DE102004063857A1 - Wafer cutting process comprises treating a workpiece surface on its stretching table - Google Patents
Wafer cutting process comprises treating a workpiece surface on its stretching table Download PDFInfo
- Publication number
- DE102004063857A1 DE102004063857A1 DE200410063857 DE102004063857A DE102004063857A1 DE 102004063857 A1 DE102004063857 A1 DE 102004063857A1 DE 200410063857 DE200410063857 DE 200410063857 DE 102004063857 A DE102004063857 A DE 102004063857A DE 102004063857 A1 DE102004063857 A1 DE 102004063857A1
- Authority
- DE
- Germany
- Prior art keywords
- workpiece
- edge
- machining
- cutting
- grinding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
- B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
- B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
- B24B9/065—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of thin, brittle parts, e.g. semiconductors, wafers
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Mechanical Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
Description
Beim Schleifen von Werkstücken, insbesondere Wafer, werden in der geschliffenen Werkstückoberfläche durch die Schleifbearbeitung Mikrorisse eingebracht und die atomare Strukturen durch Mikrozerrüttung verändert, wodurch Spannungen induziert werden die dazu führen, dass sich die dünnen Werkstücke verformen und schnell brechen können. An den Werkstückrändern, insbesondere Waferrändern, können des weiteren durch das Schleifen Kantenausbrüche auftreten sowie bei starkem dünnen der Werkstücke kann die Werkstückkante, insbesondere Waferkante, extrem scharf werden. Beides kann ebenfalls ein Brechen des Werkstücks, insbesondere Wafer, stark fördern. Ein solches Werkstück, insbesondere Wafer, zu Transportieren birgt ein hohes Risiko. Deshalb werden die geschliffenen Werkstücke, insbesondere Wafer, so nachbehandelt, dass die gestörten Bereiche entfernt sind. Dies geschieht bei geschliffenen Werkstückoberfläche, insbesondere Wafern, z. B. durch Ätzen oder Polieren. Zum Ätzen werden die Werkstücke, insbesondere Wafer, in eine spezielle Ätzapparatur gelegt oder beim chemischen Ätzen kann dies in der selben Kammer geschehen, in der die Werkstück auch gereinigt werden und dann wird unmittelbar vor dem Reinigungsprozess geätzt.At the Grinding workpieces, in particular wafers, in the ground workpiece surface through the grinding process introduced microcracks and the atomic structures by micro-disruption changed whereby stresses are induced which cause the thin workpieces to deform and can break fast. At the workpiece edges, in particular Wafer edges, can the more by the grinding edge breakouts occur as well as strong thin the workpieces can the workpiece edge, especially wafer edge, extremely sharp. Both can be done as well a break of the workpiece, especially wafers, promote strongly. Such a workpiece, especially wafers, transporting carries a high risk. Therefore become the sanded workpieces, in particular Wafer, so aftertreated that the disturbed areas are removed. This happens at ground workpiece surface, in particular wafers, z. B. by etching or polishing. For etching become the workpieces, in particular wafers, placed in a special etching apparatus or at chemical etching This can be done in the same chamber in which the workpiece is too be cleaned and then immediately before the cleaning process etched.
Der Nachteil bei diesen Verfahren ist, das die empfindlichen und gebogenen Werkstücke, insbesondere Wafer, mit der schadhaften Oberfläche zu den Apparaturen hin transportiert werden müssen, was zum Brechen der Werkstück, insbesondere Wafer, führen kann bzw. das Werkstückhandling sehr risikoreich macht. Genauso kritisch ist der Werkstücktransport zur Läppapparaturen oder anderen nachfolgenden Bearbeitungsschritten, so lange das Werkstück die rissinitiierenden Störstellen enthält.Of the Disadvantage with these procedures is that the sensitive and bent Workpieces, especially wafers, with the defective surface towards the equipment have to be transported, what for breaking the workpiece, especially wafers can or the workpiece handling very risky. Just as critical is the workpiece transport for lapping equipment or other subsequent processing steps as long as the workpiece initiates the crack impurity contains.
Der Erfindung liegt die Aufgabe zu Grunde Mittel und Verfahren zum Entfernen des Werkstückrandes, insbesondere Waferrandes, von geschliffenen Werkstückoberflächen, bereitzustellen, bei denen die Gefahr des Brechens der Werkstücke minimiert wird.Of the The invention is based on the object means and methods for removal the edge of the workpiece, in particular wafer edge, of ground workpiece surfaces to provide where the risk of breaking the workpieces is minimized.
Die Erfindung besteht darin, die risikoreichen Arbeitsschritte Werkstückhandling und Werkstücktransport, insbesondere von Wafer, mit spannungsinduzierter und mikrorissbehafteter Werkstückoberfläche und/oder schadhafter sowie scharfer Werkstückkante zu vermeiden. Dazu wird der Werkstückrand, insbesondere Waferrand, direkt nach dem Schleifen, Polieren, Läppen, CMP oder Ätzen noch auf dem Werkstückaufspanntisch liegend, ohne dass das Werkstück von seiner Aufspannung gelöst wird, beschnitten oder/und schon während der Bearbeitung mit dem Beschneiden begonnen. Dabei kann das Werkstück in Verbindung mit dem Werkstückhalter bzw. Werkstücktisch innerhalb der Maschine einen örtlichen Positionswechsel erfahren oder auch nicht. Das Trennen kann erfolgen durch Trennschleifen, Fluidstrahlschneiden mit und ohne Abrasionspartikel, Laserstrahlschneiden, Erodieren, Sägen, Brennschneiden oder Ätzen. Denkbar ist auch, dass eine solche Trennvorrichtung bei der Bearbeitung von Wafer der Halbleiterindustrie auch zum sog. Dicing verwendet werden kann, dem Ausschneiden der ICs – Integrierte Schaltkreise – aus strukturierten Wafer.The Invention is the risky work steps workpiece handling and workpiece transport, in particular of wafers, with stress-induced and microcracked Workpiece surface and / or To avoid damaged and sharp workpiece edge. To becomes the workpiece edge, in particular Wafer edge, right after sanding, polishing, lapping, CMP or etching still on the workpiece clamping table lying without the workpiece released from his work becomes, trimmed or / and already during the processing with the Pruning started. In this case, the workpiece in conjunction with the workpiece holder or Worktable within the machine a local Change of position or not. The separation can be done by cut-off grinding, fluid jet cutting with and without abrasion particles, laser beam cutting, Eroding, sawing, Flame cutting or etching. It is also conceivable that such a separation device during processing from wafers of the semiconductor industry also used for so-called dicing The cutting out of ICs - Integrated Circuits - can be structured from Wafer.
Weitere Vorteile und vorteilhafte Ausgestaltungen des erfindungsgemäßen Verfahrens und der erfindungsgemäß beanspruchten Vorrichtung werden nachfolgend anhand einer Zeichnung und deren Beschreibung erläutert. Alle in der Zeichnung, deren Beschreibung und den Patentansprüchen genannten Merkmale können sowohl einzeln als auch in beliebiger Kombination miteinander erfindungswesentlich sein.Further Advantages and advantageous embodiments of the method according to the invention and claimed according to the invention Device will be described below with reference to a drawing and its description explained. All in the drawing, the description and the claims mentioned features can be essential to the invention both individually and in any combination.
Zeichnungdrawing
Es zeigt die einzige Figur eine schematische Darstellung einer Werkzeugmaschine, die zum erfindungsgemäßen Beschneiden der Kanten eines Werkstücks ausgerüstet ist.It the sole figure shows a schematic representation of a machine tool, the trimming according to the invention the edges of a workpiece equipped is.
Beschreibung des Ausführungsbeispielsdescription of the embodiment
In
der einzigen Figur ist eine Werkzeugmaschine stark vereinfacht dargestellt.
Die Werkzeugmaschine besteht im Wesentlichen aus einer Antriebsspindel
Das
Werkstück
Umgeben
ist die gesamte Anordnung von einer Wanne
Neben
der Antriebsspindel
Alternativ zu der dargestellten Anordnung können auch noch andere Mittel zum Beschneiden der Kanten, wie sie aus den Patentansprüchen beansprucht wurden, eingesetzt werden.alternative to the illustrated arrangement can Also other means of trimming the edges as they look the claims claimed to be used.
Claims (22)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE200410063857 DE102004063857A1 (en) | 2004-12-30 | 2004-12-30 | Wafer cutting process comprises treating a workpiece surface on its stretching table |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE200410063857 DE102004063857A1 (en) | 2004-12-30 | 2004-12-30 | Wafer cutting process comprises treating a workpiece surface on its stretching table |
Publications (1)
Publication Number | Publication Date |
---|---|
DE102004063857A1 true DE102004063857A1 (en) | 2006-09-07 |
Family
ID=36847879
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE200410063857 Withdrawn DE102004063857A1 (en) | 2004-12-30 | 2004-12-30 | Wafer cutting process comprises treating a workpiece surface on its stretching table |
Country Status (1)
Country | Link |
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DE (1) | DE102004063857A1 (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101439557B (en) * | 2008-12-25 | 2011-08-31 | 唐山冶金锯片有限公司 | Method for producing diamond circular saw film base body for mine |
CN109202593A (en) * | 2018-10-09 | 2019-01-15 | 德淮半导体有限公司 | Wafer trimmer blade |
CN110744950A (en) * | 2019-10-29 | 2020-02-04 | 温州续影贸易有限公司 | Production and manufacturing equipment for detecting internal compactness of pencil |
CN113035747A (en) * | 2021-02-26 | 2021-06-25 | 苏州新米特电子科技有限公司 | Wafer film expanding machine |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01133887A (en) * | 1987-11-16 | 1989-05-25 | Hitachi Ltd | Step for passenger conveyor |
DE3927412A1 (en) * | 1988-10-20 | 1990-04-26 | Olympus Optical Co | LENS GRINDING DEVICE AND METHOD FOR GRINDING LENSES |
JP2004111606A (en) * | 2002-09-18 | 2004-04-08 | Tokyo Seimitsu Co Ltd | Method of processing wafer |
-
2004
- 2004-12-30 DE DE200410063857 patent/DE102004063857A1/en not_active Withdrawn
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01133887A (en) * | 1987-11-16 | 1989-05-25 | Hitachi Ltd | Step for passenger conveyor |
DE3927412A1 (en) * | 1988-10-20 | 1990-04-26 | Olympus Optical Co | LENS GRINDING DEVICE AND METHOD FOR GRINDING LENSES |
JP2004111606A (en) * | 2002-09-18 | 2004-04-08 | Tokyo Seimitsu Co Ltd | Method of processing wafer |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101439557B (en) * | 2008-12-25 | 2011-08-31 | 唐山冶金锯片有限公司 | Method for producing diamond circular saw film base body for mine |
CN109202593A (en) * | 2018-10-09 | 2019-01-15 | 德淮半导体有限公司 | Wafer trimmer blade |
CN110744950A (en) * | 2019-10-29 | 2020-02-04 | 温州续影贸易有限公司 | Production and manufacturing equipment for detecting internal compactness of pencil |
CN113035747A (en) * | 2021-02-26 | 2021-06-25 | 苏州新米特电子科技有限公司 | Wafer film expanding machine |
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Date | Code | Title | Description |
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OP8 | Request for examination as to paragraph 44 patent law | ||
8139 | Disposal/non-payment of the annual fee |