DE102005051615A1 - Anti-pressure linear circuit board manufacture for making circuit board, comprises providing a first circuit board, and cutting the first circuit board to form cut grooves - Google Patents

Anti-pressure linear circuit board manufacture for making circuit board, comprises providing a first circuit board, and cutting the first circuit board to form cut grooves Download PDF

Info

Publication number
DE102005051615A1
DE102005051615A1 DE200510051615 DE102005051615A DE102005051615A1 DE 102005051615 A1 DE102005051615 A1 DE 102005051615A1 DE 200510051615 DE200510051615 DE 200510051615 DE 102005051615 A DE102005051615 A DE 102005051615A DE 102005051615 A1 DE102005051615 A1 DE 102005051615A1
Authority
DE
Germany
Prior art keywords
circuit board
cut grooves
cutting
comprises providing
pressure linear
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE200510051615
Other languages
German (de)
Inventor
Chin-Jung Chen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rossmax International Ltd
Original Assignee
Rossmax International Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rossmax International Ltd filed Critical Rossmax International Ltd
Priority to DE200510051615 priority Critical patent/DE102005051615A1/en
Publication of DE102005051615A1 publication Critical patent/DE102005051615A1/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0268—Marks, test patterns or identification means for electrical inspection or testing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09081—Tongue or tail integrated in planar structure, e.g. obtained by cutting from the planar structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10151—Sensor

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Measuring Fluid Pressure (AREA)

Abstract

Anti-pressure linear circuit board manufacture comprises providing a first circuit board (2), and cutting the first circuit board to form cut grooves (21). The cut grooves define the second circuit board. The second circuit board is connected to the first circuit board via a connection portion. The first circuit board includes a main circuit. The second board includes a calibrated pressure sensor and an OP amplifier. The method includes precisely calibrating the pressure sensor and the OP amplifier. The main circuit on the first circuit board is electrically connected to the pressure sensor and the OP amplifier on the second circuit board via printed circuits on the connection portion. An independent claim is included for anti-pressure linear circuit board.
DE200510051615 2005-10-27 2005-10-27 Anti-pressure linear circuit board manufacture for making circuit board, comprises providing a first circuit board, and cutting the first circuit board to form cut grooves Withdrawn DE102005051615A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE200510051615 DE102005051615A1 (en) 2005-10-27 2005-10-27 Anti-pressure linear circuit board manufacture for making circuit board, comprises providing a first circuit board, and cutting the first circuit board to form cut grooves

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE200510051615 DE102005051615A1 (en) 2005-10-27 2005-10-27 Anti-pressure linear circuit board manufacture for making circuit board, comprises providing a first circuit board, and cutting the first circuit board to form cut grooves

Publications (1)

Publication Number Publication Date
DE102005051615A1 true DE102005051615A1 (en) 2007-05-16

Family

ID=37982512

Family Applications (1)

Application Number Title Priority Date Filing Date
DE200510051615 Withdrawn DE102005051615A1 (en) 2005-10-27 2005-10-27 Anti-pressure linear circuit board manufacture for making circuit board, comprises providing a first circuit board, and cutting the first circuit board to form cut grooves

Country Status (1)

Country Link
DE (1) DE102005051615A1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009153094A1 (en) * 2008-06-20 2009-12-23 Robert Bosch Gmbh Arrangement for decoupling stress in a substrate with a chip
EP2135839A2 (en) * 2008-06-20 2009-12-23 Garmin Ltd. Method and apparatus for improving measurement accuracy of mems devices

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009153094A1 (en) * 2008-06-20 2009-12-23 Robert Bosch Gmbh Arrangement for decoupling stress in a substrate with a chip
EP2135839A2 (en) * 2008-06-20 2009-12-23 Garmin Ltd. Method and apparatus for improving measurement accuracy of mems devices
EP2135839A3 (en) * 2008-06-20 2013-10-16 Garmin Switzerland GmbH Method and apparatus for improving measurement accuracy of mems devices

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Legal Events

Date Code Title Description
OP8 Request for examination as to paragraph 44 patent law
R016 Response to examination communication
R119 Application deemed withdrawn, or ip right lapsed, due to non-payment of renewal fee

Effective date: 20120501