DE102005054177A1 - Sensormodul und Verfahren zum Herstellen desselben - Google Patents

Sensormodul und Verfahren zum Herstellen desselben Download PDF

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Publication number
DE102005054177A1
DE102005054177A1 DE102005054177A DE102005054177A DE102005054177A1 DE 102005054177 A1 DE102005054177 A1 DE 102005054177A1 DE 102005054177 A DE102005054177 A DE 102005054177A DE 102005054177 A DE102005054177 A DE 102005054177A DE 102005054177 A1 DE102005054177 A1 DE 102005054177A1
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Germany
Prior art keywords
upper side
sensor region
membrane
continuous casting
chip
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Granted
Application number
DE102005054177A
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DE102005054177B4 (de
Inventor
Marc Fueldner
Alfons Dehe
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Infineon Technologies AG
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Infineon Technologies AG
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Priority to DE102005054177A priority Critical patent/DE102005054177B4/de
Priority to US11/559,685 priority patent/US7994618B2/en
Publication of DE102005054177A1 publication Critical patent/DE102005054177A1/de
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Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/005—Electrostatic transducers using semiconductor materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00222—Integrating an electronic processing unit with a micromechanical structure
    • B81C1/0023—Packaging together an electronic processing unit die and a micromechanical structure die
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0257—Microphones or microspeakers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48153—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being arranged next to each other, e.g. on a common substrate
    • H01L2224/48195—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being arranged next to each other, e.g. on a common substrate the item being a discrete passive component
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/102—Material of the semiconductor or solid state bodies
    • H01L2924/1025—Semiconducting materials
    • H01L2924/10251—Elemental semiconductors, i.e. Group IV
    • H01L2924/10253—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
  • Pressure Sensors (AREA)

Abstract

Ein Sensormodul (51) weist ein Trägersubstrat (53) mit einer Unterseite und einer Oberseite, einen Sensorchip (57), der auf der Oberseite des Trägersubstrats (53) angeordnet ist und eine druckempfindliche aktive Fläche (61) aufweist, einen Signalverarbeitungs-Chip (59), der auf der Oberseite des Trägersubstrats (53) neben dem Sensorchip (57) angeordnet ist und mit dem Sensorchip (57) elektrisch leitend verbunden ist, ein durchgehendes Verguss-Material (71), das die Oberseite des Trägersubstrats (53) und den Signalverarbeitungs-Chip (59) bedeckt und mit den beiden in mechanischem Kontakt ist, wobei das Verguss-Material (71) eine Ausnehmung aufweist, die so angeordnet ist, dass das Verguss-Material (71) wenigstens einen Teil der aktiven Fläche (61) des Sensorchips (57) nicht bedeckt, auf.
DE102005054177A 2005-11-14 2005-11-14 Verfahren zum Herstellen einer Vielzahl von gehäusten Sensormodulen Active DE102005054177B4 (de)

Priority Applications (2)

Application Number Priority Date Filing Date Title
DE102005054177A DE102005054177B4 (de) 2005-11-14 2005-11-14 Verfahren zum Herstellen einer Vielzahl von gehäusten Sensormodulen
US11/559,685 US7994618B2 (en) 2005-11-14 2006-11-14 Sensor module and method for manufacturing same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102005054177A DE102005054177B4 (de) 2005-11-14 2005-11-14 Verfahren zum Herstellen einer Vielzahl von gehäusten Sensormodulen

Publications (2)

Publication Number Publication Date
DE102005054177A1 true DE102005054177A1 (de) 2007-05-16
DE102005054177B4 DE102005054177B4 (de) 2011-12-22

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US (1) US7994618B2 (de)
DE (1) DE102005054177B4 (de)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2055668A3 (de) * 2007-10-30 2011-03-09 STMicroelectronics Srl Herstellungsverfahren einer elektronischen Vorrichtung einschließlich einer umspritzten MEMS-Vorrichtung
DE102011084582B3 (de) * 2011-10-17 2013-02-21 Robert Bosch Gmbh Mikromechanische Sensorvorrichtung mit Moldverpackung und entsprechendes Herstellungsverfahren
US9448130B2 (en) 2013-08-31 2016-09-20 Infineon Technologies Ag Sensor arrangement
DE102016208325A1 (de) * 2016-05-13 2017-05-04 Robert Bosch Gmbh Mikromechanisches Bauteil und Verfahren zum Verpacken eines Substrats mit einer mindestens eine piezoelektrische Schicht umfassenden mikroelektromechanischen Mikrofonstruktur
DE102017123552B3 (de) 2017-10-10 2018-11-22 Sick Ag Verfahren zur Herstellung von optoelektronischen Sensoren, insbesondere von Miniatursensoren
US11192777B2 (en) 2010-07-13 2021-12-07 Infineon Technologies Ag MEMS sensor package systems and methods

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US8148808B2 (en) * 2007-08-13 2012-04-03 Lv Sensors, Inc. Partitioning of electronic packages
US7617599B2 (en) * 2007-12-05 2009-11-17 Memsic, Inc. Sensor packaging method for a human contact interface
DE102008021091A1 (de) * 2008-04-28 2009-10-29 Epcos Ag Drucksensor
WO2010113712A1 (ja) * 2009-03-31 2010-10-07 アルプス電気株式会社 容量型湿度センサ及びその製造方法
US8375799B2 (en) * 2010-12-10 2013-02-19 Honeywell International Inc. Increased sensor die adhesion
US9365414B2 (en) * 2014-04-21 2016-06-14 Freescale Semiconductor, Inc. Sensor package having stacked die
US10163660B2 (en) 2017-05-08 2018-12-25 Tt Electronics Plc Sensor device with media channel between substrates
US10285275B2 (en) 2017-05-25 2019-05-07 Tt Electronics Plc Sensor device having printed circuit board substrate with built-in media channel

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WO2002045463A2 (en) * 2000-11-28 2002-06-06 Knowles Electronics, Llc Miniature silicon condenser microphone and method for producing same
DE10303263A1 (de) * 2003-01-28 2004-08-05 Infineon Technologies Ag Sensormodul

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2055668A3 (de) * 2007-10-30 2011-03-09 STMicroelectronics Srl Herstellungsverfahren einer elektronischen Vorrichtung einschließlich einer umspritzten MEMS-Vorrichtung
US11192777B2 (en) 2010-07-13 2021-12-07 Infineon Technologies Ag MEMS sensor package systems and methods
DE102011084582B3 (de) * 2011-10-17 2013-02-21 Robert Bosch Gmbh Mikromechanische Sensorvorrichtung mit Moldverpackung und entsprechendes Herstellungsverfahren
US9448130B2 (en) 2013-08-31 2016-09-20 Infineon Technologies Ag Sensor arrangement
DE102014112495B4 (de) 2013-08-31 2019-07-25 Infineon Technologies Ag Sensoranordnung und Verfahren zu dessen Herstellung
DE102016208325A1 (de) * 2016-05-13 2017-05-04 Robert Bosch Gmbh Mikromechanisches Bauteil und Verfahren zum Verpacken eines Substrats mit einer mindestens eine piezoelektrische Schicht umfassenden mikroelektromechanischen Mikrofonstruktur
DE102017123552B3 (de) 2017-10-10 2018-11-22 Sick Ag Verfahren zur Herstellung von optoelektronischen Sensoren, insbesondere von Miniatursensoren

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Publication number Publication date
US20070126130A1 (en) 2007-06-07
DE102005054177B4 (de) 2011-12-22
US7994618B2 (en) 2011-08-09

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