DE102007045750A1 - Circuit arrangement for e.g. behind-the-ear-hearing aid, has surface mount device component with contact directly connected with contacts of another component and another contact directly connected with contacts of third component - Google Patents

Abstract

The arrangement has a conductor element (A') on which a surface mount device (SMD) component (C2') having electrical contacts (10, 11) is in contact with the electrical contact (10). Another SMD component (C1') having electrical contacts (12, 13) is in contact with the electrical contact (12), where the component (C1') is provided on a conductor element (C'). A third SMD component (R1') has electrical contacts (14, 15), where the electrical contact (14) is directly connected with the contacts (10, 11) and the electrical contact (15) is directly connected with the contacts (12, 13). Independent claims are also included for the following: (1) a hearing device with a signal processing device having a circuit arrangement (2) a method for manufacturing circuit arrangement.

Description

The The present invention relates to a circuit arrangement with a first conductor element to which a first SMD component having a first and a second electrical contact has contacted with the first contact is, and with a second conductor element to which a second SMD component, the one third and a fourth electrical contact, with the third contact is contacted. In addition, the present concerns Invention a method for producing such a circuit arrangement. In particular, the invention relates to a hearing device including a such circuitry. The term hearing device is used here in particular a hearing aid, but Also any other in the ear portable device for sound output, such as a headset, headphones and the like understood.

Hearing aids are portable hearing aids that for the care of the hearing impaired serve. To meet the numerous individual needs, are different types of hearing aids such as behind-the-ear hearing aids (BTE), Hearing aid with external Listener (RIC: receiver in the canal) and in-the-ear hearing aids (IdO), z. B. Concha hearing aids or Channel hearing aids (ITE, CIC), provided. The hearing aids listed by way of example are on the outer ear or worn in the ear canal. About that In addition, there are bone conduction hearing aids on the market, implantable or vibrotactile hearing aids available. there the stimulation of the damaged hearing is either mechanical or electric.

Hearing aids have in principle as essential components an input transducer, an amplifier and an output transducer. The input transducer is usually a sound receiver, z. As a microphone, and / or an electromagnetic receiver, for. B. an induction coil. The output transducer is usually used as an electroacoustic transducer, z. As miniature speaker, or as an electromechanical transducer, z. B. bone conduction, realized. The amplifier is usually integrated in a signal processing unit. This basic structure is in 1 illustrated by the example of a behind-the-ear hearing aid. In a hearing aid housing 1 To carry behind the ear are one or more microphones 2 built-in for recording the sound from the environment. A signal processing unit 3 also in the hearing aid housing 1 is integrated, processes the microphone signals and amplifies them. The output signal of the signal processing unit 3 goes to a speaker or listener 4 transmitted, which emits an acoustic signal. The sound is optionally transmitted via a sound tube, which is fixed with an earmold in the ear canal, to the eardrum of the device carrier. The power supply of the hearing aid and in particular the signal processing unit 3 done by a likewise in the hearing aid housing 1 integrated battery 5 ,

at Hearing aids and especially in ITE hearing aids always the need to reduce the construction volume. From this goal, a hearing aid or the Components of a hearing aid in terms of Volume reduction is also the commonly existing amplifier circuit affected.

the However, the above goal counteracts the request, more and more functions integrate into a hearing aid to want. These are usually always new components and components necessary. So far, it has been in increasing the functionality of one Hearing aid necessary, the area a circuit, i. H. the area a printed circuit or a ceramic substrate, too, too to accommodate the new components.

The The object of the present invention is therefore the functionality of a Essentially increase circuit without increasing the space or to reduce the space requirement of a circuit with unchanged functionality.

According to the invention this Task solved by a circuit arrangement with a first conductor element, on the a first SMD device having a first and a second electrical Contact, contacted with the first contact, and a second conductor element to which a second SMD component, the one third and a fourth electrical contact, with the contacted third contact, wherein a third SMD device, that a fifth and a sixth electrical contact with the fifth contact directly to the first or second contact of the first SMD component and with the sixth contact directly to the third or fourth Contact of the second SMD component is connected.

Furthermore is provided according to the invention a method of manufacturing a circuit by providing a first and a second conductor element on a printed circuit board whose surface normal defines a vertical direction, contacting a first SMD device with the first conductor element, and contacting a second SMD device with the second conductor element, and arranging a third SMD component vertically above the first and second SMD device and contacting the third SMD device directly with the first and second SMD components in this arrangement.

Advantageously, so SMD construction be connected with their connections on top of each other, so that the SMD components can be stacked and so the footprint that must be provided on a circuit board, can be reduced in size. In addition, stacking the SMD devices one above the other allows shorter connections due to the direct contacting of the device terminals with each other, and no special components such as bridges and the like are needed for the connection. So if example, as three SMD components to be connected in series, the average SMD component can be lifted to the connection points of the first and the third SMD component. So it can relax so the space problems on a circuit board or on a ceramic substrate.

Preferably Each of the SMD components is cuboid and has on two opposite Pages one after five pages pointing contact or connection. This causes every connection also as a so-called "pad" for it to be arranged SMD components can be used.

at the circuit arrangement according to the invention can also SMD components in at least three layers one above the other be stacked. This promotes the compactness of the circuitry if nodes exist are connected to the more than two components.

conveniently, is a hearing aid and in particular a hearing aid with a Signal input device, a signal processing device for processing a signal from the signal input device and outputting an output signal, and having a signal output means provided for converting the output signal into an acoustic signal, wherein the signal processing device is a circuit arrangement as described above having. This can especially in hearing devices or hearing aids a Volume reduction can be achieved.

The The present invention will be further explained with reference to the accompanying drawings, in which: show:

1 the basic structure of a hearing aid according to the prior art;

2 a simple circuit diagram for an inventively to be realized circuit arrangement;

3 a perspective view of a circuit arrangement according to the present invention on the basis of the circuit of 2 ;

4 the circuit arrangement of 3 in plan view and

5 the circuit arrangement of 3 in the side view.

The below described embodiment represents a preferred embodiment of present invention.

2 shows a circuit example to be realized according to the present invention with SMD components principle. This is a three-port with the terminals A, B and C. Between the terminals A and C, an ohmic resistance R1 is connected. Between the terminals C and B, a first capacitor C1 and between the terminals A and B, a second capacitor C2 is connected.

On a circuit board that can be equipped with SMD components, the connections A, B and C are according to 3 realized by interconnects A ', B' and C '. For example, the interconnects A 'and C' correspond to a first conductor element and a second conductor element. On these interconnects A ', B', C 'is now the circuit of 2 implemented by cuboidal SMD components three-dimensional.

Each of the SMD components shown here is parallelepipedic and has on two opposite sides in each case a contact region which points in five directions or sides. Each of these contact areas represents a connection or contact of the respective SMD component. For example, the SMD capacitor C2 'has a first contact 10 and an opposite second contact 11 , Likewise, the SMD capacitor C1 'has a third contact as a second SMD component 12 and an opposite fourth contact 13 , Finally, the SMD resistor R1 'has a fifth contact as the third SMD component 14 and a sixth contact 15 on.

The SMD capacitor C2 'is with its first contact 10 on the track A 'and with his second contact 11 contacted on the track B '. The contacting takes place with the aid of solder or a conductive adhesive. The further SMD capacitor C1 'is connected to its third contact 12 to the track C 'and its fourth contact 13 connected to the conductor B '. The two SMD capacitors C1 'and C2', which are arranged parallel to one another, now form bridge piers for the SMD resistor R1 '. The SMD resistor R1 'is thus arranged with respect to the printed circuit board or the interconnects A', B 'and C' vertically over the SMD components C1 'and C2' and extending at right angles to this. The sixth contact 15 of SMD resistor R1 'is directly connected to the third contact 12 of the SMD capacitor C1 ', while the fifth contact 14 of the SMD resistor R1 'directly to the first contact 10 of the SMD capacitor C2 'is connected. At the junction of two contacts 10 . 14 ; 12 . 15 but also between the contacts 10 to 13 and the respective interconnects A ', B' and C 'is only solder or a conductive adhesive 16 , Special contact elements between the components can therefore be dispensed with.

The arrangement of the SMD components R1 ', C1' and C2 'is in 4 in plan view and in 5 shown in the side view. Thus, SMD components connected in series are arranged vertically one above the other and the connection between them is effected by SMD components themselves. The SMD components required in the circuit are therefore also used as mechanical connecting elements between the SMD components involved. This reduces the footprint on a printed circuit board (PCB) or ceramic substrate.

Further Advantages of the invention, vertical Stacking of SMD components consists in that shorter and more direct connections of SMD components connected in series are possible and several SMD components are placed one above the other can. In addition, can the stacking and electrical connection of the SMD components as well automatically by an SMD machine.

Claims (6)

Circuit arrangement with a first conductor element (A ') to which a first SMD component (C2') has a first ( 10 ) and a second electrical contact ( 11 ), with the first contact ( 10 ), and - a second conductor element (C ') to which a second SMD component (C1') has a third ( 12 ) and a fourth electrical contact ( 13 ), with the third contact ( 12 ), characterized in that - a third SMD component (R1 ') having a fifth ( 14 ) and a sixth electrical contact ( 15 ), with the fifth contact ( 14 ) directly to the first ( 10 ) or second contact ( 11 ) of the first SMD device (C2 ') and with the sixth contact ( 15 ) directly to the third ( 12 ) or fourth contact ( 13 ) of the second SMD component (C1 ') is connected. Circuit arrangement according to claim 1, wherein each SMD component formed cuboid is and on two opposite Pages one after five Has page-facing contact. Circuit arrangement according to claim 1 or 2, wherein SMD components in at least three layers one above the other are stacked. Hearing device with a signal input device ( 2 ), a signal processing device ( 3 ) for processing a signal from the signal input device and for outputting an output signal, as well as with a signal output device ( 4 ) for converting the output signal into an acoustic signal, wherein the signal processing device ( 3 ) comprises a circuit arrangement according to one of the preceding claims. Method for producing a circuit arrangement by - Provide a first (A ') and a second conductor element (C ') on a printed circuit board whose surface normal defines a vertical direction, - Contact a first SMD component (C2 ') with the first conductor element (A '), and - To contact a second SMD component (C1 ') with the second conductor element (C'), marked by - Arrange a third SMD device (R1 ') vertically above the first (C2') and second SMD device (C1 ') and contacting of the third SMD component (R1 ') directly to the first and second SMD device in this arrangement. The method of claim 5, wherein SMD components in at least three layers are stacked vertically one above the other.