DE102006052908A8 - Wafer-Auffang-Vorrichtung - Google Patents

Wafer-Auffang-Vorrichtung Download PDF

Info

Publication number
DE102006052908A8
DE102006052908A8 DE200610052908 DE102006052908A DE102006052908A8 DE 102006052908 A8 DE102006052908 A8 DE 102006052908A8 DE 200610052908 DE200610052908 DE 200610052908 DE 102006052908 A DE102006052908 A DE 102006052908A DE 102006052908 A8 DE102006052908 A8 DE 102006052908A8
Authority
DE
Germany
Prior art keywords
target means
wafer target
wafer
target
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
DE200610052908
Other languages
English (en)
Other versions
DE102006052908A1 (de
DE102006052908B4 (de
Inventor
Jürgen Döpping
Matthias Dr. Reinecke
Holger Brosche
Hans-Joachim Gretzschel
Steffen Pollack
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Meyer Burger Germany GmbH
Original Assignee
Deutsche Solar GmbH
HAP Handhabungs Automatisierungs und Prazisionstechnik GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Deutsche Solar GmbH, HAP Handhabungs Automatisierungs und Prazisionstechnik GmbH filed Critical Deutsche Solar GmbH
Priority to DE200610052908 priority Critical patent/DE102006052908B4/de
Priority to US11/935,195 priority patent/US8201814B2/en
Publication of DE102006052908A1 publication Critical patent/DE102006052908A1/de
Publication of DE102006052908A8 publication Critical patent/DE102006052908A8/de
Application granted granted Critical
Publication of DE102006052908B4 publication Critical patent/DE102006052908B4/de
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/202—With product handling means
    • Y10T83/2092—Means to move, guide, or permit free fall or flight of product
DE200610052908 2006-11-08 2006-11-08 Wafer-Auffang-Vorrichtung Expired - Fee Related DE102006052908B4 (de)

Priority Applications (2)

Application Number Priority Date Filing Date Title
DE200610052908 DE102006052908B4 (de) 2006-11-08 2006-11-08 Wafer-Auffang-Vorrichtung
US11/935,195 US8201814B2 (en) 2006-11-08 2007-11-05 Wafer catching device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE200610052908 DE102006052908B4 (de) 2006-11-08 2006-11-08 Wafer-Auffang-Vorrichtung

Publications (3)

Publication Number Publication Date
DE102006052908A1 DE102006052908A1 (de) 2008-06-12
DE102006052908A8 true DE102006052908A8 (de) 2008-09-25
DE102006052908B4 DE102006052908B4 (de) 2008-12-04

Family

ID=39362968

Family Applications (1)

Application Number Title Priority Date Filing Date
DE200610052908 Expired - Fee Related DE102006052908B4 (de) 2006-11-08 2006-11-08 Wafer-Auffang-Vorrichtung

Country Status (2)

Country Link
US (1) US8201814B2 (de)
DE (1) DE102006052908B4 (de)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2711979A1 (de) 2012-09-24 2014-03-26 Meyer Burger AG Wafer-Schneidsystem
EP2711978A1 (de) 2012-09-24 2014-03-26 Meyer Burger AG Verfahren zur Herstellung von Wafern
EP2720258A1 (de) 2012-10-12 2014-04-16 Meyer Burger AG System zur Handhabung von Wafern
EP2944444A1 (de) 2014-05-16 2015-11-18 Meyer Burger AG Waferverarbeitungsverfahren
TWI569351B (zh) * 2015-04-30 2017-02-01 環球晶圓股份有限公司 晶圓旋轉裝置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6119673A (en) * 1998-12-02 2000-09-19 Tokyo Seimitsu Co., Ltd. Wafer retrieval method in multiple slicing wire saw

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1065979A (en) * 1912-11-12 1913-07-01 Charles W Spencer Supporting-frame for engines.
US3640398A (en) * 1970-03-30 1972-02-08 Edward J Mellen Jr Wafer boat
JPS61111557A (ja) 1984-11-06 1986-05-29 Mitsubishi Electric Corp 半導体ウエハの移し替え装置
US5205028A (en) * 1991-04-01 1993-04-27 Silicon Technology Corporation Wafer alignment fixture for wafers having notches and/or flats
US5441091A (en) * 1992-12-28 1995-08-15 Collins; Richard M. Roller support for saw workpiece
TW275708B (de) * 1993-12-28 1996-05-11 Tokyo Electron Co Ltd
US6006736A (en) 1995-07-12 1999-12-28 Memc Electronic Materials, Inc. Method and apparatus for washing silicon ingot with water to remove particulate matter
US6171400B1 (en) * 1998-10-02 2001-01-09 Union Oil Company Of California Vertical semiconductor wafer carrier
DE10210024A1 (de) 2002-03-07 2002-09-12 Wacker Siltronic Halbleitermat Verfahren zum Herstellen von Halbleiterscheiben
DE10210021A1 (de) 2002-03-07 2002-08-14 Wacker Siltronic Halbleitermat Verfahren zur Herstellung von Halbleiterscheiben durch Abtrennen der Halbleiterscheiben von mindestens einem Kristallstück

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6119673A (en) * 1998-12-02 2000-09-19 Tokyo Seimitsu Co., Ltd. Wafer retrieval method in multiple slicing wire saw

Also Published As

Publication number Publication date
DE102006052908A1 (de) 2008-06-12
US20080295662A1 (en) 2008-12-04
DE102006052908B4 (de) 2008-12-04
US8201814B2 (en) 2012-06-19

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8327 Change in the person/name/address of the patent owner

Owner name: DEUTSCHE SOLAR AG, 09599 FREIBERG, DE

R081 Change of applicant/patentee

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R119 Application deemed withdrawn, or ip right lapsed, due to non-payment of renewal fee