DE102006044442A1 - Sensor arrangement with a substrate and with a housing and method for producing a sensor arrangement - Google Patents

Abstract

The invention is based on a sensor arrangement (10) with a substrate (20) and with a housing (30), wherein the housing (30) substantially completely surrounds the substrate (20) in a first substrate region (21) (30) in a second substrate region (22) is provided at least partially open by means of an opening (33), wherein in the region of the opening (33) of the second substrate region (22) is provided projecting from the housing (30). The gist of the invention is that the substrate (20) is supported in a third substrate region (28) at least partially by a support (25) connected to the housing (30).

Description

State of the art

The The invention is based on a sensor arrangement with a substrate and with a housing after the genus of the main claim.

From the German patent application DE 199 29 026 A1 a method for producing a pressure sensor is known, in which a semiconductor pressure sensor is applied to a mounting portion of a line grid, the semiconductor pressure sensor is electrically connected to contact portions of the line grid, the line grid is inserted with the semiconductor pressure sensor in an injection mold and then the semiconductor pressure transducer in the injection mold with a Housing is surrounded by injection molding compound, wherein in the injection mold means are provided by which a pressure feed for the Halbleitdruckaufnehmer is omitted from the envelope and spray mass, wherein a stamp is arranged in the injection mold by a gap to the side facing away from the semiconductor pressure transducer side of the mounting portion. Alternatively, it is known sensors that need access to external media, such. As pressure sensors to pack in premold casings. For this purpose, first the housing mold is injected and subsequently the chip is mounted in the already prefabricated housing and contacted accordingly. Since so-called premold housing shapes are relatively expensive compared to standard mold housings, attempts have already been made by means of the cited published patent application to package pressure sensors in standard gold housings. For example, a partial area of the component surface is kept free for this purpose by a stamp or the like. A disadvantage of all existing housing forms is that the sensor element is at least partially embedded in a plastic compound. Due to thermal expansion, the characteristic of the sensor element can be strongly influenced. This is for example possible because different thermal expansion coefficients lead to stresses in the sensor element, which gives rise to faulty measurements or functional failures.

From the not previously published German patent application DE 10 2005 038 443 a sensor arrangement is known in which the active sensor region of the sensor arrangement can be better decoupled from voltage entries induced by the housing. For this purpose, the substrate has a first substrate region and a second substrate region, wherein an active sensor region, for example a pressure sensor membrane or the like, is located in the second substrate region and the second substrate region is provided projecting out of the housing. In the transition region between the first and the second substrate region, the housing has an opening in the second substrate region. Characterized in that the second substrate portion is provided protruding from the housing, the housing is designed so that the sensor or the substrate is embedded with the active sensor area only on one side, namely in the region of its first substrate region, in the molding compound or in the housing material ,

Disclosure of the invention

Advantages of the invention

The The invention is based on a sensor arrangement with a substrate and with a housing, where the housing the substrate substantially completely surrounds in a first substrate region, wherein the housing provided in a second substrate region at least partially open by means of an opening is, being in the area of the opening the second substrate region is provided projecting out of the housing. The essence of the invention is that the substrate in a third Substrate region at least partially by a carrier, the with the housing is connected, is worn. Advantageously, the substrate at assembly of the sensor assembly thus not so easily tilt. Advantageously, the proportion of the first substrate region on the entire Substrate opposite be reduced in the prior art. Furthermore, the support of the Substrate in the third substrate area supporting further assembly processes such as gluing the sensor array in the form of a semiconductor chip on a punched grid, wire mesh or carrier strip, and in the electrical contacting, for example by wire bonding.

An advantageous embodiment of the invention provides that the substrate in the third substrate region at least partially rests on the support. Advantageously, tilting of the substrate is prevented by the support, but at the same time a mechanical load on the substrate is minimized by forces acting on the support. Another advantageous embodiment of the invention provides that the substrate in the third substrate region is at least partially firmly connected to the carrier. It is particularly advantageous that the carrier is resilient. As a result, a mechanical load of the substrate is again kept as low as possible by forces acting on the carrier. An advantageous embodiment of the invention provides that the carrier is part of a line grid. The carrier is at least indirectly, connected via the line grid to the housing. Another advantageous embodiment provides that the carrier is directly connected to the housing. Advantageously, several carriers can be provided be, which secure the substrate in several places and also in several directions against tilting.

drawing

Show it 1 FIG. 2 is a schematic plan view of a first embodiment of a sensor arrangement in the non-prepublished prior art, FIG.

2 a schematic representation of a sectional view through the sensor assembly based on the section line AA 1 .

3 a schematic plan view of a second embodiment of a sensor arrangement in the not previously published prior art,

4 a schematic sectional view of the second embodiment of the sensor assembly based on the section line AA 3 .

5 a schematic plan view of a first sensor arrangement according to the invention,

6 a schematic representation of a sectional view through the first sensor arrangement according to the invention based on the section line AA 5 .

7 a schematic representation of the first sensor arrangement according to the invention in phantom, and

8th a schematic representation of a second sensor arrangement according to the invention in review.

embodiments

embodiments The invention are illustrated in the figures and in the description described below. The same reference numerals designate the same Elements, unless the description expressly deviates from them.

In 1 is a schematic plan view of a first embodiment of a sensor arrangement in the not previously published prior art shown. This sensor arrangement 10 includes a housing 30 and a substrate 20 , The substrate material is provided in particular as a semiconductor material or as a composite substrate, for example, of wafers of different or the same materials. In the following, the substrate material becomes a substrate 20 designated. The substrate 20 has a first area 21 and a second area 22 on, being in the second area 22 an active area 23 is shown separately, which serves for sensing or for detecting a size, by means of the sensor arrangement 10 to be measured. In the second substrate area 22 is in the transition region to the first substrate region 21 an opening 33 in the case 30 present, so that the second substrate area 22 can stand out. When using the active area 23 Detectable size is in particular such, which only by means of at least indirect contact between the second substrate region 22 or in particular the active area 23 and is detectable in a medium, not shown in the figures. The medium may be, for example, a gas whose pressure is measured by means of a pressure measuring membrane as the active region 23 to be measured. In this case, the medium, such as air or another gas, must access the area 23 , ie in particular to the pressure measuring membrane, have. This access to the active area 23 is realized in that the second substrate area 22 out of the case 30 protrudes and that the first substrate area 21 in the case 30 is embedded. In 1 is a section line AA drawn, the 2 with certain modifications a schematic representation of the sensor arrangement according to the invention 10 according to the section line AA from the 1 is. In 1 is still recognizable that from the housing 30 in particular connecting elements 31 , such as pins or Kontaktierungsbeinchen or the like., Stand out. However, it is also possible that no contacting elements 31 out of the case 30 stand out, but that on the top, the bottom and / or the lateral surfaces of the housing 30 Contact surfaces (not shown) are present, which serve a contacting of the device or the sensor arrangement, for example by means of a flip-chip mounting option, BGA housing or the like.

2 shows a schematic representation of a sectional view through the sensor arrangement based on the section line AA 1 , In 2 is the sensor arrangement 10 with the first substrate area 21 , the second substrate area 22 , the active area 23 , the housing 30 and the opening 33 shown. Additionally is in 2 Yet another specific exemplary embodiment indicated in which in addition to the substrate 20 another substrate 26 is present, which, for example, further circuit means for evaluating the signals of the active area 23 includes. This is the substrate 20 and the other substrate 26 by means of a connecting line 27 , in particular in the form of a bonding wire 27 connected with each other. Both the substrate 20 as well as the further substrate 26 is in the example of the arrangement of 2 on a so-called wire grid 25 which also serves as a leadframe 25 is designated, arranged or on the leadframe 25 glued or fastened in any other way.

In 3 is a second embodiment of a sensor arrangement 10 in the unpublished prior art shown in a schematic plan view. Again, the substrate has 20 the first substrate area 21 and the second substrate region 22 on, wherein the second substrate area 22 on the one hand the active area 23 and on the other hand at the opening 33 out of the case 30 protrudes. In contrast to the first embodiment, however, the housing 30 an extension area 35 on, essentially in the main plane of the substrate 20 around the second substrate area 22 extends around and thus the second substrate area 22 especially protects against mechanical effects. This protects the additional area 35 or extension range 35 of the housing the second substrate area 22 without mechanical forces, for example by different temperature coefficients or the like. On the second substrate area 22 and in particular to the active area 23 to exert the sensor arrangement. This is because the extension area 35 a distance to the second substrate region 22 complies with, this distance by means of the reference numeral 24 in the 3 is indicated. The 3 also has a section line AA, wherein the 4 essentially a sectional view (with certain deviations) along the section line AA from the 3 represents.

In 4 is the mentioned, schematic sectional view along the section line AA (with deviations) from the 3 shown, wherein the sensor arrangement 10 turn the substrate 20 , the first substrate area 21 , the second substrate area 22 , the active area 23 , the more substrate 26 , the extension area 35 and the wire mesh 25 or the leadframe 25 includes.

5 shows a schematic plan view of a first sensor arrangement according to the invention. Shown are first from the 3 known elements. The substrate 20 has a first substrate area 21 on, which is not visible here. The substrate 20 further includes a second substrate region 22 and, distinguished by a dashed-dotted line, a third substrate region 28 on, wherein the second and third substrate area 22 and 28 in the opening 33 of the housing 30 are arranged. The third substrate area 28 is at least partially by a carrier 25 supported. This carrier 25 can be part of the grid 25 be, as shown in this embodiment. The carrier 25 can be on or in the case 30 be arranged or attached. The 5 also has a section line AA, wherein the 6 essentially a sectional view along the section line AA from the 3 represents.

6 shows a schematic representation of a sectional view through a first sensor arrangement according to the invention based on the section line AA 5 , Visible is the support of the substrate 20 in the third substrate area 28 by means of the carrier 25 , The first substrate area 21 is designed much smaller than in the prior art. By the substrate 20 in the third substrate area 28 through the carrier 25 is still supported, but a tilting of the substrate 20 during assembly of the sensor arrangement 10 locked out.

7 shows a schematic representation of the first sensor arrangement according to the invention in review. The carrier 25 supports the substrate 20 in the third substrate area 28 in the entire overlap area by mere support of the substrate 20 on the carrier 25 , The substrate 20 and the carrier 25 are not firmly connected here. The carrier 25 is in this embodiment with the remaining wire grid 25 connected.

8th shows a schematic representation of a second sensor arrangement according to the invention in phantom. The carrier 25 points in the region of the third substrate region 28 two formations on and carries the substrate 20 in this area essentially only selectively. The carrier 25 is still with the substrate 20 in the third substrate area 28 firmly connected. The connection may be, for example, an adhesive connection. In addition, the wearer points 25 in the area of the opening 33 of the housing 30 a resilient structure, which is indicated schematically here. The resilient structure serves to mechanical forces the wearer 25 on the substrate 20 in the third substrate area 28 could exercise, minimize. The carrier 25 is in this embodiment only with the housing 30 and not with the wire mesh 25 connected. But he can alternatively also with the line grid 25 be connected.

Claims (5)

Sensor arrangement ( 10 ) with a substrate ( 20 ) and with a housing ( 30 ), the housing ( 30 ) the substrate ( 20 ) in a first substrate region ( 21 ) substantially completely surrounds, wherein the housing ( 30 ) in a second substrate region ( 22 ) at least partially by means of an opening ( 33 ) is opened, wherein in the region of the opening ( 33 ) the second substrate region ( 22 ) out of the housing ( 30 ) is provided, characterized in that the substrate ( 20 ) in a third substrate region ( 28 ) at least partially by a carrier ( 25 ) connected to the housing ( 30 ) is worn. Sensor arrangement ( 10 ) according to claim 1, characterized in that the substrate ( 20 ) in the third substrate region ( 28 ) at least partially on the support ( 25 ) rests. Sensor arrangement ( 10 ) according to claim 1, characterized in that the substrate ( 20 ) in the third substrate region ( 28 ) at least partially with the carrier ( 25 ) is firmly connected. Sensor arrangement ( 10 ) according to one of the preceding claims 1 to 3, characterized in that the carrier ( 25 ) is resilient. Sensor arrangement ( 10 ) according to one of the preceding claims, characterized in that the carrier ( 25 ) Is part of a wire grid.