DE102005038522A1 - Laser cutting machine is used to separate electronic circuit boards that are moved by linear motors - Google Patents

Abstract

The system has a housing in which there is a laser (12) with an optical system (14) to focus the beam onto a specific location. The electronic circuit board is placed on a movable carriage that is moved in a controlled way by linear motors under the cutting laser beam. The motion is controlled using keyboard entries (6) and shown on a display (8).

Description

The The invention relates to a separating device for planar workpieces, in particular for separating from stocked Printed circuit boards.

With equipped electronic components Printed circuit boards are usually manufactured by a protruding printed circuit board substrate with electronic Components assembled is prepared so that a lot of printed circuit boards through this which are then suitably linked to that Substrate separated, d. H. to be isolated. This separation takes place in a known manner by mechanical machining, in particular by a milling cutter or by a rotating saw blade, a grinding or cutting disc, which the expansive assembled printed circuit board substrate through separating mutually orthogonal separating cuts into mostly rectangular printed circuit boards, which then, without requiring further processing, further installed become.

It was inventively found that execution such a separation process for areal Workpieces, in particular for PCBs are accompanied by a mechanical stress, the areal Workpiece, in particular, the circuit board, can affect. Especially with printed circuit boards that are sensitive with electrically conductive and electrically insulating coatings may be high-frequency mechanical loads have a damaging effect. Another Strain, especially for printed circuit boards extremely dangerous can be, is the strong heat input associated with mechanical processing into the workpiece. This allows electrically conductive connections damaged and electronic components destroyed become.

outgoing From this realization, the present invention has the object basis, a separator for sheet-like workpieces, in particular for separating from stocked Circuit boards, to create, in which the disadvantages described above not occur, so with a gentle, but highly accurate and economically feasible Separate areal workpieces possible is.

These The object is achieved by a separator for areal Workpieces, in particular for separating populated printed circuit boards, with a Laser separation device with a stationary laser source and an in the workpiece level stationary Separation point and with two feeders for feeding of the workpiece to the separation point and the process of the workpiece with respect to the separation point accordingly to be carried out Separating cut, wherein the respective feeding device a mobility at the workpiece level by means of a linear motor drive has.

It is thus according to the invention of mechanical working cutting separators, and instead a laser separation device is used. Essential it is that working with a stationary laser source, that the laser source itself does not have a high acceleration and delays Movement must be suspended. Starting from this stationary laser source The laser beam is transformed by laser optics into a cutting head guided, from where the laser beam directly on the sheet-like workpiece, in particular in the form of a stocked PCB, which is located at the separation point, is passed.

With Cutting head is the end of the laser optics adjacent to the separation point denotes where the laser beam leaves the laser optics and from there directly meets the separation point. If present from the term separation point is mentioned, this refers on the one hand a position for the areal Workpiece, in which a processing by the laser beam is possible; the term is So to understand in terms of a machining position for the workpiece. On the other hand, of course, the term also refers to the point of impact of the laser beam on the workpiece.

to execution the separation processing two supply devices are provided according to the invention, which the workpiece in the workpiece level accordingly to be carried out Separation cut procedure. The laser beam is stationary, d. H. he falls in particular in the Z direction to the workpiece level, while the workpiece according to the to be carried out Separating cut in the X and Y direction is moved.

According to an advantageous development, the respective feeding device each comprises a linear motor drive for movability in an X-direction and in a Y-direction. The use of electric linear motor drive technology in the feeders ensures extreme speed, high acceleration and deceleration torques, so that overall a different drive mechanisms of superior, economical and in particular wear-free drive for the feeders is realized. It should be noted at this point, however, that an otherwise inventively designed separating device in principle with other drive systems, such. B. could be formed with a toothed belt drive or spindle drive. This drive mecha can also be used; However, they are inferior in terms of speed and economy of electric linear motor drive. It should also be pointed out that the device according to the invention could be designed not only as a separating device but alternatively as a joining device or as a marking or engraving device, which in the case of the invention is also regarded as being included in the present invention.

In Further embodiment of the invention has the respective feeding device depending on a cross table. This means that every feeding device a stationary axle carrying a carriage, wherein on this slide another axle is attached, which in turn one the workpiece carrying carriage moves. The first axis thus forms a stationary longitudinal guide means, on which the first carriage controlled by a linear motor drive is movable. On this first slide is in turn firmly arranged the second linear axis, which in turn is a longitudinal guide for the second carriage forms.

To a further preferred embodiment the separating device according to the invention are the feeding devices formed with stationary and mutually parallel X-axes and arranged. This opens the possibility a space-saving realization of the feeding system. It proves it be advantageous if both feeding devices between a respective loading and Unloading station and the separation point are movable. After this According to the idea of the invention, each feeding device should have its own loading and unloading station. These could be different, for example Side of the separator may be provided, where it is instead proves to be advantageous when they are substantially adjacent to each other are arranged, which by the previously discussed arrangement with parallel mutually extending X-axes can be realized in an advantageous manner.

In Further development of the invention is proposed, the feed system in such a way that the respective feed device in a Y-direction of the separation point is movable away in an intermediate position and from there in an X-direction in the loading and unloading station movable is. This opens the possibility, that by a relatively short Travel in the Y direction a workpiece to be machined quickly to the separation point (processing position) or from the separation point can be spent away, leaving a new workpiece immediately then fed to the separation point (processing position) can. In development of this inventive concept, it turns out as advantageous that the feeders are formed and arranged so that both feeders can simultaneously assume their respective intermediate position. such Falls is the time delay with a workpiece change at the separation point (Machining position) to a minimum.

It would be z. B. conceivable that the respective intermediate position in such Distance from the separation point (machining position) is provided that the following workpiece to the separation point can be spent as soon as the previous workpiece in the Intermediate position was brought. However, this means that a corresponding greater Distance between the feeders must be provided, which is not always desirable. After one According to further inventive concept, the feeding devices are arranged that one feed device from the intermediate station to the separation point (processing position) is movable as soon as the other feeder from its intermediate position spent in the loading and unloading position. In this case Is it possible, a very small distance between the two feeders, in particular their X-axes from each other, and thus to realize an overall very small space. Also the stroke length The Y-axis can then advantageously be kept short. Due to the Use of the linear motor technology is the time delay (dead time), the it follows that the one feeder first from the Intermediate position in their loading and unloading station, before the other feeder can be moved to the separation point, low. As already mentioned, will worked here with high accelerations and delays, without that it thereby to shock loads comes.

To In an alternative inventive idea, it would also be conceivable to use two separating points, so to preside over two machining positions; the separator would be then designed so that the feeders between a respective loading and Unloading station and assigned to each feeder respective separation point are movable and that then a cutting head the laser optics between the two separation points of the feeders is movable. Again, in this case, the concept of a stationary Laser source held; So it's just an exit side Range of laser optics, initially referred to as a cutting head was trained adjustable.

Another advantage of the separating device according to the invention is the fact that compared to cutting processes, where coarse and fine dust or chips of the workpiece or printed circuit board substrate is produced by milling, grinding or sawing, residues occur to a lesser extent. Especially electronic components are very sensitive to pollution. To According to a preferred embodiment of the separating device according to the invention, the separating point is assigned a suction device which removes particles, dust and abrasion arising during separation from the separating point. In a further embodiment of this inventive idea, the suction device is focused on the separation point. In a further development of this inventive idea, conducting means for the suction flow are provided in an advantageous manner and directed to the separation point. Such guiding means can be realized, for example, on a workpiece carrier of the feeding device and comprise conducting means in the broadest sense. In particular, a plurality of such guide means may be provided on a workpiece carrier, which then communicate successively with the suction device.

It proves to be further advantageous that the respective feeding device having a workpiece carrier or in turn, on which the workpiece or fixed the isolated pieces resulting from the separation process can be arranged, before the separation, during the Singling and after singling, to prevent the isolated workpieces are arranged undefined after the separation process. A respective one Workpiece carrier is So on the workpiece substrate to be separated before the separation, but also on the geometry of the separation process resulting individual workpieces customized.

In Advantageously, the workpiece carrier for this purpose perpendicular to the workpiece plane Have extended holding means. This can be for example around mandrels or support pins acting, for example, in openings in the workpiece engage and thereby gravity supported in a defined position to the separator, as mentioned before, during and after the separation process. Also other holding means, in particular a bias on the workpiece causing holding means for workpiece positioning and fixation can be provided.

To Another inventive concept is the workpiece carrier on a fork-shaped or U-shaped receptacle the feeder arranged so that it is accessible at the separation point from below. In this way, from the bottom of the stationary separation point a Suction device are directed, which then the workpiece carrier of subjected to negative pressure at the bottom. The workpiece carrier itself can be the furthest Meaning latticed be formed, or it may have individual openings, in particular can, as previously mentioned, conductive agent for the Suction air flow can be provided, which then between the suction device and leading to Separating cut in the workpiece or printed circuit board substrate are arranged. This way you can a highest effective extraction of any resulting from the separation process Particles are ensured. This suction can be designed so effectively be that one subsequent Cleaning the separated workpieces or printed circuit boards not more is needed.

Especially can the workpiece carrier a Have base plate on which the holding means for the workpiece arranged are. Advantageously, the separating device is designed such that that the workpiece carrier and the areal Workpieces, in particular Printed circuit boards, arranged in a horizontal plane during processing are. If so lets Gravity for positioning and fixing of the workpieces or Use printed circuit board substrates.

The mentioned Holding means and workpiece carriers can in be formed in any way, they are after another Inventive idea formed such that the workpiece at a distance from 0 mm to 70 mm, in particular from 0 mm to 50 mm, in particular from 2 mm to 20 mm, in particular from 5 to 20 mm from the base plate spaced is. This is especially true with regard to electronic components stocked Circuit boards advantageous because not infrequently the electronic components in Make the thickness direction of the printed circuit board very high. While the workpiece or printed circuit board substrate is supported against the holding means can The structure then in the space between the PCB and base plate of the workpiece carrier hineinerstrecken.

As already mentioned, the workpiece carrier can openings have, through which a suction air flow from the separation point towards the suction device, wherein the openings at the same time conducting means for the Absaugstrom can form. In particular, you can sleeve-shaped conductive agent be used.

It would be conceivable that the stationary one Laser source is arranged stationarily such that the laser beam directly on the separation point (processing position) occurs. In contrast, proves However, it is advantageous if the laser separation device a includes laser optics subsequent to the laser source, which directs the laser beam from the laser source to the separation point. For example then the laser source in the horizontal direction in the separator can be arranged, and the laser beam is transmitted through the laser optics and over deflections directed to the separation point, where he then advantageously starting from the separation point end of the laser optics (cutting head) substantially extends in the vertical direction. In such case, the laser optics includes Beam deflection means to the laser beam from the horizontal direction to deflect in vertical direction and lead to the separation point.

To Another particularly advantageous concept of the invention is a the cutting point adjacent cutting head of the laser optics from the workpiece level, in particular in a direction perpendicular thereto (Z-direction) wegbewegbar, so that the cutting head or the laser optics not with elevations on Workpiece, in particular with electronic components on the printed circuit board, in the execution the cutting process collides. The movability of the cutting head in the Z direction includes a distance of advantageously up to 100 mm, in particular up to 70 mm, in particular up to 50 mm and more particularly up to 30 mm. It is preferably used linear motor drive technology.

Of the Travel of the feeders is in an X direction 70-250 cm, especially 70-200 cm and further especially 70-150 cm and in a Y direction 30-100 cm, in particular 30-70 cm and further especially 30-50 cm. An exemplary mobility is 104 cm in the X direction and 41 cm in the Y direction.

A Separating device according to the invention previously described type leaves in an advantageous manner in a cabin with external dimensions in the X direction from 90 cm to 150 cm, especially from 90 cm to 130 cm, and in the Y direction from 120 cm to 180 cm, in particular of 120 to 160 cm realize. A preferred dimension is included 110 cm (X-direction) and 144 cm (Y direction).

Further Features, details and advantages of the invention will become apparent the attached claims and from the drawings and description below a preferred embodiment the separating device according to the invention. In the drawing shows:

1 a perspective view of a surrounding area of a cabin separating device for planar workpieces;

2 to 8th the separator (without cab) in different working positions;

9 a perspective view (partially) of a feeding device of the separator after 1 ;

10 a workpiece carrier with a printed circuit board substrate;

11 after the workpiece carrier 10 without PCB substrate and

12 a perspective view of the cutting head of the laser cutting device.

1 a perspective view of one of a cabin 2 surrounded separating device 4 for sheet-like workpieces, in particular for separating populated printed circuit boards, with an input unit 6 and a display unit 8th outside at the cabin 2 attached and in the direction of the double arrow 10 are pivotable. It can be seen inside the cabin 2 a stationary horizontally arranged laser source 12 with a laser optic 14 with beam deflection means 16 which directs the laser beam to an exit end of the laser optics 14 , the cutting head 18 passes. From the cutting head 18 From the beam emerges in a substantially vertical direction and strikes the horizontally arranged workpiece 20 (hereinafter referred to as circuit board 22 designated). The relevant position of the circuit board 22 where a laser cutting processing is feasible, is hereinafter separation point 24 called.

The others 2 to 8th show the separator 4 without cabin 2 , You can now see two feeders 26 and 28 for to be separated or isolated circuit board substrates for the formation of ready-to-use individualized printed circuit boards 30 (S. 10 ).

The 2 to 8th illustrate different positions of the separator 4 , the successive processing of different workpieces or printed circuit boards 22 clarify and will be discussed in detail below.

Furthermore, it is off 2 one of the separation point 24 assigned and focused on this suction device 32 seen from below towards the separation point 24 extends.

Previously, however, based on the 9 the structure of a respective feeding device 26 . 28 to be discribed. 9 shows a perspective view of the feeder 28 in the form of a so-called cross table 34 is trained.

This includes a first fixed axis extending in an X direction 36 , which is a linear guide for a first slide 38 forms, which is thus movable in an X direction. The first sled 38 carries a second linear axis 40 , in turn, a longitudinal guide means for a second carriage 42 forms, which is perpendicular to the X direction horizontally along the second linear axis in a Y-direction reciprocable. This second carriage comprises a lying in a horizontal plane U-shaped receptacle 44 for a workpiece carrier 46 , From the U-shaped recording 44 is a free-running thigh 48 recognizable, that of a gusset plate 49 is supported. If the second sled 42 in the 9 in Y-direction is extended to the left, so is the workpiece carrier 46 thus accessible from below.

The mobility of the first carriage 38 opposite the fixed X-axis 36 and the mobility of the second carriage 42 opposite the second Y-axis 40 via an electric linear motor drive 50 , with which high accelerations and decelerations can be realized bumplessly and thus high speeds both during cutting and when moving the printed circuit boards 22 to the separation point 24 towards or from the separation point 24 can be reached away.

The feeding devices 26 . 28 are how out 2 to 8th visible, with their X-axes 36 arranged parallel and at a relatively small distance from each other. 2 shows a processing state in which the feeding device shown on the right 28 with her workpiece carrier 46 in a loading and unloading position 52 located. The other feeder 26 is in an intermediate position 54 spaced in the X direction from its loading and unloading position. 3 shows that the feeder 26 from the in 2 illustrated intermediate position 54 slightly to the right in the Y direction. An assumed homing position of the workpiece carrier 46 is now at the separation point 24 , From this Referenzierungsposition starting the separation processing on the circuit board 22 executed. In this case, the second carriage 42 the feeder 26 in the Y direction to the in 4 be moved apparent position. The first sled 38 can be moved even further away from the loading and unloading position in the X direction ( 5 ), so that the entire workpiece carrier 46 or the entire circuit board 22 can be acted upon by the vertical laser beam.

6 shows a state in which the feeding device 26 or their second carriage 42 starting from the in 5 shown position in the Y direction was moved to the left. However, the feeder is still at the separation point, ie in a processing position. 7 shows the feeder 26 or the second carriage and the workpiece carrier together with the printed circuit board turn in an intermediate position 54 outside the separation point. It is now a workpiece carrier change before. Starting from the position in 7 becomes the feeder 26 towards their loading and unloading position 56 (X direction) moves, and the feeder 28 gets out of its loading and unloading position 52 in their intermediate position 58 spent. From there, the second sled can 42 the feeder 28 in the Y direction to the separation point 24 be moved.

The 10 and 11 show in perspective an exemplary embodiment of the workpiece carrier 46 with a circuit board 22 by cutting into a number of printed circuit boards 30 should be isolated. The workpiece carrier 46 includes a base plate 62 with a multitude of openings 64 that with straight sleeve-shaped sections 66 interact. These sleeve-shaped sections 66 extend perpendicular to the plane of the base plate 62 and end a few millimeters below a plane 68 by a variety of holding means 70 , which is also perpendicular to the base plate 62 extend away, is formed. The level 68 defines a support plane for the circuit board 22 , like this 10 is apparent. One also recognizes holding means 72 with thorn-shaped projections 74 that are in openings 76 the circuit boards 30 extend into it and keep it in its intended position after separation.

One recognizes from the representation of the printed circuit board 22 in 10 further, that the printed circuit board substrate along the black lines 78 already has dividing slots. A respective printed circuit board 30 So it is only through the apparent bar-shaped connections 80 held. As part of the separation process, these web-shaped connections 80 separated. Immediately below opens the sleeve-shaped section 66 , In this way, therefore, an effective extraction of accumulating particles is possible. However, it goes without saying that a separating cut which is elongate in the plane direction can also be carried out by means of laser cutting processing. In such a case, it would prove advantageous if elongate slit-shaped guide means were provided which with the 2 to 8th apparent suction device 32 interact.

It would also be conceivable that the base plate 62 is formed with a plurality of openings or in particular lattice-shaped, so that a strong suction air flow is able to dissipate all accumulating particles in the separation process safely.

12 shows a perspective view of the cutting head 18 the laser separator. This cutting head 18 comprises a sleeve-shaped telescopic shielding means 82 for the laser beam running in the Z direction (see arrow). The laser beam occurs at the bottom 84 from the cutting head 18 in Z direction.

The entire cutting head 18 is about another electric linear motor drive 86 Movable up and down in the Z direction, that is, the cutting head 18 can be lifted from the workpiece level in the Z direction. In this way it can be prevented during the process of the workpiece that the cutting head 18 with its lower end 84 With a structure of the workpiece, in particular an electronic component of the workpiece collided.

Claims (28)

Separating device ( 4 ) for planar workpieces, in particular for separating populated printed circuit boards, with a laser separation device with a stationary laser source ( 12 ) and a stationary in the workpiece plane separation point ( 24 ) and with two feeders ( 26 . 28 ) for feeding the workpiece to the separation point ( 24 ) and the process of the workpiece with respect to the separation point ( 24 ) according to the separating cut to be carried out, wherein the respective feeding device ( 26 . 28 ) a movability in the workpiece plane by means of a linear motor drive ( 50 ) having. Separating device according to claim 1, characterized in that the respective feeding device ( 26 . 28 ) each a linear motor drive ( 50 ) for traversability in an X direction and in a Y direction. Separating device according to claim 1 or 2, characterized in that the respective feeding device ( 26 . 28 ) each a cross table ( 34 ) having. Separating device according to claim 1, 2 or 3, characterized in that the feeding devices ( 26 . 28 ) with stationary and mutually parallel X-axes ( 36 ) are arranged. Separating device according to one or more of the preceding claims, characterized in that the feeding devices ( 26 . 28 ) between a respective loading and unloading station ( 56 . 52 ) and the separation point ( 24 ) are movable. Separating device according to claim 5, characterized in that the respective feeding device ( 26 . 28 ) in a Y-direction from the separation point ( 24 ) into an intermediate position ( 54 . 58 ) and from there in an X-direction in the loading and unloading station ( 52 . 56 ) is movable. Separating device according to claim 6, characterized in that the feeding devices ( 26 . 28 ) are arranged so that both feeders simultaneously their respective intermediate position ( 54 . 58 ) can take. Separating device according to claim 6 or 7, characterized in that the feed devices are arranged so that the one feed device ( 26 . 28 ) from the intermediate position ( 54 . 58 ) to the separation point ( 24 ) is movable as soon as the other feeder ( 28 . 26 ) from its intermediate position ( 58 . 54 ) into the loading and unloading station ( 52 . 56 ) is spent. Separating device according to one of claims 1-5, characterized characterized in that the feeding devices between a respective loading and unloading station and each one feeder assigned respective separation point are movable and that a Cutting head of the laser optics between the two separation points of the Feeding devices movable is. Separating device according to one or more of the preceding claims, characterized in that the separation point ( 24 ) a suction device ( 32 ) is assigned, which dissipates particles, dust and abrasion arising during separation from the separation point. Separating device according to claim 10, characterized in that the suction device ( 32 ) to the separation point ( 24 ) is focused. Separating device according to Claim 11, characterized in that conducting means are provided for the suction stream and are applied to the separating point ( 24 ) are directed. Separating device according to one or more of the preceding claims, characterized in that the respective feeding device ( 26 . 28 ) a workpiece carrier ( 46 ) or in turn carries, on which the workpiece or the resulting separation from the separated pieces before, during and after the separation processing can be arranged fixed in a predetermined position. Separating device according to claim 13, characterized in that the workpiece carrier ( 46 ) extending perpendicular to the workpiece plane holding means ( 70 . 72 ) having. Separating device according to claim 13 or 14, characterized in that the workpiece carrier ( 46 ) on a forked receptacle ( 44 ) of the feeding device ( 26 . 28 ) is arranged so that it is accessible from below. Separating device according to claim 13, 14 or 15, characterized in that the workpiece carrier ( 26 . 28 ) a base plate ( 62 ), on which the holding means ( 70 . 72 ) are arranged for the workpiece. Separating device according to one of claims 13-16, characterized in that the workpiece carrier ( 46 ) Holding means ( 70 . 72 ), which are formed such that the workpiece at a distance of 0 mm-70 mm, in particular from 0 mm-50 mm, in particular from 2 mm-20 mm, in particular from 5 mm-20 mm from the base plate ( 62 ) is spaced. Separating device according to one of claims 13-17, characterized in that the workpiece carrier ( 46 ) Openings ( 64 ), through which a suction air flow from the separation point ( 24 ) to the suction device ( 32 ). Separating device according to claim 18, characterized in that the openings ( 64 ) at the same time form the guiding means for the suction flow. Separating device according to claim 18, characterized the guide means are sleeve-shaped or a slit-shaped limit elongated opening. Separating device according to one or more of the preceding claims, characterized in that the laser separation device is a laser optics ( 14 ) comprising the laser beam from the laser source ( 12 ) to the separation point ( 24 ). Separating device according to one or more of the preceding claims, characterized in that the stationary laser source ( 12 ) is arranged horizontally. Separating device according to claim 22, characterized in that the laser optics ( 14 ) Beam deflection means ( 16 ) to deflect the laser beam from the horizontal direction in the vertical direction and the separation point ( 24 ). Separating device according to one of claims 21-23, characterized in that one of the separation point ( 24 ) adjacent cutting head ( 18 ) of the laser optics ( 14 ) can be moved away from the workpiece plane, in particular in a Z-direction perpendicular thereto, so that it does not collide with elevations on the workpiece, in particular with electronic components of the printed circuit board. Separating device according to claim 24, characterized in that the travel path of the cutting head ( 18 ) in the Z direction up to 100 mm, in particular up to 70 mm, in particular up to 50 mm and more particularly up to 30 mm. Separating device according to one or more of the preceding claims, characterized in that the travel path of the feed devices ( 26 . 28 ) in an X direction is 70-250 cm, in particular 70-200 cm and more particularly 70-150 cm. Separating device according to one or more of the preceding claims, characterized in that the travel path of the feed devices ( 26 . 28 ) in a Y direction is 30-100 cm, in particular 30-70 cm and more particularly 30-50 cm. Separating device according to one or more of the preceding claims, characterized in that the outer dimensions of a cabin surrounding the separating device ( 2 ) in the X direction from 90 cm to 150 cm, in particular from 90 cm to 130 cm, and in the Y direction from 120 cm to 180 cm, in particular from 120 to 160.