dissipation element, for. B. a heat pipe (heat pipe), on. For example, a heat pipe may have a partially solid and partially liquid, partially solid and partially gaseous, liquid only, gaseous only, partially liquid and partially gaseous or partially solid and partially liquid and partially gaseous state working fluid in a sealed volume. The heat pipe may, for example, in the case of a present in the liquid and gaseous state working medium, such as water and / or alcohol, by evaporation of the working fluid at a first end of the heat pipe heat or thermal energy from the environment, for example, from the optoelectronic device derived waste heat, take up. This can lead to a phase transition or phase transformation of part of the working medium, for example from liquid to gaseous. The converted, for example vaporized, fraction of the working medium may move (migrate) within the heat pipe in a dedicated volume or cavity, for example due to convection, to a second end of the heat pipe when the second end is at a lower temperature than the first end having. At the second end, the working medium can be transferred to the environment of the heat pipe back to the original phase with the release of heat, that is, for example, condense and return to the liquid state. Due to a restoring force, such as gravitational force and / or capillary force or forces, for example, caused by a wick or web in the heat pipe, the liquid working fluid may move back to the first end. The heat dissipation element can be designed to dissipate the waste heat of the respective component from the connection carrier or the module carrier. The cooling element may, in particular in addition to the heat dissipation element, one or a plurality of cooling parts, for. As cooling fins, cooling fins and / or fins have. The cooling part is preferably designed for dissipating heat to the surroundings of the module. The cooling part can be supplied via the Wärmeableitelement the waste heat of the component or components, in particular from the module carrier, for delivery to the environment. Advantageously, it is then not necessary for the module to provide an external cooling device for reliable operation in the lighting device. This is particularly advantageous in the case of high-performance components which can generate a considerable waste heat but also a luminous flux which is advantageously high for lighting devices.
• - A cover, z. B. a cap. The cover may be attached to the module carrier and / or to the connection carrier. The cover protects the optoelectronic component or the optoelectronic components preferably from harmful external influences such as mechanical or chemical damaging influences.
• - A sealant. This sealing means can be arranged between the cover and the module carrier. The sealant, z. As a rubber seal or a rubber seal, can further seal a formed by the cover interior. Furthermore, the sealant may also comprise an adhesive and / or a resin, for example with silicone and / or epoxy. In this case, the sealing means can laterally rotate the connection carrier. In particular, the interior may be dustproof and / or splash-proof. and or
• - An electronic control. The control that z. B. has a driver circuit is suitably designed to control the optoelectronic components or. The control can be used as a control chip, z. B. as an IC chip may be formed. The control element can be arranged inside or outside the interior of the cover. An arrangement within offers advantageously high protection for the control from damaging influences such as dust, moisture and / or mechani loads. An arrangement outside facilitates accessibility to the control. This can be particularly advantageous if the or the optoelectronic components, such. B. at a cooling of the components, have a longer life than the control. The replacement of the control can then be done without opening the cover.

The The above-described functional elements may all be in a single Be integrated module.

It So a module can be created, the one or a plurality of components for that thermal management, an optics for beam forming and / or an electronic control for controlling or powering the respective components, in particular the high-performance components, having. In the lighting device must therefore only another electrical connection for the electrical supply of the Module or the plurality of modules that are installed in this to be provided. But an electrical power source is just routine ingredient a conventional one Lighting device.

Especially the module can be a connection carrier, at least one arranged on the connection carrier optoelectronic Component which is designed, for example, as a light-emitting diode a cooling element, arranged on the connection carrier is a cover that is over the connection carrier extends, and an electrical, in particular electronic, control for controlling the optoelectronic component. Thereby For example, a module can be provided that in its optical functionality, for example by a suitable choice of the radiation characteristic of the optoelectronic Component, in its electrical and / or electronic functionality Providing the control and in its thermal functionality through Provision of the cooling element already to the specifications and specifications of a lighting device can be adjusted. Through the cover can be a mechanical protection as well as a protection against degradation, for example by dust or Moisture, can be achieved, so in combination with the aforementioned functionalities a long life and reliability for the Module and also for a lighting device can be ensured with the module.

Especially an arrangement of the control outside the cover can as mentioned above be advantageous, especially if it is assumed can, that the at least one optoelectronic component a higher Life as the control has. Changing the Control can thus without opening the cover, so that the at least one optoelectronic Component also in this case uninterrupted by the cover from damaging influences protected can be.

In In this case, the cover can permanently on the module carrier and / or on the connection carrier be arranged. A permanent arrangement can in particular mean that the cover is not intended after the Completion and assembly of the optoelectronic module again open to become. In this case, the cover preferably insoluble, the does not mean solvable anymore without damage for example, the cover or optionally the sealant, on the module carrier and / or on the connection carrier be arranged and attached.

Farther may be a permanent arrangement of the cover by means of a sealant allows be with an adhesive and / or a resin, for example, with Silicone and / or epoxy.

The Control can be electrically conductive with the at least one Optoelectronic device be electrically connected. For this purpose, for example, the connection carrier may have conductor tracks, the electrical contacting of the control with the at least allow an optoelectronic device.

It in particular, an optoelectronic module in the form of a high-performance module with an electrical power consumption of 10 W or more, preferred of 15 W or more, more preferably 18 W or more be carried out, which is advantageous highly integrated.

Especially may be advantageous in terms of the above embodiments, when the cooling element a heat pipe having. Furthermore, it may be particularly advantageous if the cooling element a plurality of cooling parts, in particular cooling ribs and the heat pipe extends through the cooling parts. This can be the heat pipe with the cooling parts, in particular mechanically and / or thermally, be connected. Thereby can the heat pipe simplified arranged and designed so that it waste heat from the optoelectronic devices in an advantageous manner the cooling parts passes.

Furthermore, it can be advantageous if the connection carrier is arranged on a module carrier, wherein the side of the connection carrier facing away from the optoelectronic components preferably faces the module carrier. It can do that Cooling element may be arranged on the remote from the connection carrier side of the module carrier, wherein the cooling element is preferably thermally conductively connected to the module carrier.

Especially a fastener can continue from the connection carrier or the module carrier extend away as the cooling element, so that a fastening means facing away from the connection carrier Side of the module carrier the cooling element, in particular in a direction perpendicular to the module carrier, surmounted. This can be the Fastening means on its from the connection carrier or of the module carrier remote side parallel or substantially parallel to the connection carrier or the module carrier extend and in particular laterally beyond the connection carrier or protrude the module carrier.

One Lighting device may have a base body and preferably free from outside be the one or the module provided cooling devices. Especially a plurality of modules may be provided, wherein at least two the majority of modules similar modules and / or at least two the majority of the modules are rail-like modules. The main body can be a or more recess for have one or more modules, in each of which a module or a Plurality of modules is used.

Farther can the basic body extend between a first end side and a second end side, wherein one or a plurality of modules between the first end side and the second end side, wherein the base body is preferably open at the end is, so that cooling gas, z. As air, within the body from the first end side to the second end side can flow. Especially advantageous can the basic body in the region of one of the first and second end sides away from the module Kinked or bent away be, reducing the flow of cooling gas can be relieved. In particular, a module can be held in the base body in this way and be arranged that the cooling gas along the cooling parts of the module can. Furthermore, the main body be open in the area between two modules, allowing cooling gas between two modules in the main body can occur.

Further Features, benefits and benefits result from the following description of the embodiments in conjunction with the figures.

1A . 1B and 1C show on the basis of various schematic views an embodiment of an optoelectronic module.

2 shows an embodiment of a lighting device based on a plan view of the modules of the lighting device.

3 shows by way of various schematic views in the 3A to 3D and in the 3E to 3I Further embodiments of lighting devices.

4A . 4B and 4C show a schematic exploded view and a front and rear view of a module according to another embodiment.

5A and 5B show exemplary embodiments of the electrical connection of a lighting device according to further embodiments.

6A and 6B show in each case a section of an optoelectronic module according to a further exemplary embodiment on the basis of various schematic views.

7A to 7E show further embodiments of the arrangement of modules in lighting devices.

8th shows in conjunction with the 8A to 8F Abstrahlcharakteristiken for embodiments with lighting devices.

9A to 9C show a radiation characteristic for a further embodiment with lighting devices.

Same, similar and equivalent elements are in the figures with provided the same reference numerals.

1A . 1B and 1C show on the basis of various schematic views an embodiment of an optoelectronic module 1 , 1A shows a schematic plan view of the module 1 . 1A a schematic sectional view through the module according to 1A and 1C a schematic plan view of the radiation exit surface of an optical element of the module 1 ,

The optoelectronic module 1 has a connection carrier 2 on. The connection carrier 2 is z. B. as a printed circuit board, preferably formed as a metal core circuit board. On the connection carrier is a plurality of optoelectronic components 3 , in particular light-emitting diodes, arranged. The components 3 are with connecting conductors, such as conductor tracks, the connection carrier 2 electrically connected, wherein the connection conductors and the electrical connection for reasons of clarity are not shown explicitly. The build ELEMENTS 3 are furthermore designed as surface-mountable components, in particular as LED components or light-emitting diodes. Conveniently, the components 3 designed as high-performance components with an electrical power consumption of 1 W or more, preferably 2 W or more. For this purpose, for example, a device of the Golden Dragon type (manufacturer: OSRAM Opto Semiconductors GmbH) is suitable. The components can be designed to produce mixed-color and in particular white light.

A metal core board is suitable as a connection carrier 2 especially for high performance components, as in the components 3 considerable heat loss due to the high thermal conductivity of the metal core board particularly efficient of the components 3 away through the connection carrier 2 on the components 3 opposite side of the connection carrier 2 can be directed.

Furthermore, the module has 1 a module carrier 4 on. The connection carrier 2 is on the module carrier 4 arranged. Here are the components 3 on the of the module carrier 4 opposite side of the connection carrier 2 arranged. The module carrier 4 is preferably formed with high thermal conductivity. The module carrier 4 can herzu a metal, z. As Cu and / or Al, or consist of.

The connection carrier 2 is with the module carrier 4 preferably connected thermally conductive. The connection carrier 2 is expediently on the module carrier 4 attached. With particular advantage for this purpose is a connection layer 5 between the connection carrier 2 and the module carrier 4 intended. By means of the bonding layer 5 can the connection carrier 2 on the module carrier 4 attached and / or thermally conductively connected thereto. For the mechanical and thermal connection to the connection carrier 2 For example, a thermally conductive adhesive or a solder for the bonding layer is suitable 5 , Through the module carrier 4 and optionally the thermally conductive bonding layer 4 The waste heat can continue from the building elements 3 be routed away. As an alternative to the embodiment shown, the module carrier 4 and the connection carrier 2 Also be provided as a combined support, the characteristics and characteristics of the connection carrier 2 and the module carrier 4 united in itself. In other words, the connection carrier 2 at the same time as a module carrier 4 be educated. This allows the structure of the module 1 be further simplified and a higher degree of integration of the components of the module 1 be achieved.

Furthermore, the module has 1 a cover 6 on. The cover 6 is expediently radiation-permeable to one of the components 3 formed to be generated radiation. With preference is the cover 6 made of radiation-permeable material. The cover 6 For example, a glass and / or a plastic, such as polymethyl methacrylate (PMMA), or a composite material, for example, a composite material with glass and plastic films, may be included. The components 3 opposite side of the cover 6 can be the radiation exit side of the module 1 form. The cover 6 can with the module carrier 4 connected and in particular mechanically fixed to this. For example, the cover 6 with the module carrier 4 bolted (not explicitly shown). The cover 6 encloses the connection carrier 2 preferably with a cap.

By means of the cover 6 is preferably a cavity - the interior of the cover 6 - above the connection carrier 2 and in particular the components 3 educated. Through the cover 6 can elements, such as. B. the components 3 are arranged in the cavity, to be protected from harmful external influences, such as mechanical stress, dust and / or moisture.

For further sealing of the interior of the cover 6 can be a sealant 7 be provided. The sealant 7 is conveniently between the cover 6 and the module carrier 4 arranged. The sealant 7 runs around the connection carrier 2 preferably laterally circumferentially and more preferably, the sealant rotates 7 the connection carrier 2 Completely. The sealant 7 is z. B. executed as a sealing rubber ring. About the sealant 7 can the cavity between the cover 2 and the module carrier 4 be formed at least splash and / or dustproof. The cavity can meet about the tightness requirements of the IP65 known to those skilled in the art.

For electrical contact formation to the components 3 and in particular to the connection carrier 2 can the module carrier 4 be omitted. A corresponding recess 40 is, preferably next to the connection carrier 2 , in the module carrier 4 educated. An electrical contact of the connection carrier 2 and in particular the optoelectronic components 3 is so relieved. Through the recess 40 For example, an electrical supply cable can be passed (not shown).

The optoelectronic module 1 further comprises an electrical, in particular an electronic, control 8th on. The control 8th is suitably for electrical control the optoelectronic components 3 educated. Conveniently, the control 8th electrically conductive with the components 3 and in particular the connection carrier 2 connected (not explicitly shown).

The control 8th can be used to power the components 3 be educated. For example, the control can 8th be designed as a current transformer, the externally to the module 1 applied AC voltage, z. B. 24 V, in DC, preferably constant -. B. at 350 mA - is held, converted. By means of the control 8th can the module 1 So be adapted to the given by an external power supply boundary conditions. The electronic control 8th For example, it can be designed as a control chip, in particular as an IC chip.

The control 8th can inside the cover 6 be arranged. Alternatively, the control 8th outside the cover 6 be arranged. The arrangement outside the cover 6 is in 1A and 1B indicated by dashed lines. As already mentioned, has an arrangement within the cover 6 a beneficial high protection for the control 8th on. An arrangement outside the cover 6 simplifies access to the control 8th from the outside, so that it can be easily replaced, in particular without the cover 6 should be removed.

Furthermore, the module has 1 a cooling element 9 on. The cooling element 9 is suitably on the of the components 3 opposite side of the connection carrier 2 arranged. The cooling element 9 can on the of the connection carrier 2 opposite side of the module carrier 4 be arranged. Furthermore, the cooling element 9 expediently with the module carrier 4 thermally conductive and / or mechanically stable connected. The cooling element 9 For example, with the module carrier 4 be soldered or glued.

About the module carrier 4 can the cooling element 9 the heat loss from the components 3 for dissipation to the environment of the module 1 be forwarded. The cooling element 9 preferably has a heat dissipation element 90 on. The heat dissipation element 90 can be designed for example as a heat pipe (heat pipe). A heat pipe is particularly suitable for efficient heat transfer as described above. The heat dissipation element 90 is preferably for dissipating the waste heat from the components 3 opposite side of the module carrier 4 educated. The heat dissipation element 90 can be on the module carrier 4 initially facing along the module carrier, then in an area of the module carrier 4 away and then back along the module carrier 4 , in particular parallel or substantially parallel to this extend. The heat dissipation element 90 can with its the module carrier 4 facing side on the module carrier 4 attached, in particular glued or welded, be.

In particular, the heat dissipation element 90 be performed at least partially or completely U-shaped. In this case, the heat dissipation element 90 expediently arranged such that it is perpendicular or substantially perpendicular to the module carrier 4 extends. A leg of the U-like shape can with the module carrier 4 be connected while the other leg of the module carrier 4 can be spaced.

The cooling element 9 also has a plurality of cooling parts 91 , in particular cooling fins or cooling fins, on. The refrigerated parts 91 preferably extend oblong, in particular perpendicular or substantially perpendicular, from the connection carrier 2 and in particular from the module carrier 4 path.

The refrigerated parts 91 are with the heat sink 90 thermally conductive and preferably also mechanically stable connected. The refrigerated parts 91 are preferably for delivering the heat loss to the environment of the module 1 educated. A cooling rib-like design of the refrigerated parts 91 is particularly suitable due to the high surface area. For efficient heat transfer from the heat sink 90 to the cooling parts 91 can the heat dissipation element with the cooling parts 91 thermally conductive glued or soldered. The heat dissipation element 90 can get through the cooling parts 91 extend. The refrigerated parts 91 are expediently recessed accordingly in the passage area. Particularly preferably takes place in the passage region of the heat dissipation element 90 through the cooling parts 91 an efficient heat transfer to the cooling parts 91 , The passage through the cooling parts 91 especially on the module carrier 4 distant side of the heat dissipation element 90 be provided.

For example, for cooling two separate, in particular similar, cooling elements 9 intended.

By means of such cooling is a sufficient heat dissipation from the optoelectronic devices 3 also with an execution of the module 1 as a high-performance module with a power consumption of 10 W or more, preferably 15 W or more, for example 16 W or more or 18 W or more guaranteed.

Is a cooling element 9 provided, it may be particularly useful, the electronic control 8th outside the cover 6 to arrange, since in this case it is expected that the control 8th , due to the long life of the optoelectronic devices 3 , must be replaced earlier than the components 3 ,

Furthermore, the module has 1 a plurality of fasteners 10 on. The fasteners 10 are preferably as separate fastening means on the module carrier 4 attached. By suitable selection of fasteners 10 can the module 1 be optimized in such a way to a variety of lighting devices that it can be easily attached to these. The fastener 10 For example, it initially extends laterally beyond the module carrier 4 out, then diagonally or perpendicular to the module carrier 4 away from it and on the module carrier 4 distant side again parallel or substantially parallel to the module carrier 4 ,

The fasteners 10 extend, in particular along a direction perpendicular or substantially perpendicular to the module carrier 4 , preferably further from the module carrier 4 away as the cooling element 9 so that the cooling element 9 an assembly of the module 1 in a lighting device by means of the module carrier 4 removed end side of the fasteners 10 not disabled.

The from the module carrier 4 removed end side of the fasteners 10 So it can be used to mount the module 1 be provided in a lighting device.

For mounting on the lighting device, the fastening means 10 a mounting means 100 exhibit. The mounting means 100 For example, it may be formed as a recess through the attachment means 10 ranges and for example for a screw connection of the fastener 10 is provided on the lighting device. The respective fastener 10 preferably also protrudes laterally over the module carrier 4 out. The respective fastener 10 can on one end side of the module carrier 4 be attached to this. Preferably, the fastening means 10 on opposite end sides of the module carrier 4 attached. In particular, the respective fastening means 10 closer to the edge of the module carrier 4 be arranged as the (respective) cooling element 9 ,

Furthermore, the optoelectronic components 3 each an optical element 30 on. The respective optoelectronic component 3 can already work with the optical element 30 be manufactured or after manufacture, but before mounting on the connection carrier 2 , with the optical element 30 be equipped. Alternatively, the optoelectronic components 3 after mounting on the connection carrier 2 with optical elements 30 be fitted.

1C shows an example of a plan view of the radiation exit surface 31 one of these in 1B in a sectional view shown optical elements 30 , The optical elements 30 are preferably each carried out the same way. The radiation exit surface 31 of the respective optical element 30 has a concave curved portion 310 on. This is preferably centrally located in the radiation exit surface 31 educated. The concavely curved section 310 is of a convex curved portion 311 surround. The convex curved portion 311 surrounds the concavely curved portion 310 preferably completely. Particularly preferably, the optical axis runs 11 of the respective component 3 through the concavely curved portion 310 , In 1C stands the optical axis 11 perpendicular to the representation plane. Such a shape of the optical element designed as a lens 30 is, in particular in rotationally symmetrical form, also referred to as ARGUS.

The optical element 30 is preferably oblong in plan view, so with an excellent longitudinal direction, and in particular oval. For example, the optical element 30 in view of the radiation exit surface 31 elliptical shaped. Such a design of the optical element 30 is particularly suitable for the illumination of roads, such as for use in street lamps.

The module 1 , the connection carrier 2 and / or the module carrier 4 furthermore preferably has an excellent longitudinal direction. The module 1 In particular, it may be designed to be elongate overall. The excellent longitudinal direction of the optical element 30 So, for example, the longer major axis of the elliptical radiation exit surface 31 of the optical element 30 , can along this longitudinal direction of the module 1 , the connection carrier 2 and / or the module carrier 4 be aligned. Will the longitudinal direction of the optical elements 30 along a main direction of extension of the object to be illuminated, z. As a road, aligned, a particularly efficient illumination of the object, for example, a road can be achieved. At the same time, the burden of the environment, for. B. located on the street residential buildings, can be reduced with the generated radiation, since the optical element 30 the radiation is concentrated on the object to be illuminated. The shape of the radiation exit surface 31 with the concavely curved portion 311 and the surrounding convex curved portion 310 and the elongated shape of the lens is particularly suitable for this purpose.

2 shows a plan view of a lighting device 12 with attached modules 1 , which are preferably carried out according to the previous embodiment. The lighting device 12 , for example, a street lamp, has a main body 13 on. This can be made elongated.

The main body 13 furthermore preferably has recesses 19 on. In a recess 19 is in each case, in particular exactly, a module 1 used. The modules 1 are with their excellent longitudinal direction transverse to the excellent longitudinal direction of the body 13 running used. Conveniently, the modules 1 used in such a way that initially the side of the module 1 with the cooling element 9 and in particular the fastening means 10 into the recess 19 is introduced (not explicitly shown). About the fasteners 10 can the module 1 then at the base 13 attached, z. B. screwed, be. The illustrated plan view may represent the street-facing side of a street lamp.

For example, by the arrangement of one or more optoelectronic components 3 relative to one or more optical elements 30 the respective emission characteristics of the modules 1 adjustable and in particular simplified to specifications and specifications of a lighting device 12 such as being adaptable to street lighting or tunnel lighting. The modules can 1 be executed the same. Alternatively, at least two of the modules 1 also be designed differently, so that by combining several modules 1 the desired radiation characteristic of the lighting device 12 can be achieved. Exemplary radiation characteristics - also in connection with other optical elements as in connection with the 6A and 6B are shown in the 8A to 9C shown and described in more detail below.

3 shows by way of various schematic views in the 3A to 3D a further embodiment of a lighting device 12 , In essence, the embodiment corresponds to that in connection with 2 described.

In contrast to 2 indicates the basic body 13 at its end pages 14 . 15 Cooling gas passages 16 . 17 on. The end pages 14 . 15 are preferably the end sides, between which the main body 13 extends along its excellent longitudinal direction. The cooling gas passages 16 . 17 may each include a plurality of cooling slots. It is in a final arrangement of the lighting device 12 one of the cooling gas passages preferably arranged above the other cooling gas passage arranged. This can be achieved by the basic body 13 in the area of the first end side of the modules 1 is executed bent or bent, wherein the optoelectronic modules 1 particularly preferably outside of the bent or bent region of the basic body 13 are arranged. About the cooling gas passage 17 can be cooling gas, for example, ambient air, in the body 13 enter. Subsequently, the cooling gas at the cooling elements 9 , in particular the cooling parts 91 , flow along, waste heat from the modules 1 carry away and subsequently through the cooling gas passage 16 from the housing body of the body 13 escape. The cooling gas flow is in 3 indicated by the arrows.

Between each two modules 1 can continue a cooling gas passage 18 be arranged. The cooling gas passages 18 can each have a plurality of hole-like recesses in the body 13 exhibit. Preferably extend next to a module 1 two cooling gas passages each 18 between which the module 1 is particularly preferably arranged. The cooling gas passages 18 In particular, along an excellent longitudinal direction of the module 1 extend. Through the cooling gas passages 18 can also cooling gas, for example, ambient air, in the body 13 enter. A cooling of the modules 1 is thus improved and thus the risk of failure of a module 1 reduced due to overheating.

3 shows further in conjunction with the 3E to 3I a further embodiment of a lighting device 12 , which is a modification of the in the 3A to 3D illustrated embodiment represents.

In contrast to the previous embodiment, the lighting device 12 of the 3E to 3I a basic body 13 on, the first basic body part 131 and a second body part 132 includes. The first basic body part 131 is here as a holding device for the second basic body part 132 trained and preferably serves the attachment of the second body part 132 for example, above a street or an object to be illuminated. The second basic body part 132 serves the already described above recording the modules 1 analogous to the basic body 13 according to the previous embodiment.

In a like in the 3E to 3I shown lighting device 12 could, for example, with the eight modules shown 1 a luminous flux of about 8960 lumens with a power consumption of about 140 watts of designed as LEDs optoelectronic devices 3 the modules 1 reached become. These performance data are through adaptation of the modules 1 as well as the number of modules 1 in a basic body 13 scalable and to the requirements of a lighting device 12 customizable for a variety of purposes such as general lighting, street lighting, tunnel lighting or object lighting.

4A shows a schematic exploded view of an optoelectronic module 1 as related to 1A to 1C is described. In the 4B and 4C is the optoelectronic module 1 assembled in a front view on the cover 6 and in a rear view of the cooling element 9 shown. The following description refers equally to the 4A to 4C ,

The module 1 points to the connection carrier 2 on one side or on both sides next to the optoelectronic components 3 an electronic control 6 on, which is not shown for clarity. The optoelectronic components 3 are in the embodiment shown on the connection carrier 2 arranged hexagonally, so that a possible dense covering of the connection carrier 2 with the optoelectronic components 3 can be achieved.

The optoelectronic module 1 allows variable use in various types of lighting devices. In particular, high-power lighting devices, for example with a power consumption of 100 W or more, in particular 140 W or more, can be realized. The desired power can be scaled by the number of modules and the number of components per module.

A like in 4 shown optoelectronic module 1 was manufactured with the dimension 200 mm length, 70 mm width and 66 mm height as well as a weight of 700 grams. On the connection carrier 2 were called optoelectronic devices 16 Light-emitting diodes (LEDs) with as lenses as in 1 described optical elements 30 applied. The optoelectronic components 3 were operated at an efficiency of about 70 lumens per watt at a voltage of 3.2 volts at 350 milliamps per LED, with the module operating 1 a luminous flux of about 1120 lumens has been achieved. About the recess 40 could apply a 24 volt AC to that in the cover 2 attached electronic control 6 (not shown), which are then used to operate the optoelectronic components 3 required operating voltage of 24 volts DC at a current of 700 milliamps provides. The optoelectronic components 3 and the electronic control 6 produced a heat output of about 22 watts. Thermal measurement as well as simulations on a model of such a module 1 have shown that through the cooling element 9 and the above-described thermal connection of the cooling element 9 to the connection carrier 2 an operating temperature of less than 65 degrees Celsius at an ambient temperature of 30 degrees Celsius (in calm conditions) could be achieved.

In particular, the module 1 in already existing and not extra on the module 1 coordinated lighting devices 12 be used. Furthermore, the module 1 optionally be operated with solar power.

The proposed module 1 is particularly suitable for use in a street lamp, tunnel lighting, bus stop lighting or in an architectural lighting device, eg. B. a decorative lighting.

In the 5A and 5B schematically two embodiments for the electrical connection of a lighting device 12 with one or more modules 1 shown.

As in 5A is shown, the lighting device described here 12 For example, be integrated into an existing street lighting system. For this purpose, for example, by means of a power plant 98 and be provided with already existing Stromtransportwege current with an AC voltage of 220 volts. By means of a transformer 97 the current thus provided can be converted into electricity with an alternating voltage of 24 volts, which then as in connection with the 4A to 4C described by means of the or in one or more modules 1 integrated electrical control elements can be supplied directly to the respective optoelectronic component.

As compared to conventional street lighting systems with fluorescent tubes or incandescent lamps for the lighting device described here 12 Power with a much lower voltage, for example, only 24 volts AC at a current of 350 milliamps, must be provided, as in 5B shown, alternatively or additionally, an electrical connection via a solar system 95 , So a photovoltaic system with solar cells, done by means of which energy of the sun 99 can be converted into electricity. This can also be an inverter and battery system 96 be provided next to the transformer 97 that of the solar system 95 provided electrical power to the requirements of the lighting device 12 and / or the modules in the Be leuchtungsvorrichtung 12 can adapt.

6A and 6B show on the basis of various schematic views sections of a module according to a further embodiment, wherein in 6A a spatial representation and in 6B a sectional view is shown. The following description refers equally to the 6A and 6B ,

In the embodiment shown are on a connection carrier 2 purely by way of example four optoelectronic components 3 each with an optical element designed as a lens 30 arranged. In this case, the optoelectronic components 3 , which are designed as lenses optical elements 30 as well as the connection carrier 2 for example as in connection with 1A ERIS 1C be executed described.

Further, on the connection carrier 2 another optical element 20 arranged and preferably attached. The further optical element is designed as a reflector. The optoelectronic components 3 and the respective directly downstream optical elements 30 are within the reflector 20 arranged, so that in particular the plurality of optoelectronic components shown 3 the executed as a reflector optical component 20 is assigned together. The reflector 20 has inside reflective surfaces or side surfaces 210 on, which preferably run obliquely to the connection carrier and, for example, each have a parabolic curvature. Furthermore, the reflector 20 a radiation exit opening 21 on top of the reflective surfaces 210 enclosed and bordered and is rectangular in the embodiment shown. As an alternative to the exemplary embodiment shown, the reflector may, for example, also have planar, elliptical and / or hyperbolic reflecting surfaces. Depending on the shape of the reflective surfaces 210 can the radiation outlet 21 alternatively or additionally have a square, circular, elliptical or oval shape or a combination thereof. The reflector 20 is formed in the embodiment shown as a reflector pot.

In particular, the modules shown in the previous embodiments may also have one or more such reflectors. In each case, individual optoelectronic components 3 , Groups with a plurality of optoelectronic devices 3 or even all on the respective connection carrier 2 arranged optoelectronic components 3 in an optical element designed as a reflector 20 arranged and optionally further optoelectronic components 3 on the connection carrier 2 be optically decoupled. By suitable choice and combination of optical elements formed as lenses 30 and optical elements formed as reflectors 20 For example, the radiation characteristic of a module can be adjusted individually and specifically to the requirements of the module or to the lighting device without having to subordinate a further module or module to a further additional optical system. Further degrees of freedom for setting a desired emission characteristic result from twisting, tilting and / or displacement of optoelectronic components and / or optical elements 20 respectively 30 relative to each other.

7A to 7E show further embodiments of arrangements of modules 1 in lighting devices. For the sake of clarity, only the modules are involved 1 Further features of the illumination devices, as described for example in connection with previous exemplary embodiments, are not shown for the sake of clarity. The in conjunction with the 7A to 7E shown arrangement options are purely exemplary and can in particular also be combined with each other.

In the embodiment of 7A are the modules 1 arranged side by side along a row. In the embodiment of 7B are the modules 1 arranged in a matrix-like arrangement in rows and columns next to each other. 7C shows a main body 13 with three spaced-apart groups of rows arranged side by side modules 1 , The groups with modules 1 have in the embodiment shown in each case a different number of modules 1 on. In 7D is a free arrangement of modules 7D shown. As in 7E is shown, the modules can be arranged not only in a common plane but also along curved, curved and / or kinked surfaces.

By any combination of modules with the same and different Radiation characteristics results in a kind of modular system. That can mean that modules with different radiation characteristics can be provided, so that through different combinations of these different modules depending on the requirement of the lighting device desired radiation characteristics and brightness distributions may result. That means the Modules as previously shown according to the requirements for use the lighting device, each with the same or different Abstrahlcharakteristiken the modules in a simple manner relative to each other can be arranged.

8th shows in conjunction with the 8A to 8F Simulations of radiation characteristics of lighting devices according to the previous embodiments. The different emission characteristics are made possible by the above-described modular system of the modules and their arrangement to each other.

In the 8A to 8F each are two lighting devices 12 and the brightness curve generated by this on a part of a street where the lighting devices 12 are assumed arranged. The respective brightness curve is defined by the brightness ranges separated by the dashed lines 101 . 102 and 103 indicated. The brightness range corresponds to this 101 an illuminance of greater than or equal to about 30 Lux, the brightness range 102 an illuminance of greater than or equal to about 17 Lux and less 30 Lux and the brightness range 103 an illuminance of less than about 17 Lux. The lighting devices 12 are executed according to the embodiments described above for lighting devices and modules.

In 8A have the modules of the lighting devices 12 according to the embodiment of 1A to 1C executed optoelectronic components 3 with optical elements 30 , as oval lenses with concave and convex curved portions 310 . 311 are formed.

By changing the relative arrangements of the optoelectronic components 3 and the optical elements 30 as by rotation and / or displacement to each other, as well as by changing the relative dimensions of the optical elements 30 in comparison to the optoelectronic components 3 , such as by extension and / or broadening, the brightness range 103 with a light intensity of less than about 17 Lux between the lighting devices 12 be scaled down as in 8B is shown, so that a more homogeneous illumination can be achieved.

By the additional use of a further optical element 20 that like in the 6A and 6B is designed as a reflector, in addition to the execution of the lighting devices 12 for the generation of the brightness curve according to 8A can be a brightness gradient according to 8C be achieved.

By changing the optical elements 20 . 30 in terms of their dimensions and arrangements relative to the optoelectronic devices 3 a further homogenization of the brightness profile can be achieved, as in 8D is shown.

8E shows the simulation of lighting devices 12 that like the lighting fixtures 12 in conjunction with the brightness curve in 8A are executed. The radiation characteristic of the modules 1 but was adjusted so that the highest brightness between the lighting devices 12 can be generated (so-called "fill-the-gap" execution).

By mixing modules 1 in the lighting devices 12 , which has a radiation characteristic according to 8A and having a radiation characteristic according to 8E can have a radiation characteristic with a generated brightness curve according to 8F be achieved.

Due to the adjustability and variability of the modules 1 and the lighting devices 12 For example, the emission characteristic can be adapted to the desired brightness curve without the light and thus energy being wasted, for example, by shadowing or non-targeted radiation, so that the illumination devices described here 12 can lead to a significant electrical power saving compared to conventional lighting devices.

In the 9A to 9C is shown a further embodiment of lighting devices in conjunction with a simulation with respect to the producible brightness distribution.

The arrangement of the lighting devices 12 along a street is in the 9A and 9B shown. The lighting devices 12 are designed in terms of their dimensions as well-known standard 250W high-pressure sodium lamps for street lighting. That means like in 9A indicated a mounting height 110 of 8 meters, an overhang 111 of 2 meters, a boom angle of 15 ° and a boom length of 1.5 meters, resulting in a height above the road of 7,994 meters. Instead of the high-pressure sodium vapor lamps, the lighting device of the present embodiment 10 modules 1 with a total electrical power consumption of the optoelectronic components designed as LEDs 3 of 180 watts at a luminous flux of 9760 lumens.

As in 9B shown are the lighting devices 12 On a street side 30 meters apart and offset to the lighting devices 12 arranged on the opposite side of the street.

In 9C the resulting simulated brightness distribution is shown in the form of lines, which has a constant illuminance of 40 . 30 and 20 Lux feature. The achievable by means of the embodiment shown average illuminance is included 30 Lux at a maximum illuminance of 48 Lux and a minimum illuminance of 14 Lux. The ratio of minimum to maximum illuminance in the embodiment shown is 0.29 at a uniformity of the illuminance of 0.47 known to those skilled in the art. In comparison, well-known street lighting with high-pressure sodium lamps produces more inhomogeneous illumination with a much greater maximum illuminance. Thus, with the lighting devices and modules described herein, improved homogeneity and illumination of the road can be achieved with less power consumption than conventional street lighting systems.

By The lighting devices and modules described herein may have disadvantages known lighting devices such as glare, light pollution as well as the impairment significantly reduced or even completely prevented by nocturnal insects become. through the selectable and adjustable Radiation characteristic and the associated directionality of the emitted light can be reduced or prevented by Glare effects such as road safety increase. By the better efficiency can Reduced costs and reduced light pollution. By the integrated in the modules optical elements and optoelectronic Elements can the efficiency of the light sources and their lifetime are increased. The consequences of this can be an increased Safety, homogeneity and efficiency as well as reduced costs and maintenance intervals compared to conventional Be lighting devices. Furthermore, the ones described here Lighting equipment and modules through the integration of optoelectronic Components such as LEDs are dimmable and / or fast switching, so that intelligent lighting solutions can be realized in which can adjust brightness and / or color rendering index in turn can contribute to safety, for example in road traffic. By the modular structure in the form of the modular system described above arise with regard to the dimensions and dimensions of the modules and lighting devices flexible design options and high scalability. By the achievable with LEDs as optoelectronic devices Radiation spectrum can change the appearance of the lighting devices and modules can be adjustable, which gives great flexibility as well the above mentioned Reduction of impairment can result from nocturnal insects.

The The invention is not by the description based on the embodiments limited. Much more For example, the invention includes every novel feature as well as every combination of features, in particular any combination of features in the claims includes, even if this feature or this combination itself not explicitly stated in the patent claims or exemplary embodiments is.

Claims (15)

Optoelectronic module comprising: - a connection carrier ( 2 ), - one on the connection carrier ( 2 ) arranged optoelectronic component ( 3 ), - a cooling element ( 9 ), on which the connection carrier ( 2 ), - a cover ( 6 ), which extend over the connection carrier ( 2 ) and - an electrical, in particular electronic, control element ( 8th ) for controlling the optoelectronic component ( 3 ). Module according to claim 1, in which - the cooling element ( 9 ) a heat dissipation element ( 90 ), in particular a heat pipe, and / or a plurality of cooling parts ( 91 ), in particular cooling ribs. Module according to one of the preceding claims, in which - the connection carrier ( 2 ) is designed as a printed circuit board, in particular as a metal core circuit board. Module according to one of the preceding claims, in which - the connection carrier ( 2 ) on a module carrier ( 4 ) is arranged, wherein the of the optoelectronic devices ( 3 ) facing away from the connection carrier ( 2 ) the module carrier ( 4 ) is facing. Module according to claim 4, in which - the cooling element ( 9 ) on the of the connection carrier ( 2 ) facing away from the module carrier ( 4 ) is arranged and thermally conductive with the module carrier ( 4 ) connected is. Module according to claim 4 or 5, in which - the cover ( 6 ) is connected to the module carrier. Module according to one of Claims 4 to 6, in which - between the module carrier ( 4 ) and the cover ( 6 ) a sealant ( 7 ), in particular a sealing rubber ring, is arranged. Module according to one of the preceding claims, - one or more fasteners ( 10 ), which are used for fastening the module ( 1 ) on a lighting device ( 12 ) are formed. Module according to one of the preceding claims, in which - the optoelectronic component ( 3 ) one or a plurality of optical elements ( 30 ) selected from a lens having a radiation exit surface and a reflector having a radiation exit opening. Module according to one of Claims 1 to 9, in which - the control element ( 8th ) within the cover ( 6 ) is arranged. Module according to one of Claims 1 to 9, in which - the control element ( 8th ) outside the cover ( 6 ) is arranged. Lighting device comprising - a module ( 1 ) according to one of claims 1 to 11 and - a basic body ( 13 ) on which the module ( 1 ) is attached. Lighting device according to claim 12, in which - a plurality of modules ( 1 ), wherein at least two of the plurality of modules ( 1 ) and / or at least two of the plurality of modules ( 1 ) are diverse. Lighting device according to claim 12 or 13, in which - the basic body ( 13 ) between a first end side and a second end side ( 14 . 15 ), wherein the (respective) module ( 1 ) between the first and second end sides ( 14 . 15 ), and the main body ( 13 ) is open at the end, so that cooling gas, z. Air, within the body ( 13 ) from the first to the second end side ( 14 . 15 ) can flow. Lighting device according to one of claims 12 to 14, in which - the main body ( 13 ) in the area between two modules ( 1 ), so that cooling gas between two modules ( 1 ) in the basic body ( 13 ) can occur.