DE102004054320A1 - Verfahren und Vorrichtung zum Entfernen von Verunreinigungen und Verwendung eines Reinigungsmittels - Google Patents

Verfahren und Vorrichtung zum Entfernen von Verunreinigungen und Verwendung eines Reinigungsmittels Download PDF

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Publication number
DE102004054320A1
DE102004054320A1 DE200410054320 DE102004054320A DE102004054320A1 DE 102004054320 A1 DE102004054320 A1 DE 102004054320A1 DE 200410054320 DE200410054320 DE 200410054320 DE 102004054320 A DE102004054320 A DE 102004054320A DE 102004054320 A1 DE102004054320 A1 DE 102004054320A1
Authority
DE
Germany
Prior art keywords
cleaning material
radiation
contraption
solid
cleaning
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE200410054320
Other languages
German (de)
English (en)
Inventor
Paul Prof. Dr. Leiderer
Johannes Graf
Mario Mosbacher
Boris Prof. Lukiyanchuk
Minghui Prof. Hong
Tow Chong Prof. Chong
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Universitaet Konstanz
Agency for Science Technology and Research Singapore
Original Assignee
Universitaet Konstanz
Agency for Science Technology and Research Singapore
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Universitaet Konstanz, Agency for Science Technology and Research Singapore filed Critical Universitaet Konstanz
Priority to DE200410054320 priority Critical patent/DE102004054320A1/de
Priority to PCT/EP2005/012055 priority patent/WO2006050950A1/fr
Publication of DE102004054320A1 publication Critical patent/DE102004054320A1/de
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • B08B7/0014—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by incorporation in a layer which is removed with the contaminants
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • B08B7/0035—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • B08B7/0035—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like
    • B08B7/0042—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like by laser
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • B08B7/0064—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by temperature changes
    • B08B7/0071—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by temperature changes by heating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67115—Apparatus for thermal treatment mainly by radiation

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning In General (AREA)
DE200410054320 2004-11-10 2004-11-10 Verfahren und Vorrichtung zum Entfernen von Verunreinigungen und Verwendung eines Reinigungsmittels Withdrawn DE102004054320A1 (de)

Priority Applications (2)

Application Number Priority Date Filing Date Title
DE200410054320 DE102004054320A1 (de) 2004-11-10 2004-11-10 Verfahren und Vorrichtung zum Entfernen von Verunreinigungen und Verwendung eines Reinigungsmittels
PCT/EP2005/012055 WO2006050950A1 (fr) 2004-11-10 2005-11-10 Procede et appareil permettant d'eliminer des impuretes et utilisation d'un agent de nettoyage

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE200410054320 DE102004054320A1 (de) 2004-11-10 2004-11-10 Verfahren und Vorrichtung zum Entfernen von Verunreinigungen und Verwendung eines Reinigungsmittels

Publications (1)

Publication Number Publication Date
DE102004054320A1 true DE102004054320A1 (de) 2006-05-11

Family

ID=35945192

Family Applications (1)

Application Number Title Priority Date Filing Date
DE200410054320 Withdrawn DE102004054320A1 (de) 2004-11-10 2004-11-10 Verfahren und Vorrichtung zum Entfernen von Verunreinigungen und Verwendung eines Reinigungsmittels

Country Status (2)

Country Link
DE (1) DE102004054320A1 (fr)
WO (1) WO2006050950A1 (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR3089436B1 (fr) * 2018-12-11 2020-11-13 Addup Procédé de nettoyage d’une pièce fabriquée par un procédé de fabrication additive par immersion, solidification et vibrations
US11859153B2 (en) * 2021-11-08 2024-01-02 Changxin Memory Technologies, Inc. Method for cleaning substrate and system for cleaning substrate

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4535023A (en) * 1983-06-03 1985-08-13 The United States Of America As Represented By The Secretary Of The Navy Process for fabricating cryogenic targets and targets made thereby
EP0423761A2 (fr) * 1989-10-17 1991-04-24 Applied Materials, Inc. Dispositif et méthode pour enlever des particules avec fluide de convection forcée
US5857474A (en) * 1995-12-28 1999-01-12 Dainippon Screen Mfg. Co., Ltd. Method of and apparatus for washing a substrate
US20040140298A1 (en) * 2003-01-21 2004-07-22 Applied Materials Israel Ltd Iced film substrate cleaning

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6341855A (ja) * 1986-08-07 1988-02-23 Mitsubishi Electric Corp フオトマスクのドライ洗浄方法
US5470154A (en) * 1991-04-18 1995-11-28 Osaka Sanso Kogyo Ltd. Method of cleaning the reflector mirror in an optical dew point meter and an optical dew point meter equipped with a cleaning device
DE69333248T2 (de) * 1992-04-15 2004-04-29 Air Products And Chemicals, Inc. Reinigungseinrichtung für harte Oberflächen mittels cryogenen Aerosols
JP3225623B2 (ja) * 1992-09-21 2001-11-05 ソニー株式会社 微細粒子検出方法及び微細粒子除去方法
US5731229A (en) * 1994-06-28 1998-03-24 Nissan Motor Co., Ltd. Method of producing device having minute structure

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4535023A (en) * 1983-06-03 1985-08-13 The United States Of America As Represented By The Secretary Of The Navy Process for fabricating cryogenic targets and targets made thereby
EP0423761A2 (fr) * 1989-10-17 1991-04-24 Applied Materials, Inc. Dispositif et méthode pour enlever des particules avec fluide de convection forcée
US5857474A (en) * 1995-12-28 1999-01-12 Dainippon Screen Mfg. Co., Ltd. Method of and apparatus for washing a substrate
US20040140298A1 (en) * 2003-01-21 2004-07-22 Applied Materials Israel Ltd Iced film substrate cleaning

Also Published As

Publication number Publication date
WO2006050950A1 (fr) 2006-05-18

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8139 Disposal/non-payment of the annual fee