DE102007059856A1 - Herstellungsverfahren für ein mikromechanisches Bauelement und mikromechaniches Bauelement - Google Patents

Herstellungsverfahren für ein mikromechanisches Bauelement und mikromechaniches Bauelement Download PDF

Info

Publication number
DE102007059856A1
DE102007059856A1 DE102007059856A DE102007059856A DE102007059856A1 DE 102007059856 A1 DE102007059856 A1 DE 102007059856A1 DE 102007059856 A DE102007059856 A DE 102007059856A DE 102007059856 A DE102007059856 A DE 102007059856A DE 102007059856 A1 DE102007059856 A1 DE 102007059856A1
Authority
DE
Germany
Prior art keywords
semiconductor substrate
insulating layer
actuator
etching
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE102007059856A
Other languages
German (de)
English (en)
Inventor
Christoph Friese
Tjalf Pirk
Stefan Pinter
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Priority to DE102007059856A priority Critical patent/DE102007059856A1/de
Priority to PCT/EP2008/063670 priority patent/WO2009074368A2/fr
Publication of DE102007059856A1 publication Critical patent/DE102007059856A1/de
Withdrawn legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C3/00Assembling of devices or systems from individually processed components
    • B81C3/001Bonding of two components
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00Specific applications of microelectromechanical systems
    • B81B2201/03Microengines and actuators
    • B81B2201/033Comb drives
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00Specific applications of microelectromechanical systems
    • B81B2201/04Optical MEMS
    • B81B2201/042Micromirrors, not used as optical switches
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00Forming microstructural systems
    • B81C2203/03Bonding two components
    • B81C2203/038Bonding techniques not provided for in B81C2203/031 - B81C2203/037

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Micromachines (AREA)
  • Pressure Sensors (AREA)
DE102007059856A 2007-12-12 2007-12-12 Herstellungsverfahren für ein mikromechanisches Bauelement und mikromechaniches Bauelement Withdrawn DE102007059856A1 (de)

Priority Applications (2)

Application Number Priority Date Filing Date Title
DE102007059856A DE102007059856A1 (de) 2007-12-12 2007-12-12 Herstellungsverfahren für ein mikromechanisches Bauelement und mikromechaniches Bauelement
PCT/EP2008/063670 WO2009074368A2 (fr) 2007-12-12 2008-10-10 Procédé de fabrication d'un composant micromécanique et composant micromécanique

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102007059856A DE102007059856A1 (de) 2007-12-12 2007-12-12 Herstellungsverfahren für ein mikromechanisches Bauelement und mikromechaniches Bauelement

Publications (1)

Publication Number Publication Date
DE102007059856A1 true DE102007059856A1 (de) 2009-06-18

Family

ID=40679864

Family Applications (1)

Application Number Title Priority Date Filing Date
DE102007059856A Withdrawn DE102007059856A1 (de) 2007-12-12 2007-12-12 Herstellungsverfahren für ein mikromechanisches Bauelement und mikromechaniches Bauelement

Country Status (2)

Country Link
DE (1) DE102007059856A1 (fr)
WO (1) WO2009074368A2 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102014210986A1 (de) * 2014-06-10 2015-12-17 Robert Bosch Gmbh Mikromechanische Schichtenanordnung

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19728598A1 (de) 1997-07-04 1999-02-04 Bosch Gmbh Robert Mikromechanische Spiegeleinrichtung
US6891650B2 (en) 2001-08-20 2005-05-10 Fujitsu Limited, Micromirror unit fabrication method and micromirror unit made by the same

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100400218B1 (ko) * 2000-08-18 2003-10-30 삼성전자주식회사 마이크로 액튜에이터 및 그 제조방법
KR100486716B1 (ko) * 2002-10-18 2005-05-03 삼성전자주식회사 2-d 액튜에이터 및 그 제조방법
KR100579868B1 (ko) * 2003-12-02 2006-05-15 삼성전자주식회사 마이크로 미러 및 그 제조방법
KR100624436B1 (ko) * 2004-10-19 2006-09-15 삼성전자주식회사 2축 액츄에이터 및 그 제조방법

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19728598A1 (de) 1997-07-04 1999-02-04 Bosch Gmbh Robert Mikromechanische Spiegeleinrichtung
US6891650B2 (en) 2001-08-20 2005-05-10 Fujitsu Limited, Micromirror unit fabrication method and micromirror unit made by the same

Also Published As

Publication number Publication date
WO2009074368A3 (fr) 2009-11-12
WO2009074368A2 (fr) 2009-06-18

Similar Documents

Publication Publication Date Title
EP2170763B1 (fr) Procédé de production d'un composant, et composant obtenu
DE102012208033B4 (de) Hybrid integriertes Bauteil und Verfahren zu dessen Herstellung
DE102012208032B4 (de) Hybrid integriertes Bauteil mit MEMS-Bauelement und ASIC-Bauelement
DE102013213717A1 (de) MEMS-Bauelement mit einer Mikrofonstruktur und Verfahren zu dessen Herstellung
WO2005118463A1 (fr) Composant micromecanique presentant plusieurs chambres et procede de fabrication
DE102010039057A1 (de) Sensormodul
DE102013211872B4 (de) Mikro-elektromechanischer Reflektor und Verfahren zum Herstellen eines mikro-elektromechanischen Reflektors
DE102009055283A1 (de) Halbleitervorrichtung und Verfahren zu ihrer Herstellung
DE102009026628A1 (de) Mikromechanisches Bauelement und Verfahren zum Herstellen eines mikromechanischen Bauelements
DE102011081002A1 (de) Mikromechanisches Bauteil, durch ein Herstellungsverfahren hergestelltes Zwischenprodukt und Herstellungsverfahren für ein mikromechanisches Bauteil
DE102006009718A1 (de) Sensorvorrichtung
DE102013222836B4 (de) 1Mikroelektromechanisches Bauelement und entsprechendes Herstellungsverfahren
EP2285733B1 (fr) Procédé de fabrication de puces
DE102007059856A1 (de) Herstellungsverfahren für ein mikromechanisches Bauelement und mikromechaniches Bauelement
DE102009028037A1 (de) Bauelement mit einer elektrischen Durchkontaktierung, Verfahren zur Herstellung eines Bauelementes und Bauelementsystem
DE102010029760B4 (de) Bauelement mit einer Durchkontaktierung und Verfahren zu seiner Herstellung
EP2150488B1 (fr) Procédé de fabrication d'un composant micromécanique comportant une couche de charge et une couche de masque
DE102008007345B4 (de) Mikromechanisches Bauelement und Verfahren zur Herstellung desselben
EP4057317A1 (fr) Élément commutateur mems encapsulé, dispositif et procédé de fabrication
DE102013212095A1 (de) Mikro-elektromechanischer Reflektor und Verfahren zum Herstellen eines mikro-elektromechanischen Reflektors
DE10231730B4 (de) Mikrostrukturbauelement
DE102008001058A1 (de) Mikromechanische Elektrodenstruktur, entsprechendes Herstellungsverfahren und Mikroaktuatorvorrichtung
DE10359217A1 (de) Elektrische Durchkontaktierung von HL-Chips
DE102006023701A1 (de) Mikromechanisches Bauelement und Verfahren zur Herstellung eines mikromechanischen Bauelements
DE102008005521B4 (de) Kapazitiver Wandler und Verfahren zur Herstellung desselben

Legal Events

Date Code Title Description
R012 Request for examination validly filed

Effective date: 20140408

R002 Refusal decision in examination/registration proceedings
R119 Application deemed withdrawn, or ip right lapsed, due to non-payment of renewal fee