DE1008671B - Method and device for cutting moving pastry plates - Google Patents

Description

GERMAN

The invention relates to a method for cutting up moving biscuit sheets, in particular continuously moving wafer belts, by means of standing and in this direction firmly guided cutting devices, especially cutting wires.

Such methods and devices are for individual wafer sheets lying one on top of the other in stacks known. So far, however, the cutting has been carried out either by means of the waffle sheet stack in the direction of movement stationary cutting wires that oscillate only perpendicular to the wafer sheets, against which the individual wafer sheet stack are moved or vice versa by means of against the stationary wafer sheet stack moving cutting wires. The disadvantage of these known proposals is in particular that die_Arbeitszeit is too long and cutting out differently shaped parts is relatively cumbersome going on.

These disadvantages are avoided according to the method according to the invention in that at least one in its direction of movement in the plane of the plate and only in this variable cutting device during the cutting process at least some of the boundary edges of the biscuit to be produced describes the corresponding path and thereby forms these edges, while the remaining edges be formed by a further cutting device and / or the pastry plate edge, the Cutting device at an angle depending on the cutting direction to the direction of the plate movement is moved.

Although a sheeter for wafer sheet stacks is already known, which is also used during the Movement of the wafer sheet stack a cutting should take place. Drag knives are used, which execute a movement at an angle to the stack feed direction. The drag knives are on one constantly revolving chain system attached, so they have no permanent leadership, so that a clean cutting of the waffle stacks is hardly possible and thin wafer sheets are definitely not processed can be. In contrast, the method according to the invention of fixed cutting devices assumed in which these disadvantages are avoided.

It is particularly advantageous to carry out the method according to the invention in such a way that the cutting device describes a self-contained figure when moving relative to the solid base. The cutting device can then be arranged and controlled in a simple manner. In doing so, the movement the cutting device can be broken down into two movements, namely into a so-called main process and device

for cutting up moving

Pastry plates

Applicant:

Dr. Wilma Wendt, née Oellrich,
Hamburg 39, Leinpfad 14

movement that is directed against or in the same direction as the conveying direction of the pastry belt, and an auxiliary movement at an angle to it. The auxiliary movement can be serikfecht or at an angle to the Be directed conveying movement of the pastry belt.

By superimposing these two movements, the cutting devices according to the invention be guided in relation to the solid base in such a way that a closed figure is created.

Preferably, the movements are further superimposed so that the cutting device in their Movement with respect to the moving pastry plate describes serpentine or zigzag lines, namely when using several cutting devices, preferably mutually touching or overlapping

intersecting serpentine or zigzag lines. In this way, the Cutting devices of various shaped parts be cut out of the pastry strand.

According to a further feature is the invention

characterized in that d'ie cutting device oscillates perpendicular to the plane of the plate. In this way, a particularly clean cut is achieved and before especially at the turning points in the cutting direction damage to the pastry strand on all Cases avoided with certainty .. '

A device provided for carrying out the method can be characterized by a all cutting devices in side-by-side and / or or behind one another arrangement

709 510/1

containing, in the provided cutting devices with the required cutting speed movable frame. This frame then performs the various previously mentioned cutting movements while the pastry belt is conveyed through the frame.

Further details of the invention emerge from the following description of the drawings Shapes to be cut out from a wafer ribbon.

1 shows a perspective representation of a part of a wafer band together with two cutting wires; 2 to 4 show schematically in plan each part of a wafer strip with different shapes to be cut out; ¹ p

Fig. 5 shows schematically the composition of the overall movement from the individual movement processes again.

In the embodiment according to FIG. 1, from a wafer strip 1, which is continuously moved in the direction of arrow A , z. B. square waffle pieces or plates 2 are cut out. For this purpose, two cutting wires 3, 4 are first moved in the direction of arrow B against the movement of the wafer sheet 1 and penetrate it at points 5, 6. This movement of the cutting wires in the direction of arrow B is their main movement. In addition, when they have reached points 7 and 8, they also receive a movement running transversely to the conveying movement A or to its main movement B in the direction of arrow C, which movement is referred to as an auxiliary movement. Since the wafer sheet 1 is moving, the cutting wires must now be moved backwards in direction A at the same speed as the wafer sheet in order to produce a cutting process perpendicular to the previous cut. If the cutting wires then come to points 9 or 10, their movement in direction C ceases and they are moved again, reversing the main movement in direction B, towards the wafer sheet. This overall process is repeated continuously.

The three movements A, B, C are thus coordinated with one another in such a way that the wafer plates 2 are continuously cut out of the wafer strip 1 ^ 5 .

FIGS. 2 to 4 show various other shapes of the wafer plates to be cut out, namely FIG. 2 shows waffle plates 2 of trapezoidal shape. The cutting wires are again with 3.4 and that Wafer ribbon labeled 1. The cutting wire 3 is in accordance with the dash-dotted line and the cutting wire 4 moves in a zigzag according to the drawn line.

In the illustration according to FIG. 3, the cutting wire 3 and the cutting wire 4 are each moved in serpentine lines, the cutting wire 3 describing the extended path and the cutting wire 4 describing the dash-dotted path. Both tracks overlap at points 7. The shape of the resulting ^wafer pieces or wafers 2 can be seen from FIG. 3.

In Fig. 4, 1 is again the wafer band. 2 are the shapes of the wafer plates to be cut out or cut out and 3, 4 are the two cutting wires that are moved ⁶ S in the direction of the arrow.

The examples given show how you can use the process according to the invention to produce any desired shapes can cut continuously from a strand of biscuits, depending on how you move the main and auxiliary movement can be superimposed in terms of direction and speed.

In order to be able to use the entire width of the wafer band completely, work depending on the desired Shape of the waffle pieces, two or more cutting wires next to each other.

Fig. S shows the course of movement of the three combined movements A, B, C of a wire, z. B. 3, Fig. 1 again. The main movements take place in the direction of the double arrow E, the auxiliary movements in the direction of the double arrow D and the conveying movement of the wafer strip 1 in the direction of the arrow F. The individual movement phases are shown next to one another in FIG. The total movement results from the triangle α to i.

According to the invention, the individual pieces can be completely different in a single operation Size and shape of the wafer sheet or wafer belt, which is expedient with a constant conveyor or Manufacturing speed is moved, are produced. The production takes place in the conceivable shortest time, so that with the most efficient use of the wafer ribbons or sheets an extremely quick and clean division into any desired shape and quantity in continuous operation can and results in a considerable saving of time, money, labor and material, namely the latter, because waste is not recorded or is limited to a minimum.

Claims (5)

Claims 1. A method for cutting moving pastry sheets, in particular continuously moving wafer strips, by means of cutting devices standing perpendicular to the surface to be cut and fixedly guided in this direction, in particular cutting wires, characterized in that at least one variable in its direction of movement in the plane of the plate and only in this Cutting device (3, -4) describes a path corresponding to at least part of the boundary edges of the biscuit to be produced during the cutting process and thereby forms these boundary edges, while the remaining boundary edges are formed by a further cutting device (4, 3) and / or the biscuit plate edge, with the cutting device is moved at an angle that is dependent on the cutting direction in relation to the direction of the plate movement (B) . 2. The method according to claim 1, characterized in that the cutting device (3, 4) at their movement in relation to the solid base describes a self-contained figure. 3. The method according to claim 1 and 2, characterized in that the cutting device (3, 4) describes snake or zigzag lines when moving in relation to the moving pastry plate, when using several cutting devices, preferably each other touching or intersecting serpentine or zigzag lines. 4. The method according to claim 1 to 3, characterized in that the cutting device (3, 4) oscillates perpendicular to the plane of the plate. 5. Apparatus for performing the method according to claim 1 to 4, characterized by a all cutting devices in side-by-side and / or or behind one another arrangement containing, in the provided cutting devices with the required cutting speed movable frame. Considered publications: German patents Nos. 853 885, 858 601, 676,542; British Patent No. 581,852; U.S. Patent Nos. 2,145,770, 2,576,533. 1 sheet of drawings