DE102004048691A1 - Apparatus and method for edge cleaning of substrates - Google Patents
Apparatus and method for edge cleaning of substrates Download PDFInfo
- Publication number
- DE102004048691A1 DE102004048691A1 DE102004048691A DE102004048691A DE102004048691A1 DE 102004048691 A1 DE102004048691 A1 DE 102004048691A1 DE 102004048691 A DE102004048691 A DE 102004048691A DE 102004048691 A DE102004048691 A DE 102004048691A DE 102004048691 A1 DE102004048691 A1 DE 102004048691A1
- Authority
- DE
- Germany
- Prior art keywords
- flange
- substrates
- cleaning
- medienabsaugöffnung
- main body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
Abstract
Für eine einfache und kostengünstige Reinigung von Randbereichen von Substraten, die insbesondere auch für nichtrunde Substrate geeignet ist, sieht die Erfindung eine Vorrichtung und ein Verfahren zur Randreinigung von Substraten, insbesondere Fotomasken und/oder Halbleiterwafern, vor. Die Vorrichtung weist wenigstens einen Reinigungskopf mit wenigstens einer Medienzuführdüse und wenigstens einer Medienabsaugöffnung auf, wobei der Reinigungskopf einen Hauptkörper besitzt, in dem die Medienabsaugöffnung und ein sich daran anschließender Medienabsaugkanal ausgebildet sind, sowie wenigstens einen ersten Flansch, der eine zur Medienabsaugöffnung weisende und sich im Wesentlichen senkrecht zu einer die Medienabsaugöffnung aufweisenden Seite des Hauptkörpers erstreckende ebene Seite besitzt, wobei die wenigstens eine Medienzuführdüse am ersten Flansch beabstandet vom Hauptkörper vorgesehen ist und sich zu der zur Medienabsaugöffnung weisenden Seite des Flansches öffnet und im Wesentlichen senkrecht hierzu gerichtet ist, wobei die Austrittsöffnung der Medienzuführdüse bezüglich der ebenen Seite des Flansches zurückgesetzt ist oder auf einer Ebene hiermit liegt und wobei eine Bewegungsvorrichtung derart steuerbar ist, dass sie bei einer Reinigung zwischen einer Oberfläche des Substrats und der zur Substratoberfläche weisenden ebenen Seite des Flansches einen Abstand von 0,05 bis 0,5 mm, insbesondere bis 0,3 mm und vorzugsweise von 0,2 mm, beibehält.For a simple and cost-effective cleaning of edge regions of substrates, which is also suitable in particular for non-circular substrates, the invention provides an apparatus and a method for edge cleaning of substrates, in particular photomasks and / or semiconductor wafers. The device has at least one cleaning head with at least one media feed nozzle and at least one media suction opening, wherein the cleaning head has a main body in which the Medienabsaugöffnung and an adjoining Medienabsaugkanal are formed, and at least a first flange, the one facing the Medienabsaugöffnung and in the Substantially perpendicular to a side of the main body having the Medienabsaugöffnung extending side has, wherein the at least one Medienzuführdüse on the first flange spaced from the main body is provided and opens to the media suction opening facing side of the flange and directed substantially perpendicular thereto, wherein the outlet opening the Medienzuführdüse is set back with respect to the flat side of the flange or lies on a plane hereby and wherein a moving device is controllable such that it is at a cleaning between a surface of the substrate and the plane facing the substrate surface flat side of the flange a distance of 0.05 to 0.5 mm, in particular to 0.3 mm, and preferably of 0.2 mm, maintains.
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102004048691A DE102004048691A1 (en) | 2003-10-08 | 2004-10-06 | Apparatus and method for edge cleaning of substrates |
JP2006530111A JP2007508684A (en) | 2003-10-08 | 2004-10-07 | Apparatus and method for edge cleaning of substrates |
EP04790166A EP1671359A1 (en) | 2003-10-08 | 2004-10-07 | Device and method for cleaning the edges of substrates |
KR1020067008917A KR20060109895A (en) | 2003-10-08 | 2004-10-07 | Device and method for cleaning the edges of substrate |
CA002539920A CA2539920A1 (en) | 2003-10-08 | 2004-10-07 | Device and method for cleaning the edges of substrates |
PCT/EP2004/011193 WO2005036611A1 (en) | 2003-10-08 | 2004-10-07 | Device and method for cleaning the edges of substrates |
US10/575,746 US20070000516A1 (en) | 2003-10-08 | 2004-10-07 | Device and method for cleaning the edges of substrates |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10346667 | 2003-10-08 | ||
DE102004048691A DE102004048691A1 (en) | 2003-10-08 | 2004-10-06 | Apparatus and method for edge cleaning of substrates |
Publications (1)
Publication Number | Publication Date |
---|---|
DE102004048691A1 true DE102004048691A1 (en) | 2005-05-12 |
Family
ID=34428229
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE102004048691A Withdrawn DE102004048691A1 (en) | 2003-10-08 | 2004-10-06 | Apparatus and method for edge cleaning of substrates |
Country Status (3)
Country | Link |
---|---|
CN (1) | CN1864243A (en) |
DE (1) | DE102004048691A1 (en) |
TW (1) | TW200611302A (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4841451B2 (en) * | 2007-01-31 | 2011-12-21 | 大日本スクリーン製造株式会社 | Substrate processing apparatus and substrate processing method |
CN102214553A (en) * | 2011-05-23 | 2011-10-12 | 叶伟清 | Wafer end surface cleaning method |
-
2004
- 2004-09-30 TW TW093129507A patent/TW200611302A/en unknown
- 2004-10-06 DE DE102004048691A patent/DE102004048691A1/en not_active Withdrawn
- 2004-10-07 CN CNA2004800295801A patent/CN1864243A/en active Pending
Also Published As
Publication number | Publication date |
---|---|
TW200611302A (en) | 2006-04-01 |
CN1864243A (en) | 2006-11-15 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8130 | Withdrawal |