DE10195157D2 - Reinigungsvorrichtung zum Reinigen von für das Polieren von Halbleiterwafern verwendeten Poliertüchern - Google Patents

Reinigungsvorrichtung zum Reinigen von für das Polieren von Halbleiterwafern verwendeten Poliertüchern

Info

Publication number
DE10195157D2
DE10195157D2 DE10195157T DE10195157T DE10195157D2 DE 10195157 D2 DE10195157 D2 DE 10195157D2 DE 10195157 T DE10195157 T DE 10195157T DE 10195157 T DE10195157 T DE 10195157T DE 10195157 D2 DE10195157 D2 DE 10195157D2
Authority
DE
Germany
Prior art keywords
polishing
cleaning
semiconductor wafers
cleaning device
cloths used
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE10195157T
Other languages
English (en)
Other versions
DE10195157B4 (de
Inventor
Veit Goetze
Ruediger Hunger
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Polaris Innovations Ltd
Original Assignee
Infineon Technologies AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Infineon Technologies AG filed Critical Infineon Technologies AG
Priority to DE10195157T priority Critical patent/DE10195157B4/de
Publication of DE10195157D2 publication Critical patent/DE10195157D2/de
Application granted granted Critical
Publication of DE10195157B4 publication Critical patent/DE10195157B4/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • B08B1/30—Cleaning by methods involving the use of tools by movement of cleaning members over a surface
    • B08B1/32—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • B08B1/30—Cleaning by methods involving the use of tools by movement of cleaning members over a surface
    • B08B1/32—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members
    • B08B1/36—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members rotating about an axis orthogonal to the surface
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02—Cleaning by the force of jets or sprays
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
DE10195157T 2000-11-29 2001-10-25 Reinigungsvorrichtung zum Reinigen von für das Polieren von Halbleiterwafern verwendeten Poliertüchern Expired - Fee Related DE10195157B4 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE10195157T DE10195157B4 (de) 2000-11-29 2001-10-25 Reinigungsvorrichtung zum Reinigen von für das Polieren von Halbleiterwafern verwendeten Poliertüchern

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
DE10059180.9 2000-11-29
DE10059180 2000-11-29
DE10195157T DE10195157B4 (de) 2000-11-29 2001-10-25 Reinigungsvorrichtung zum Reinigen von für das Polieren von Halbleiterwafern verwendeten Poliertüchern
PCT/DE2001/004082 WO2002043923A1 (de) 2000-11-29 2001-10-25 Reinigungsvorrichtung zum reinigen von für das polieren von halbleiterwafern verwendeten poliertüchern

Publications (2)

Publication Number Publication Date
DE10195157D2 true DE10195157D2 (de) 2003-11-13
DE10195157B4 DE10195157B4 (de) 2010-08-26

Family

ID=7665052

Family Applications (1)

Application Number Title Priority Date Filing Date
DE10195157T Expired - Fee Related DE10195157B4 (de) 2000-11-29 2001-10-25 Reinigungsvorrichtung zum Reinigen von für das Polieren von Halbleiterwafern verwendeten Poliertüchern

Country Status (5)

Country Link
US (1) US20030216112A1 (de)
JP (1) JP2004514300A (de)
KR (1) KR20040004453A (de)
DE (1) DE10195157B4 (de)
WO (1) WO2002043923A1 (de)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3797861B2 (ja) * 2000-09-27 2006-07-19 株式会社荏原製作所 ポリッシング装置
JP2006332550A (ja) * 2005-05-30 2006-12-07 Asahi Sunac Corp 研磨パッドのドレッシング性評価方法及び研磨パッドのドレッシング方法
JP4790322B2 (ja) * 2005-06-10 2011-10-12 株式会社ディスコ 加工装置および加工方法
KR100615100B1 (ko) * 2005-08-16 2006-08-22 삼성전자주식회사 연마 패드 클리너 및 이를 갖는 화학기계적 연마 장치
WO2008097627A1 (en) * 2007-02-07 2008-08-14 Tbw Industries, Inc. Cleaning cup system for chemical mechanical planarization apparatus
KR100901239B1 (ko) * 2008-03-31 2009-06-08 신진유지보수 주식회사 상수관 터널 갱생 자동화장치용 고정장치
KR100996234B1 (ko) * 2010-08-30 2010-11-23 서부길 화학적 기계연마(ｃｍｐ)용 연마패드의 클리닝 장치
CN102407477A (zh) * 2011-11-14 2012-04-11 云南钛业股份有限公司 一种钛及钛合金冷凝屏清洗方法
US9630295B2 (en) * 2013-07-17 2017-04-25 Taiwan Semiconductor Manufacturing Co., Ltd. Mechanisms for removing debris from polishing pad
CN106540895B (zh) * 2015-09-16 2019-06-04 泰科电子(上海)有限公司 清洗系统
CN106363505A (zh) * 2016-09-20 2017-02-01 陕西理工学院 一种磨具设备
CN111633563B (zh) * 2020-06-15 2021-09-14 衢州学院 抛光介质制备装置和方法、机械化学抛光设备和方法
CN113290507A (zh) * 2021-07-06 2021-08-24 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） 抛光液输送装置
KR102465486B1 (ko) 2021-10-19 2022-11-11 (주)퓨렉스 폴리싱 패드용 세정 장치

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2622069B2 (ja) * 1993-06-30 1997-06-18 三菱マテリアル株式会社 研磨布のドレッシング装置
US5456627A (en) * 1993-12-20 1995-10-10 Westech Systems, Inc. Conditioner for a polishing pad and method therefor
US5486131A (en) * 1994-01-04 1996-01-23 Speedfam Corporation Device for conditioning polishing pads
JP2647050B2 (ja) * 1995-03-31 1997-08-27 日本電気株式会社 ウェハ研磨装置
US5578529A (en) * 1995-06-02 1996-11-26 Motorola Inc. Method for using rinse spray bar in chemical mechanical polishing
JP3678468B2 (ja) * 1995-07-18 2005-08-03 株式会社荏原製作所 ポリッシング装置
JP2850803B2 (ja) * 1995-08-01 1999-01-27 信越半導体株式会社 ウエーハ研磨方法
JP2833549B2 (ja) * 1995-11-07 1998-12-09 日本電気株式会社 研磨布の表面調整方法及び機構
US5893753A (en) * 1997-06-05 1999-04-13 Texas Instruments Incorporated Vibrating polishing pad conditioning system and method
US6139406A (en) * 1997-06-24 2000-10-31 Applied Materials, Inc. Combined slurry dispenser and rinse arm and method of operation
DE19737854C2 (de) * 1997-08-29 1999-06-17 Siemens Ag Vorrichtung und Verfahren zum Reinigen von Polierpads, beispielsweise Poliertüchern, insbesondere für das Polieren von Wafern
US5916010A (en) * 1997-10-30 1999-06-29 International Business Machines Corporation CMP pad maintenance apparatus and method
JP3615931B2 (ja) * 1998-03-26 2005-02-02 株式会社荏原製作所 ポリッシング装置および該ポリッシング装置におけるコンディショニング方法
JP3770752B2 (ja) * 1998-08-11 2006-04-26 株式会社日立製作所 半導体装置の製造方法及び加工装置
KR20010071353A (ko) * 1999-04-01 2001-07-28 롤페스 요하네스 게라투스 알베르투스 2중 ｃｍｐ 패드 조절기
US6283840B1 (en) * 1999-08-03 2001-09-04 Applied Materials, Inc. Cleaning and slurry distribution system assembly for use in chemical mechanical polishing apparatus

Also Published As

Publication number Publication date
US20030216112A1 (en) 2003-11-20
WO2002043923A1 (de) 2002-06-06
DE10195157B4 (de) 2010-08-26
KR20040004453A (ko) 2004-01-13
JP2004514300A (ja) 2004-05-13

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R119 Application deemed withdrawn, or ip right lapsed, due to non-payment of renewal fee