DE102006011743A8 - Method for producing Peltier modules and Peltier module - Google Patents
Method for producing Peltier modules and Peltier module Download PDFInfo
- Publication number
- DE102006011743A8 DE102006011743A8 DE102006011743A DE102006011743A DE102006011743A8 DE 102006011743 A8 DE102006011743 A8 DE 102006011743A8 DE 102006011743 A DE102006011743 A DE 102006011743A DE 102006011743 A DE102006011743 A DE 102006011743A DE 102006011743 A8 DE102006011743 A8 DE 102006011743A8
- Authority
- DE
- Germany
- Prior art keywords
- peltier
- producing
- modules
- module
- peltier module
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
- 238000004519 manufacturing process Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/80—Constructional details
- H10N10/81—Structural details of the junction
- H10N10/817—Structural details of the junction the junction being non-separable, e.g. being cemented, sintered or soldered
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/01—Manufacture or treatment
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Ceramic Products (AREA)
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102006011743A DE102006011743A1 (en) | 2006-03-13 | 2006-03-13 | Peltier module manufacture method involves connecting Peltier components or chips to contact areas on ceramic substrates by means of terminal surfaces during production process, in which contact areas have metallic or sinter layers |
JP2008556650A JP4969589B2 (en) | 2006-03-01 | 2007-02-20 | Peltier element purification process and Peltier element |
CN2013102837069A CN103354271A (en) | 2006-03-01 | 2007-02-20 | Peltier module manufacture method and peltier module |
PCT/DE2007/000342 WO2007098736A2 (en) | 2006-03-01 | 2007-02-20 | Method for the production of peltier modules, and peltier module |
EP07721954.1A EP1989741B1 (en) | 2006-03-01 | 2007-02-20 | Method for the production of peltier modules |
US12/224,362 US8481842B2 (en) | 2006-03-01 | 2007-02-20 | Process for producing Peltier modules, and Peltier module |
RU2008138883/28A RU2433506C2 (en) | 2006-03-01 | 2007-02-20 | Method for peltier module fabrication, and also peltier module |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102006011743A DE102006011743A1 (en) | 2006-03-13 | 2006-03-13 | Peltier module manufacture method involves connecting Peltier components or chips to contact areas on ceramic substrates by means of terminal surfaces during production process, in which contact areas have metallic or sinter layers |
Publications (2)
Publication Number | Publication Date |
---|---|
DE102006011743A1 DE102006011743A1 (en) | 2007-09-20 |
DE102006011743A8 true DE102006011743A8 (en) | 2008-01-03 |
Family
ID=38374768
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE102006011743A Ceased DE102006011743A1 (en) | 2006-03-01 | 2006-03-13 | Peltier module manufacture method involves connecting Peltier components or chips to contact areas on ceramic substrates by means of terminal surfaces during production process, in which contact areas have metallic or sinter layers |
Country Status (1)
Country | Link |
---|---|
DE (1) | DE102006011743A1 (en) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102009046102A1 (en) * | 2009-10-28 | 2011-05-05 | Robert Bosch Gmbh | Method of manufacturing a seabed leg module |
DE102009046099A1 (en) * | 2009-10-28 | 2011-05-05 | Robert Bosch Gmbh | Method for producing a sea shelf module and corresponding sea shelf module |
DE102011010642A1 (en) * | 2011-02-09 | 2012-08-09 | Emitec Gesellschaft Für Emissionstechnologie Mbh | Coated thermoelectric element and a method for its production |
DE102012102090A1 (en) * | 2012-01-31 | 2013-08-01 | Curamik Electronics Gmbh | Thermoelectric generator module, metal-ceramic substrate and method for producing a metal-ceramic substrate |
FR2994336B1 (en) * | 2012-08-02 | 2016-10-21 | Valeo Systemes Thermiques | PROCESS FOR MANUFACTURING A THERMO ELECTRIC MODULE, IN PARTICULAR FOR GENERATING AN ELECTRICAL CURRENT IN A MOTOR VEHICLE, AND THERMO ELECTRIC MODULE OBTAINED BY SAID METHOD. |
DE102014203176A1 (en) * | 2014-02-21 | 2015-09-10 | MAHLE Behr GmbH & Co. KG | Thermoelectric device, in particular thermoelectric generator or heat pump |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19527867A1 (en) * | 1995-07-29 | 1997-01-30 | Schulz Harder Juergen | Metal substrate for electrical and/or electronic semiconductor circuit - has Peltier chip connected between respective overlapping metallisation structures of upper and lower ceramic layer |
US5929351A (en) * | 1997-04-23 | 1999-07-27 | Matsushita Electric Industrial Co., Ltd. | Co-Sb based thermoelectric material and a method of producing the same |
US6127619A (en) * | 1998-06-08 | 2000-10-03 | Ormet Corporation | Process for producing high performance thermoelectric modules |
US20020024154A1 (en) * | 2000-07-03 | 2002-02-28 | Reiko Hara | Thermoelectric module |
DE102005030591A1 (en) * | 2004-07-07 | 2006-01-26 | National Institute Of Advanced Industrial Science And Technology | Thermoelectric element and thermoelectric module |
-
2006
- 2006-03-13 DE DE102006011743A patent/DE102006011743A1/en not_active Ceased
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19527867A1 (en) * | 1995-07-29 | 1997-01-30 | Schulz Harder Juergen | Metal substrate for electrical and/or electronic semiconductor circuit - has Peltier chip connected between respective overlapping metallisation structures of upper and lower ceramic layer |
US5929351A (en) * | 1997-04-23 | 1999-07-27 | Matsushita Electric Industrial Co., Ltd. | Co-Sb based thermoelectric material and a method of producing the same |
US6127619A (en) * | 1998-06-08 | 2000-10-03 | Ormet Corporation | Process for producing high performance thermoelectric modules |
US20020024154A1 (en) * | 2000-07-03 | 2002-02-28 | Reiko Hara | Thermoelectric module |
DE102005030591A1 (en) * | 2004-07-07 | 2006-01-26 | National Institute Of Advanced Industrial Science And Technology | Thermoelectric element and thermoelectric module |
Also Published As
Publication number | Publication date |
---|---|
DE102006011743A1 (en) | 2007-09-20 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
OP8 | Request for examination as to paragraph 44 patent law | ||
8181 | Inventor (new situation) |
Inventor name: SCHULZ-HARDER, JUERGEN, DR., 91207 LAUF, DE |
|
8196 | Reprint of faulty title page (publication) german patentblatt: part 1a6 | ||
OP8 | Request for examination as to paragraph 44 patent law | ||
R002 | Refusal decision in examination/registration proceedings | ||
R003 | Refusal decision now final |
Effective date: 20120605 |