DE202004018218U1 - Heat sink for cooling purposes e.g. for CPU, has concave section that can uniformly distribute air flow from fan to improve cooling effect; concave section is of curved form, gradually deepening form or stepped - Google Patents
Heat sink for cooling purposes e.g. for CPU, has concave section that can uniformly distribute air flow from fan to improve cooling effect; concave section is of curved form, gradually deepening form or stepped Download PDFInfo
- Publication number
- DE202004018218U1 DE202004018218U1 DE200420018218 DE202004018218U DE202004018218U1 DE 202004018218 U1 DE202004018218 U1 DE 202004018218U1 DE 200420018218 DE200420018218 DE 200420018218 DE 202004018218 U DE202004018218 U DE 202004018218U DE 202004018218 U1 DE202004018218 U1 DE 202004018218U1
- Authority
- DE
- Germany
- Prior art keywords
- heat sink
- fan
- concave section
- concave
- air flow
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04D—NON-POSITIVE-DISPLACEMENT PUMPS
- F04D29/00—Details, component parts, or accessories
- F04D29/58—Cooling; Heating; Diminishing heat transfer
- F04D29/582—Cooling; Heating; Diminishing heat transfer specially adapted for elastic fluid pumps
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
Description
Die Erfindung betrifft allgemein eine Wärmesenke.The The invention relates generally to a heat sink.
Eine
herkömmliche
Wärmesenke
Durch
diese Wärmesenke
Der Erfindung liegt die Aufgabe zugrunde, eine Wärmesenke zu schaffen, die die Luftströmung von einem Lüfter gleichmäßig verteilen kann, um den Kühleffekt zu verbessern.Of the Invention has for its object to provide a heat sink, the Air flow of a fan spread evenly can, to the cooling effect to improve.
Diese Aufgabe ist durch die Wärmesenken gemäß den beigefügten unabhängigen Ansprüchen 1 und 8 gelöst. Die erfindungsgemäße Wärmesenke ist so angeordnet, dass sie dem Luftauslass eines Lüfters zugewandt ist. An der dem Lüfter zugewandten Wärmesenke ist ein konkaver Abschnitt ausgebildet, auf den der vom Lüfter erzeugte Luftstrom trifft. Dadurch kann der konkave Teil die vom Lüfter her strömende Luft gleichmäßig verteilen, wodurch der Kühleffekt verbessert ist.These The object is achieved by the heat sinks according to the appended independent claims 1 and 8 solved. The heat sink according to the invention is arranged so that it faces the air outlet of a fan. At the the fan facing heat sink a concave section is formed on which the fan generated Airflow hits. As a result, the concave part, the air flowing from the fan ago spread evenly, whereby the cooling effect is improved.
Die Erfindung wird nachfolgend anhand von durch Figuren veranschaulichten Ausführungsformen näher erläutert.The Invention will now be illustrated by figures embodiments explained in more detail.
Wie
es aus den
Die
Wärmesenke
Durch
die
Wenn
das Wärme
erzeugende Element betrieben wird, wirkt es als Wärmequelle.
Die Wärmeleitplatte
Wie
es aus der
Wie
es aus der
Die
in der
Bei
der in der
Wie
es aus den
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE200420018218 DE202004018218U1 (en) | 2004-11-24 | 2004-11-24 | Heat sink for cooling purposes e.g. for CPU, has concave section that can uniformly distribute air flow from fan to improve cooling effect; concave section is of curved form, gradually deepening form or stepped |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE200420018218 DE202004018218U1 (en) | 2004-11-24 | 2004-11-24 | Heat sink for cooling purposes e.g. for CPU, has concave section that can uniformly distribute air flow from fan to improve cooling effect; concave section is of curved form, gradually deepening form or stepped |
Publications (1)
Publication Number | Publication Date |
---|---|
DE202004018218U1 true DE202004018218U1 (en) | 2005-01-27 |
Family
ID=34112362
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE200420018218 Expired - Lifetime DE202004018218U1 (en) | 2004-11-24 | 2004-11-24 | Heat sink for cooling purposes e.g. for CPU, has concave section that can uniformly distribute air flow from fan to improve cooling effect; concave section is of curved form, gradually deepening form or stepped |
Country Status (1)
Country | Link |
---|---|
DE (1) | DE202004018218U1 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7355146B2 (en) | 2005-07-28 | 2008-04-08 | Ebm-Papst St. Georgen Gmbh & Co. Kg | Heating unit |
CN112698541A (en) * | 2019-10-22 | 2021-04-23 | 中强光电股份有限公司 | Heat dissipation module and projection device using same |
-
2004
- 2004-11-24 DE DE200420018218 patent/DE202004018218U1/en not_active Expired - Lifetime
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7355146B2 (en) | 2005-07-28 | 2008-04-08 | Ebm-Papst St. Georgen Gmbh & Co. Kg | Heating unit |
CN112698541A (en) * | 2019-10-22 | 2021-04-23 | 中强光电股份有限公司 | Heat dissipation module and projection device using same |
US11506961B2 (en) | 2019-10-22 | 2022-11-22 | Coretronic Corporation | Heat dissipation module and projection apparatus using the same |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
DE19509904C2 (en) | Cooling device for dissipating heat from electronic components by means of a fan | |
DE10319086A1 (en) | fastening device | |
DE20013029U1 (en) | Cooling pad for notebook | |
DE202014101924U1 (en) | Heat dissipation arrangement of a brake pad | |
DE202015105009U1 (en) | Front panel arrangement of a power device | |
DE202007004949U1 (en) | Grinder with a rotating plate, to hold a grinding disk, has concentric circles of suction openings to extract dust | |
DE20317856U1 (en) | Luftleitverkleidung | |
DE102005063024B4 (en) | airguide | |
DE3331112A1 (en) | DEVICE FOR HEAT EXHAUST FROM PCB | |
DE202004018218U1 (en) | Heat sink for cooling purposes e.g. for CPU, has concave section that can uniformly distribute air flow from fan to improve cooling effect; concave section is of curved form, gradually deepening form or stepped | |
DE102007053090B4 (en) | Heat sink and cooling arrangement for electrical components and method for producing a heat sink and a cooling arrangement for electrical components | |
DE202012100573U1 (en) | Mounting structure of a heat sink with cooling fins | |
EP2405480A2 (en) | Cooling element with an electric component | |
DE102018108282A1 (en) | end disk | |
DE10203239A1 (en) | Cooling component for semiconducting devices has coolant channels of each of 2 planes joined by transverse channel, each of 2 connection arrangements connected to transverse channel | |
DE4229810C2 (en) | Model plate carrier for compression processes subjected to compressed air | |
EP3372916A1 (en) | System for reversibly attaching an element of air conditioning and ventilation assembly | |
DE102017217314A1 (en) | Oil separator unit and oil separator | |
DE102013105293B3 (en) | Cooling arrangement for cooling e.g. processor of computer system, has air scoop including inlet opening that is arranged within airflow of fan, and outlet opening arranged so that component to be cooled is detected by deflected air flow | |
DE202004013226U1 (en) | Adapter for installing electronic devices, especially frequency converters, has attachment part(s) with elements(s) for attaching part, different attachment elements for attaching to fitting point | |
DE102005002205A1 (en) | Radiation module for cooling a heat generating part, has baffle that resists heated air, which passes through radiator, to make heated air flow backward | |
DE10331026B3 (en) | Heat sink element for electronic component has projection of heat-conductive core of heat sink body fitting into opening in base element used for contacting electronic component | |
DE102022123356A1 (en) | AIR GUIDE DEVICE FOR AN ELECTRICALLY POWERED HAND TOOL | |
DE102009047206A1 (en) | Cooler for cooling CPU of computer system, has secondary finned cooling unit with heat guiding pipes inserted into grooves of primary finned cooling unit, where pipes are attached to base plate and thermally coupled at secondary unit | |
DE202022103125U1 (en) | Mounting frame, heat distribution system and use of a mounting frame for pressing a heat distribution body onto a microprocessor device |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
R207 | Utility model specification |
Effective date: 20050303 |
|
R150 | Term of protection extended to 6 years |
Effective date: 20071213 |
|
R157 | Lapse of ip right after 6 years |
Effective date: 20110531 |