DE102004041911A1 - Fan module for heat dissipating device, has tubular air guiding unit mounted on connecting seat, comprising air passage that is in fluid contact with through-hole of connecting seat - Google Patents
Fan module for heat dissipating device, has tubular air guiding unit mounted on connecting seat, comprising air passage that is in fluid contact with through-hole of connecting seat Download PDFInfo
- Publication number
- DE102004041911A1 DE102004041911A1 DE200410041911 DE102004041911A DE102004041911A1 DE 102004041911 A1 DE102004041911 A1 DE 102004041911A1 DE 200410041911 DE200410041911 DE 200410041911 DE 102004041911 A DE102004041911 A DE 102004041911A DE 102004041911 A1 DE102004041911 A1 DE 102004041911A1
- Authority
- DE
- Germany
- Prior art keywords
- guide tube
- connector
- cooling fan
- connecting seat
- cooling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4093—Snap-on arrangements, e.g. clips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
Technisches Gebiettechnical area
Die Erfindung betrifft einen Kühlmodul, der eine geräuschdämpfende Funktion aufweist.The Invention relates to a cooling module, the one silencing Function has.
Die Betriebswärme der elektronischen Bauelemente muß abgeführt werden, um eine Beschädigung der elektronischen Bauelemente durch diese Abwärme zu vermeiden. Dafür werden ein Kühler und ein Kühlventilator verwendet.The operating heat the electronic components must be dissipated to damage the electronic components to avoid this waste heat. For that will be a cooler and a cooling fan used.
Der
Kühler
Aufgabe der ErfindungTask of invention
Der Erfindung liegt die Aufgabe zugrunde, einen Kühlmodul mit Geräuschdämpfung zu schaffen, der eine geräuschdämpfende Funktion aufweist.Of the Invention is based on the object, a cooling module with noise reduction create a noise-dampening Function has.
Der Erfindung liegt eine weitere Aufgabe zugrunde, einen Kühlmodul mit Geräuschdämpfung zu schaffen, der die Kühlwirkung erhöhen kann.Of the Invention is based on a further object, a cooling module with noise damping to create the cooling effect increase can.
Diese Aufgaben werden durch den erfindungsgemäßen Kühlmodul mit Geräuschdämpfung gelöst, der auf einem Kühler und einer Klemmvorrichtung angeordnet und aus einem Kühlventilator, einem Führungsrohr und einem dazwischen liegenden Verbinder besteht, wobei der Kühlventilator ein Gehäuse und ein Flügelrad aufweist, der zur Verbindung des Führungsrohres und des Kühlventilators dient, und das Führungsrohr die Luft auf den Kühlventilator konzentriert.These Tasks are solved by the cooling module according to the invention with noise damping, the on a radiator and a clamping device arranged and from a cooling fan, a guide tube and an intermediate connector, the cooling fan a housing and an impeller having, for connecting the guide tube and the cooling fan serves, and the guide tube the air is concentrated on the cooling fan.
Durch die Anordung des Führungsrohres wird das Geräusch des Kühlventilators wesenentlich verringert. Zudem wird die Geschwindigkeit des Luftstromes des Kühlventilators erhöht, so daß die Kühlwirkung verbessert wird.By the arrangement of the guide tube is the noise the cooling fan significantly reduced. In addition, the speed of the air flow the cooling fan elevated, So that the cooling effect is improved.
Kurze Beschreibung der ZeichnungenShort description the drawings
Wege zur Ausführung der ErfindungWays to execute the invention
Im folgenden wird die Erfindung anhand eines bevorzugten Ausführungsbeispiels näher erläutert.in the The following is the invention with reference to a preferred embodiment explained in more detail.
Der
Kühlmodul
Der
Verbinder
Das
Führungsrohr
Beim
Einsatz wird die Luft durch das Führungsrohr
Um
die Kühlwirkung
weiterhin zu erhöhen, kann
das Material des Kühlers
Claims (7)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE200410041911 DE102004041911A1 (en) | 2004-08-30 | 2004-08-30 | Fan module for heat dissipating device, has tubular air guiding unit mounted on connecting seat, comprising air passage that is in fluid contact with through-hole of connecting seat |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE200410041911 DE102004041911A1 (en) | 2004-08-30 | 2004-08-30 | Fan module for heat dissipating device, has tubular air guiding unit mounted on connecting seat, comprising air passage that is in fluid contact with through-hole of connecting seat |
Publications (1)
Publication Number | Publication Date |
---|---|
DE102004041911A1 true DE102004041911A1 (en) | 2006-03-02 |
Family
ID=35745659
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE200410041911 Ceased DE102004041911A1 (en) | 2004-08-30 | 2004-08-30 | Fan module for heat dissipating device, has tubular air guiding unit mounted on connecting seat, comprising air passage that is in fluid contact with through-hole of connecting seat |
Country Status (1)
Country | Link |
---|---|
DE (1) | DE102004041911A1 (en) |
-
2004
- 2004-08-30 DE DE200410041911 patent/DE102004041911A1/en not_active Ceased
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
OP8 | Request for examination as to paragraph 44 patent law | ||
8125 | Change of the main classification |
Ipc: H01L 23/467 AFI20051017BHDE |
|
8131 | Rejection |