DE102006048039B3 - Low inductive connection for conductive strip, has connection of conductive surfaces placed on surfaces of boards that are facing each other by solder joint, where ratio of width of strips to distance of strips is greater than two - Google Patents

Low inductive connection for conductive strip, has connection of conductive surfaces placed on surfaces of boards that are facing each other by solder joint, where ratio of width of strips to distance of strips is greater than two Download PDF

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Publication number
DE102006048039B3
DE102006048039B3 DE200610048039 DE102006048039A DE102006048039B3 DE 102006048039 B3 DE102006048039 B3 DE 102006048039B3 DE 200610048039 DE200610048039 DE 200610048039 DE 102006048039 A DE102006048039 A DE 102006048039A DE 102006048039 B3 DE102006048039 B3 DE 102006048039B3
Authority
DE
Germany
Prior art keywords
connection
strips
circuit board
conductive
pairs
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE200610048039
Other languages
German (de)
Inventor
Armin Wagner
Andreas Streck
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ELOVIS GmbH
Original Assignee
ELOVIS GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ELOVIS GmbH filed Critical ELOVIS GmbH
Priority to DE200610048039 priority Critical patent/DE102006048039B3/en
Application granted granted Critical
Publication of DE102006048039B3 publication Critical patent/DE102006048039B3/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H05K3/363—Assembling flexible printed circuits with other printed circuits by soldering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/02—Soldered or welded connections
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
    • H01R43/0256—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections for soldering or welding connectors to a printed circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09481—Via in pad; Pad over filled via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/0969—Apertured conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10666—Plated through-hole for surface mounting on PCB

Abstract

The connection has conductive surfaces including a connection (3) placed on surfaces of printed circuit boards (1) that are facing each other by a solder joint, where a ratio of a width (11) of conductive strips (2) to a distance of the strips is greater than two. A conductive layer of each board lies at a surface of a side facing other circuit board, and strips lie on a side opposite to the board, where middle layers are connected with the strips on the surface over a through holes (4) in an electrically conductive manner.

Description

Aufgabe der ErfindungObject of the invention

Die Erfindung dient der Verbindung von Bauteilen mit schnellen Stromänderungen.The Invention serves to connect components with fast current changes.

Aufgabe der Erfindung ist es, eine Lötverbindung zu schaffen, die zwei oder mehr feste beziehungsweise flexible Leiterplatten leitend verbindet, wobei die auftretende Induktivität möglichst niedrig, die Verbindung mechanisch stabil und die Herstellung der Verbindung wirtschaftlich realisierbar ist.task The invention is a solder joint to create the two or more fixed or flexible circuit boards conductively connects, with the occurring inductance as possible low, the compound mechanically stable and the production of the Compound is economically feasible.

Die Aufgabe wird durch die kennzeichnenden Merkmale des Anspruchs 1 gelöst.The The object is achieved by the characterizing features of claim 1 solved.

Stand der TechnikState of the art

Zur Verbindung von Leiterplatten miteinander oder von Komponenten mit einer Leiterplatte sind zahlreiche Steckverbinder auf dem Markt erhältlich, wie sie beispielsweise in den Patentschriften EP 1 134 844 A1 und DE 100 16 942 C2 beschrieben werden. Diese Verbindungsmöglichkeiten besitzen jedoch den Nachteil, dass eine wirklich niederinduktive Verbindung auf Grund der nicht vorhandenen Ausprägung der Leiterbahnen als Streifenleiter nicht möglich ist.For connecting printed circuit boards together or components with a printed circuit board numerous connectors are available on the market, as for example in the patents EP 1 134 844 A1 and DE 100 16 942 C2 to be discribed. However, these connection options have the disadvantage that a really low-inductive connection due to the non-existent expression of the conductor tracks as a strip conductor is not possible.

Des Weiteren ist die Möglichkeiten bekannt, ein Lötpad niederinduktiv an eine andere leitende Schicht der gleichen Leiterplatte anzubinden, wie sie in DE 197 48 689 C2 beschrieben ist. Auch hierin wird aber nicht die Lösung des Problems einer niederinduktiven Verbindung zweier oder mehrer Leiterplatten wie in Abschnitt 2.1 beschrieben gegeben.Furthermore, the possibilities are known to connect a solder pad low inductively to another conductive layer of the same circuit board as in DE 197 48 689 C2 is described. However, this does not solve the problem of a low-inductance connection of two or more printed circuit boards as described in Section 2.1.

Beschreibung der ErfindungDescription of the invention

Die Verbindung von zwei oder mehr, festen oder flexiblen Leiterplatten (1) geschieht in der Art, dass jeweils eine der leitenden Schichten einer Leiterplatte sich an der der anderen Leiterplatte zugewandten Oberfläche befindet und der Kontakt durch eine Lötstelle erfolgt, die eine leitfähige Schicht, die auf der der anderen Leiterplatte zugewandten Seite liegt, mit einer Durchkontaktierung (4) mit der dieser Seite abgewandten Schicht leitend verbindet.The connection of two or more, fixed or flexible printed circuit boards ( 1 ) occurs in such a way that in each case one of the conductive layers of a printed circuit board is located on the surface facing the other printed circuit board and the contact takes place through a solder joint which has a conductive layer which lies on the side facing the other printed circuit board ( 4 ) conductively connects to the side facing away from this side.

Das Verhältnis der Breite (11) der Leiterbahnen (2) zum Abstand (10) der übereinander liegenden Leiterbahnen nimmt einen Wert größer als Zwei ein und die Kontakte sind bezogen auf die Stromrichtung hintereinander angeordnet.The ratio of the width ( 11 ) of the tracks ( 2 ) to the distance ( 10 ) of the superimposed interconnects occupies a value greater than two and the contacts are arranged with respect to the current direction one behind the other.

Zeichnung 1 zeigt die Aufsicht auf eine Leiterplatte (1), wobei die Bandleitung Aussparungen unterschiedlicher Form enthalten kann, um z.B. die Flexibilität der Leiterplatte zu erhöhen.Drawing 1 shows the top view of a printed circuit board ( 1 ), wherein the ribbon cable may contain recesses of different shape, for example, to increase the flexibility of the circuit board.

Zeichnung 2 zeigt die Seitenansicht entlang der Querschnittslinie A-B (5) in Zeichnung 1 mit den Leiterbahnen (2) jeweils auf der Ober- und Unterseite der beiden sich überlappenden Leiterplatten.Drawing 2 shows the side view along the cross-sectional line AB ( 5 ) in drawing 1 with the tracks ( 2 ) each on the top and bottom of the two overlapping circuit boards.

Im Überlappungsbereich befinden sich die mit Lötzinn gefüllten Lötstellen (3) und die Durchkontaktierungen (4), wobei sich die Durchkontaktierungen nicht unmittelbar auf den Löstellen befinden müssen. Sie können z.B. wie in Zeichnung 3 exemplarisch gezeigt vor oder auch (nicht dargestellt) hinter den Lötstellen angeordnet sein.In the overlap area are the solder-filled solder joints ( 3 ) and the vias ( 4 ), wherein the vias do not need to be located directly on the Löstellen. For example, as shown in drawing 3, they may be arranged before or else (not shown) behind the solder joints.

Der Überlappungsbereich ist in Zeichnung 4 vergrößert dargestellt; der Pfeil zeigt den Abstand der Leiterbahnen (10).The overlap area is shown enlarged in drawing 4; the arrow shows the distance of the tracks ( 10 ).

Zeichnung 5 zeigt eine andere Ausführungsform. Hier wird gezeigt, dass die hier beschriebene Kontaktierungsmethode nicht nur für zweilagige Leiterplatten genutzt werden kann, sondern dass sich auch die Kontaktierung von Leiterbahnen auf Mittenlagen von Mehrlagen-Leiterplatten realisieren lässt.drawing 5 shows another embodiment. Here it is shown that the contacting method described here not only for Two-layer circuit boards can be used, but that too the contacting of printed conductors on the middle layers of multilayer printed circuit boards can be realized.

In Zeichnung 6 sind alternative Kontaktierungsmöglichkeiten dargestellt.In Drawing 6 alternative contacting options are shown.

11
Leiterplattecircuit board
22
Leiterbahnconductor path
33
Lötstellesoldered point
44
Durchkontaktierungvia
55
Schnittlinie A-Bintersection FROM
66
Gelötete VerbindungsplättchenSoldered connecting plates
77
Federkontaktespring contacts
88th
Wire-Bond-DrähteWire-bonding wires
99
Aussparungenrecesses
1010
Abstand der Leiterbahnendistance the tracks
1111
Breite der Leiterbahnwidth the conductor track

Claims (3)

Niederinduktive Verbindung eines oder mehrerer Leiterbahnenpaare auf einer starren oder flexiblen Leiterplatte mit einem oder mehreren Leiterbahnenpaaren auf einer weiteren starren oder flexiblen Leiterplatte, wobei die einzelnen Leiterbahnen der Paare auf verschiedenen Schichten der Leiterplatten liegen und die mechanische und elektrische Verbindung mittels einer Lötverbindung realisiert wird, dadurch gekennzeichnet, dass das Verhältnis der Breite (11) der Leiterbahnen (2) zum Abstand der Leiterbahnen (10) einen Wert größer als Zwei annimmt und dass die Kontakte bezogen auf die Stromrichtung hintereinander angeordnet sind.Low-inductance connection of one or more interconnect pairs on a rigid or flexible circuit board with one or more pairs of interconnects on another rigid or flexible circuit board, wherein the individual interconnects of the pairs are on different layers of the circuit boards and the mechanical and electrical connection is realized by means of a solder connection, characterized characterized in that the ratio of the width ( 11 ) of the tracks ( 2 ) to the distance of the tracks ( 10 ) assumes a value greater than two and that the contacts are arranged one behind the other with respect to the current direction. Niederinduktive Verbindung nach Anspruch 1 dadurch gekennzeichnet, dass jeweils eine leitende Schicht jeder Leiterplatte sich an der Oberfläche der der anderen Leiterplatte zugewandten Seite liegt und die Leiterbahnen auf der der anderen Leiterplatte abgewandten Seite oder einer Mittenlage über eine Durchkontaktierung (Via) elektrisch leitend mit den entsprechenden Leiterbahnen auf der Oberfläche verbunden sind und die Verbindung der leitenden Flächen auf den einander zugewandten Oberflächen der Leiterplatten mittels einer Lötverbindung realisiert wird.Low-inductance compound according to claim 1, characterized in that in each case a conductive layer of each printed circuit board on the surface of the the other circuit board facing side and the conductor tracks on the side facing away from the other circuit board or a center layer via a via (electrically conductive) are connected to the corresponding conductor tracks on the surface and the connection of the conductive surfaces on the mutually facing surfaces of the circuit boards a solder joint is realized. Niederinduktive Verbindung nach Anspruch 2 dadurch gekennzeichnet, dass bei der Verbindung eines oder mehrerer Leiterbahnenpaare auf einer flexiblen Leiterplatte die bandförmigen Leiterbahnenpaare durch Aussparungen strukturiert werden, so dass die Flexibilität der Leitung erhöht wird.Lower-inductive compound according to claim 2 characterized characterized in that in the connection of one or more pairs of conductor tracks on a flexible circuit board through the band-shaped conductor pairs Recesses are structured so that the flexibility of the pipe elevated becomes.
DE200610048039 2006-10-09 2006-10-09 Low inductive connection for conductive strip, has connection of conductive surfaces placed on surfaces of boards that are facing each other by solder joint, where ratio of width of strips to distance of strips is greater than two Expired - Fee Related DE102006048039B3 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE200610048039 DE102006048039B3 (en) 2006-10-09 2006-10-09 Low inductive connection for conductive strip, has connection of conductive surfaces placed on surfaces of boards that are facing each other by solder joint, where ratio of width of strips to distance of strips is greater than two

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE200610048039 DE102006048039B3 (en) 2006-10-09 2006-10-09 Low inductive connection for conductive strip, has connection of conductive surfaces placed on surfaces of boards that are facing each other by solder joint, where ratio of width of strips to distance of strips is greater than two

Publications (1)

Publication Number Publication Date
DE102006048039B3 true DE102006048039B3 (en) 2008-04-17

Family

ID=39185242

Family Applications (1)

Application Number Title Priority Date Filing Date
DE200610048039 Expired - Fee Related DE102006048039B3 (en) 2006-10-09 2006-10-09 Low inductive connection for conductive strip, has connection of conductive surfaces placed on surfaces of boards that are facing each other by solder joint, where ratio of width of strips to distance of strips is greater than two

Country Status (1)

Country Link
DE (1) DE102006048039B3 (en)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19748689C2 (en) * 1997-11-04 2000-01-27 Trenew Electronic Gmbh Low induction connection
EP1134844A1 (en) * 2000-03-15 2001-09-19 Molex Incorporated Electrical connector with low-inductance terminal structure
DE10016942C2 (en) * 1999-04-08 2002-05-08 Yazaki Corp Tokio Tokyo Connector for connecting a first flexible printed circuit board to a second printed circuit board and arrangement comprising the same

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19748689C2 (en) * 1997-11-04 2000-01-27 Trenew Electronic Gmbh Low induction connection
DE10016942C2 (en) * 1999-04-08 2002-05-08 Yazaki Corp Tokio Tokyo Connector for connecting a first flexible printed circuit board to a second printed circuit board and arrangement comprising the same
EP1134844A1 (en) * 2000-03-15 2001-09-19 Molex Incorporated Electrical connector with low-inductance terminal structure

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
R119 Application deemed withdrawn, or ip right lapsed, due to non-payment of renewal fee