DE102005056269A1 - Separation unit for use on flat workpieces, eg circuit boards, comprises a laser with a stationary source and a separation point - Google Patents

Separation unit for use on flat workpieces, eg circuit boards, comprises a laser with a stationary source and a separation point Download PDF

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Publication number
DE102005056269A1
DE102005056269A1 DE200510056269 DE102005056269A DE102005056269A1 DE 102005056269 A1 DE102005056269 A1 DE 102005056269A1 DE 200510056269 DE200510056269 DE 200510056269 DE 102005056269 A DE102005056269 A DE 102005056269A DE 102005056269 A1 DE102005056269 A1 DE 102005056269A1
Authority
DE
Germany
Prior art keywords
laser
separation
circuit boards
stationary source
separation point
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE200510056269
Other languages
German (de)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
GAS AUTOMATION GmbH
Original Assignee
GAS AUTOMATION GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE102005038522A external-priority patent/DE102005038522A1/en
Application filed by GAS AUTOMATION GmbH filed Critical GAS AUTOMATION GmbH
Priority to DE202005021341U priority Critical patent/DE202005021341U1/en
Priority to DE200510056269 priority patent/DE102005056269A1/en
Publication of DE102005056269A1 publication Critical patent/DE102005056269A1/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0228—Cutting, sawing, milling or shearing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/08—Treatments involving gases
    • H05K2203/082—Suction, e.g. for holding solder balls or components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laser Beam Processing (AREA)

Abstract

A separation unit (4) for flat work pieces, comprises a laser with a stationary source (12) and a stationary separation point in the plane of the workpiece. Two supply units feed the workpiece to the separation point, and comprise a linear motor. A cutting head can be moved over the workpiece surface, and the workpiece can be fixed on the guide.
DE200510056269 2005-08-01 2005-11-14 Separation unit for use on flat workpieces, eg circuit boards, comprises a laser with a stationary source and a separation point Withdrawn DE102005056269A1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
DE202005021341U DE202005021341U1 (en) 2005-11-14 2005-11-14 Separating device for planar workpieces, in particular for separating populated printed circuit boards
DE200510056269 DE102005056269A1 (en) 2005-08-01 2005-11-14 Separation unit for use on flat workpieces, eg circuit boards, comprises a laser with a stationary source and a separation point

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102005038522A DE102005038522A1 (en) 2005-08-01 2005-08-01 Laser cutting machine is used to separate electronic circuit boards that are moved by linear motors
DE200510056269 DE102005056269A1 (en) 2005-08-01 2005-11-14 Separation unit for use on flat workpieces, eg circuit boards, comprises a laser with a stationary source and a separation point

Publications (1)

Publication Number Publication Date
DE102005056269A1 true DE102005056269A1 (en) 2007-05-16

Family

ID=37982758

Family Applications (1)

Application Number Title Priority Date Filing Date
DE200510056269 Withdrawn DE102005056269A1 (en) 2005-08-01 2005-11-14 Separation unit for use on flat workpieces, eg circuit boards, comprises a laser with a stationary source and a separation point

Country Status (1)

Country Link
DE (1) DE102005056269A1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108247221A (en) * 2018-03-09 2018-07-06 天津美森电子有限公司 A kind of processing work platform and system of processing for pcb board
DE202022103455U1 (en) 2022-06-21 2023-09-26 Schunk Electronic Solutions Gmbh Separating machine for separating individual circuit boards from a circuit board panel

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4020535A1 (en) * 1990-06-28 1992-01-02 Erzeugnisse Schweiss Schneid Thermal cutter esp. for preventing deformation of thin metal sheet - has sheet supported on struts away from solid surface with gaps for passage of gases and particles
DE4210518A1 (en) * 1992-03-31 1993-10-07 Wissner Rolf Laser milling and engraving machine - includes suction device which prevents unwanted deposits around suction area and rough cut edges
DE29620304U1 (en) * 1996-11-21 1997-01-16 Foracon Maschinen Und Anlagenb Protective brush
DE20101996U1 (en) * 2001-02-06 2001-04-05 Itec Ges Fuer Prozesautomation Device for laser processing workpieces

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4020535A1 (en) * 1990-06-28 1992-01-02 Erzeugnisse Schweiss Schneid Thermal cutter esp. for preventing deformation of thin metal sheet - has sheet supported on struts away from solid surface with gaps for passage of gases and particles
DE4210518A1 (en) * 1992-03-31 1993-10-07 Wissner Rolf Laser milling and engraving machine - includes suction device which prevents unwanted deposits around suction area and rough cut edges
DE29620304U1 (en) * 1996-11-21 1997-01-16 Foracon Maschinen Und Anlagenb Protective brush
DE20101996U1 (en) * 2001-02-06 2001-04-05 Itec Ges Fuer Prozesautomation Device for laser processing workpieces

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
JP 63154286 A (abstract). DOKIDX [online][recher- chiert am 23.03.2006]. In: DEPATIS *

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108247221A (en) * 2018-03-09 2018-07-06 天津美森电子有限公司 A kind of processing work platform and system of processing for pcb board
DE202022103455U1 (en) 2022-06-21 2023-09-26 Schunk Electronic Solutions Gmbh Separating machine for separating individual circuit boards from a circuit board panel

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