DE102007016388B4 - Apparatus for the wet treatment of substrates - Google Patents
Apparatus for the wet treatment of substrates Download PDFInfo
- Publication number
- DE102007016388B4 DE102007016388B4 DE200710016388 DE102007016388A DE102007016388B4 DE 102007016388 B4 DE102007016388 B4 DE 102007016388B4 DE 200710016388 DE200710016388 DE 200710016388 DE 102007016388 A DE102007016388 A DE 102007016388A DE 102007016388 B4 DE102007016388 B4 DE 102007016388B4
- Authority
- DE
- Germany
- Prior art keywords
- substrates
- cover plates
- cage
- locking bar
- oval
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/67313—Horizontal boat type carrier whereby the substrates are vertically supported, e.g. comprising rod-shaped elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Vorrichtung zur Nassbehandlung von Substraten, mit einem Käfig (1) zur einschließenden Aufnahme von Substraten (8), der aus zwei gegenüberliegenden rechteckigen Deckplatten (2.1, 2.2) und aus zwei quer zur Einschubrichtung der Substrate (8) endseitig angeordneten Stangen (4.5, 4.6), die mit einer Verzahnung (7) für die in Einschubrichtung vordere Kante der Substrate (8) versehen ist, sowie aus einer dem Verschließen und Öffnen des Käfigs (1) dienenden, in die und aus den Deckplatten (2.1, 2.2) einsetzbaren und herausnehmbaren Riegelstange (3), die den endseitig angeordneten Stangen (4.5, 4.6) gegenüberliegt, und die mit einer Verzahnung (7) für die in Einschubrichtung hintere Kante der Substrate (8) versehen ist, gebildet ist, dadurch gekennzeichnet, dass die beiden Enden der Riegelstange (3) als eiförmiges Oval ausgebildet sind und die Riegelstange (3) mit den so geformten Enden in eine Nut (6.1) in den Deckplatten (2.1, 2.2) in Längsrichtung des Ovals einführbar und durch Drehung um 90° über einen ovalen Formschluss...Device for wet treatment of substrates, with a cage (1) for the inclusion of substrates (8), which consists of two opposite rectangular cover plates (2.1, 2.2) and two rods (4.5, 4.6.) Arranged at the ends transversely to the direction of insertion of the substrates (8) ), which is provided with a toothing (7) for the front edge of the substrates (8) in the direction of insertion, as well as one used for closing and opening the cage (1), into and out of the cover plates (2.1, 2.2) and Removable locking bar (3), which is opposite the rods (4.5, 4.6) arranged at the end, and which is provided with teeth (7) for the rear edge of the substrates (8) in the direction of insertion, characterized in that the two ends the locking bar (3) is designed as an egg-shaped oval and the locking bar (3) with the ends shaped in this way can be inserted into a groove (6.1) in the cover plates (2.1, 2.2) in the longitudinal direction of the oval and by rotating it 90 ° over an oval form fit ...
Description
Die vorliegende Erfindung bezieht sich auf eine Vorrichtung zur Nassbehandlung von Substraten nach dem Oberbegriff des Anspruchs 1.The present invention relates to a device for the wet treatment of substrates according to the preamble of claim 1.
Substrate für die Mikroelektronik und Photovoltaik, in der Regel so genannte Wafer aus Silizium, durchlaufen bei den vielseitigen Fertigungsschritten auch nasschemische Prozesse zur Strukturierung und nasse Prozesse zur Reinigung. Für beide Prozessarten werden unterschiedlichste Medien bei unterschiedlichen Prozess-Temperaturen eingesetzt. Die Behandlung erfolgt in den meisten Fällen chargenweise in filigran gefertigten Prozess-Kassetten, damit die Medien nach dem jeweiligen Prozess gut abtropfen, mit wenig Verschleppungen in den nächsten Nassprozess eingetaucht und dem letzten Reinigungsprozess fleckenfrei entnommen werden können.Substrates for microelectronics and photovoltaics, usually so-called silicon wafers, also undergo wet-chemical processes for structuring and wet processes for cleaning in the versatile production steps. For both types of process a wide variety of media are used at different process temperatures. In most cases, the treatment is carried out batch-wise in filigree process cassettes, so that the media drip off well after the respective process, can be dipped into the next wet process with little carryover and can be removed without staining during the last cleaning process.
Insbesondere bei der Herstellung von photovoltaischen Zellen werden zur Einsparung von Silizium immer dünnere Zellen verwendet, die sich leicht durchbiegen. Dies hat zur Folge, dass die dicht an dicht stehenden Substrate, bei Verwendung von Kassetten nach dem heutigen Stand der Technik, durch die Bewegung im Bad und durch die Adhäsionskräfte büschelweise zusammenkleben und an diesen Stellen den laufenden Prozess beeinträchtigen oder gar verhindern. Ein weiterer Nachteil heutiger Kassetten ist, dass durch die nach oben geöffnete Bauweise die immer dünner und damit leichter werdenden Wafer heraus schwimmen können.In particular, in the production of photovoltaic cells are used to save silicon ever thinner cells that bend easily. This has the consequence that the densely packed substrates, when using cassettes according to the current state of the art, by the movement in the bathroom and by the adhesion forces stick together in tufts and affect the current process or even prevent at these points. Another disadvantage of today's cassettes is that the ever-thinner and hence lighter-weight wafers can float out due to the open-top design.
Aus der
Die
Entsprechendes gilt für die
Aufgabe der vorliegenden Erfindung ist es deshalb, eine einfacher handhabbare Verschlusstechnik zwischen Riegelstange und Käfig zu schaffen.Object of the present invention is therefore to provide a more manageable closure technique between locking bar and cage.
Zur Lösung dieser Aufgabe sind die Merkmale nach Anspruch 1 vorgesehen.To solve this problem, the features of claim 1 are provided.
Die Lösung besteht somit darin, die Riegelstange an ihren beiden Enden und die Einführöffnung in den Deckplatten so auszubilden, dass ein einfaches vertikal lineares Einführen und anschließendes 90°-Verdrehen der Riegelstange zu einer festen Verbindung zwischen den beiden Bauteilen ausreicht. Ein weiterer Vorteil gemäß vorliegender Erfindung besteht darin, dass mit dem Verdrehen der Riegelstange bei entsprechender Anordnung einer Verzahnung an dieser Riegelstange gleichzeitig die Substrate auch an ihrem in Einschubrichtung hinteren Ende in einem bestimmten vorgegebenen Abstand fixiert werden können. Des Weiteren ist eine seitliche Fixierung der Substrate in der Vorrichtung vorgesehen.The solution is therefore to form the locking bar at its two ends and the insertion opening in the cover plates so that a simple vertically linear insertion and subsequent 90 ° twisting the locking bar is sufficient for a firm connection between the two components. Another advantage of the present invention is that with the rotation of the locking bar with a corresponding arrangement of a toothing on this locking bar at the same time the substrates can be fixed at its rear end in the insertion direction at a certain predetermined distance. Furthermore, a lateral fixation of the substrates is provided in the device.
Mit den Merkmalen nach Anspruch 2 wird die Art und Weise der Aussteifung der Vorrichtung beschrieben.With the features of claim 2, the manner of stiffening the device will be described.
Weitere Einzelheiten der Erfindung sind der folgenden Beschreibung zu entnehmen, in der die Erfindung anhand des in der Zeichnung dargestellten Ausführungsbeispiels näher beschrieben und erläutert ist.Further details of the invention will be apparent from the following description in which the invention with reference to the embodiment shown in the drawing is described and explained in more detail.
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Claims (2)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE200710016388 DE102007016388B4 (en) | 2007-04-03 | 2007-04-03 | Apparatus for the wet treatment of substrates |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE200710016388 DE102007016388B4 (en) | 2007-04-03 | 2007-04-03 | Apparatus for the wet treatment of substrates |
Publications (2)
Publication Number | Publication Date |
---|---|
DE102007016388A1 DE102007016388A1 (en) | 2008-10-09 |
DE102007016388B4 true DE102007016388B4 (en) | 2012-01-12 |
Family
ID=39736188
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE200710016388 Expired - Fee Related DE102007016388B4 (en) | 2007-04-03 | 2007-04-03 | Apparatus for the wet treatment of substrates |
Country Status (1)
Country | Link |
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DE (1) | DE102007016388B4 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102015224980A1 (en) | 2015-11-13 | 2017-05-18 | Singulus Technologies Ag | Cassette for holding plate-shaped elements |
DE102017204910A1 (en) | 2017-03-23 | 2018-09-27 | Singulus Technologies Ag | Carrier cassette and carrier cassette stack |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102012010940A1 (en) | 2012-06-04 | 2013-12-05 | ACI eco Tec GmbH | Device for wet treatment of substrates e.g. silicon wafer, has support elements on which substrate support is pointed up and down, such that substrates are in parallel state at constant, limiting distance force |
TWM508112U (en) * | 2015-04-30 | 2015-09-01 | Chung King Entpr Co Ltd | Substrate carrier for solar cells |
FR3124887B1 (en) * | 2021-07-02 | 2023-06-23 | Commissariat Energie Atomique | Platelet immersion device |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE4300205A1 (en) * | 1993-01-07 | 1994-07-14 | Deutsche Bundespost Telekom | Mounting for substrates in cassette form |
JPH10340945A (en) * | 1997-06-10 | 1998-12-22 | Sony Corp | Cassette for wafer |
US20040065413A1 (en) * | 2002-10-07 | 2004-04-08 | Kim Dae Jeong | Cassette for preventing breakage of glass substrate |
-
2007
- 2007-04-03 DE DE200710016388 patent/DE102007016388B4/en not_active Expired - Fee Related
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE4300205A1 (en) * | 1993-01-07 | 1994-07-14 | Deutsche Bundespost Telekom | Mounting for substrates in cassette form |
JPH10340945A (en) * | 1997-06-10 | 1998-12-22 | Sony Corp | Cassette for wafer |
US20040065413A1 (en) * | 2002-10-07 | 2004-04-08 | Kim Dae Jeong | Cassette for preventing breakage of glass substrate |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102015224980A1 (en) | 2015-11-13 | 2017-05-18 | Singulus Technologies Ag | Cassette for holding plate-shaped elements |
DE102015224980B4 (en) * | 2015-11-13 | 2017-08-17 | Singulus Technologies Ag | Cassette for holding plate-shaped elements |
DE102017204910A1 (en) | 2017-03-23 | 2018-09-27 | Singulus Technologies Ag | Carrier cassette and carrier cassette stack |
DE102017204910B4 (en) | 2017-03-23 | 2018-10-04 | Singulus Technologies Ag | Carrier cassette and carrier cassette stack |
Also Published As
Publication number | Publication date |
---|---|
DE102007016388A1 (en) | 2008-10-09 |
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Legal Events
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OP8 | Request for examination as to paragraph 44 patent law | ||
8181 | Inventor (new situation) |
Inventor name: HAAS, ANDREAS, 78112 ST. GEORGEN, DE Inventor name: SCHUHMACHER, HARALD, 78739 HARDT, DE Inventor name: MENAUER, KARL-HEINZ, DIPL.-ING., 71263 WEIL DE, DE Inventor name: JAEGER, FELIX, DIPL.-ING. (FH), 78333 STOCKACH, DE |
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8127 | New person/name/address of the applicant |
Owner name: ACI-ECOTEC GMBH & CO. KG, 78658 ZIMMERN, DE |
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R081 | Change of applicant/patentee |
Owner name: ACI ECOTEC GMBH, DE Free format text: FORMER OWNER: ACI ECO TEC GMBH, 78658 ZIMMERN, DE Effective date: 20110701 Owner name: ACI ECOTEC GMBH, DE Free format text: FORMER OWNER: ACI-ECOTEC GMBH & CO. KG, 78658 ZIMMERN, DE Effective date: 20110513 Owner name: ACI AG, DE Free format text: FORMER OWNER: ACI-ECOTEC GMBH & CO. KG, 78658 ZIMMERN, DE Effective date: 20110513 Owner name: ACI AG, DE Free format text: FORMER OWNER: ACI ECO TEC GMBH, 78658 ZIMMERN, DE Effective date: 20110701 |
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Representative=s name: DREISS PATENTANWAELTE, 70188 STUTTGART, DE Representative=s name: V. FUENER EBBINGHAUS FINCK HANO, 81541 MUENCHEN, D Representative=s name: DREISS PATENTANWAELTE, DE Effective date: 20110701 Representative=s name: V. FUENER EBBINGHAUS FINCK HANO, DE Effective date: 20110701 Representative=s name: DREISS PATENTANWAELTE PARTG MBB, DE Effective date: 20110701 |
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R082 | Change of representative |
Representative=s name: V. FUENER EBBINGHAUS FINCK HANO, 81541 MUENCHEN, D Representative=s name: V. FUENER EBBINGHAUS FINCK HANO, DE Representative=s name: DREISS PATENTANWAELTE PARTG MBB, DE |
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R082 | Change of representative |
Representative=s name: DREISS PATENTANWAELTE PARTG MBB, DE |
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R020 | Patent grant now final |
Effective date: 20120413 |
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R081 | Change of applicant/patentee |
Owner name: ACI AG, DE Free format text: FORMER OWNER: ACI ECOTEC GMBH, 78658 ZIMMERN, DE |
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R082 | Change of representative |
Representative=s name: DREISS PATENTANWAELTE PARTG MBB, DE |
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R119 | Application deemed withdrawn, or ip right lapsed, due to non-payment of renewal fee |