DE102004048691A1 - Apparatus and method for edge cleaning of substrates - Google Patents

Apparatus and method for edge cleaning of substrates Download PDF

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Publication number
DE102004048691A1
DE102004048691A1 DE102004048691A DE102004048691A DE102004048691A1 DE 102004048691 A1 DE102004048691 A1 DE 102004048691A1 DE 102004048691 A DE102004048691 A DE 102004048691A DE 102004048691 A DE102004048691 A DE 102004048691A DE 102004048691 A1 DE102004048691 A1 DE 102004048691A1
Authority
DE
Germany
Prior art keywords
flange
substrates
cleaning
medienabsaugöffnung
main body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE102004048691A
Other languages
German (de)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Steag Hamatech AG
Original Assignee
Steag Hamatech AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Steag Hamatech AG filed Critical Steag Hamatech AG
Priority to DE102004048691A priority Critical patent/DE102004048691A1/en
Priority to EP04790166A priority patent/EP1671359A1/en
Priority to KR1020067008917A priority patent/KR20060109895A/en
Priority to JP2006530111A priority patent/JP2007508684A/en
Priority to PCT/EP2004/011193 priority patent/WO2005036611A1/en
Priority to CA002539920A priority patent/CA2539920A1/en
Priority to US10/575,746 priority patent/US20070000516A1/en
Publication of DE102004048691A1 publication Critical patent/DE102004048691A1/en
Withdrawn legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)

Abstract

Für eine einfache und kostengünstige Reinigung von Randbereichen von Substraten, die insbesondere auch für nichtrunde Substrate geeignet ist, sieht die Erfindung eine Vorrichtung und ein Verfahren zur Randreinigung von Substraten, insbesondere Fotomasken und/oder Halbleiterwafern, vor. Die Vorrichtung weist wenigstens einen Reinigungskopf mit wenigstens einer Medienzuführdüse und wenigstens einer Medienabsaugöffnung auf, wobei der Reinigungskopf einen Hauptkörper besitzt, in dem die Medienabsaugöffnung und ein sich daran anschließender Medienabsaugkanal ausgebildet sind, sowie wenigstens einen ersten Flansch, der eine zur Medienabsaugöffnung weisende und sich im Wesentlichen senkrecht zu einer die Medienabsaugöffnung aufweisenden Seite des Hauptkörpers erstreckende ebene Seite besitzt, wobei die wenigstens eine Medienzuführdüse am ersten Flansch beabstandet vom Hauptkörper vorgesehen ist und sich zu der zur Medienabsaugöffnung weisenden Seite des Flansches öffnet und im Wesentlichen senkrecht hierzu gerichtet ist, wobei die Austrittsöffnung der Medienzuführdüse bezüglich der ebenen Seite des Flansches zurückgesetzt ist oder auf einer Ebene hiermit liegt und wobei eine Bewegungsvorrichtung derart steuerbar ist, dass sie bei einer Reinigung zwischen einer Oberfläche des Substrats und der zur Substratoberfläche weisenden ebenen Seite des Flansches einen Abstand von 0,05 bis 0,5 mm, insbesondere bis 0,3 mm und vorzugsweise von 0,2 mm, beibehält.For a simple and cost-effective cleaning of edge regions of substrates, which is also suitable in particular for non-circular substrates, the invention provides an apparatus and a method for edge cleaning of substrates, in particular photomasks and / or semiconductor wafers. The device has at least one cleaning head with at least one media feed nozzle and at least one media suction opening, wherein the cleaning head has a main body in which the Medienabsaugöffnung and an adjoining Medienabsaugkanal are formed, and at least a first flange, the one facing the Medienabsaugöffnung and in the Substantially perpendicular to a side of the main body having the Medienabsaugöffnung extending side has, wherein the at least one Medienzuführdüse on the first flange spaced from the main body is provided and opens to the media suction opening facing side of the flange and directed substantially perpendicular thereto, wherein the outlet opening the Medienzuführdüse is set back with respect to the flat side of the flange or lies on a plane hereby and wherein a moving device is controllable such that it is at a cleaning between a surface of the substrate and the plane facing the substrate surface flat side of the flange a distance of 0.05 to 0.5 mm, in particular to 0.3 mm, and preferably of 0.2 mm, maintains.

DE102004048691A 2003-10-08 2004-10-06 Apparatus and method for edge cleaning of substrates Withdrawn DE102004048691A1 (en)

Priority Applications (7)

Application Number Priority Date Filing Date Title
DE102004048691A DE102004048691A1 (en) 2003-10-08 2004-10-06 Apparatus and method for edge cleaning of substrates
EP04790166A EP1671359A1 (en) 2003-10-08 2004-10-07 Device and method for cleaning the edges of substrates
KR1020067008917A KR20060109895A (en) 2003-10-08 2004-10-07 Device and method for cleaning the edges of substrate
JP2006530111A JP2007508684A (en) 2003-10-08 2004-10-07 Apparatus and method for edge cleaning of substrates
PCT/EP2004/011193 WO2005036611A1 (en) 2003-10-08 2004-10-07 Device and method for cleaning the edges of substrates
CA002539920A CA2539920A1 (en) 2003-10-08 2004-10-07 Device and method for cleaning the edges of substrates
US10/575,746 US20070000516A1 (en) 2003-10-08 2004-10-07 Device and method for cleaning the edges of substrates

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10346667 2003-10-08
DE102004048691A DE102004048691A1 (en) 2003-10-08 2004-10-06 Apparatus and method for edge cleaning of substrates

Publications (1)

Publication Number Publication Date
DE102004048691A1 true DE102004048691A1 (en) 2005-05-12

Family

ID=34428229

Family Applications (1)

Application Number Title Priority Date Filing Date
DE102004048691A Withdrawn DE102004048691A1 (en) 2003-10-08 2004-10-06 Apparatus and method for edge cleaning of substrates

Country Status (3)

Country Link
CN (1) CN1864243A (en)
DE (1) DE102004048691A1 (en)
TW (1) TW200611302A (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4841451B2 (en) * 2007-01-31 2011-12-21 大日本スクリーン製造株式会社 Substrate processing apparatus and substrate processing method
CN102214553A (en) * 2011-05-23 2011-10-12 叶伟清 Wafer end surface cleaning method

Also Published As

Publication number Publication date
CN1864243A (en) 2006-11-15
TW200611302A (en) 2006-04-01

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8130 Withdrawal