DD290844A5 - METHOD FOR THE PRODUCTION OF BASE MATERIAL FOR CONDUCTOR PLATES - Google Patents

Abstract

Process for the production of base material for printed circuit boards, which is copper-clad on one or both sides, by pressing prepregs and copper foil in a double belt press. According to the invention, the object is achieved by continuously blending prepregs and copper foil formed from epoxy resin diandicyanate and carrier fabric into laminates in a double belt press. {Base material; Printed circuit boards; Double belt press; continuous pressing; Epoxy resin, medium molecular weight, flame retardant; Diandicyanat; laminating; paint}

Description

Field of application of the invention

The invention relates to an ancestor for the production of base material for printed circuit boards, which is copper-clad on one or both sides, by pre-compression of Proprogs and Kupforfolio In ooror double belt press.

Characteristic of the known state of the art

It is bokannt, base material for Loitorplatton, which is kupforkoschiort oin or on both sides, by continuous pre-pressing of preprogs with Kupforfolio on Doppolbandprosson herzustellon (DD-PS 235151). Due to the achieved substantial reduction of the manufacturing stages compared to the discontinuous production of laminates in props, wio omission of Querschneidons the Propregs and dor Kupferfolio on Formatlängo, dos Verlegons dor Propregpakete, dos construction and Voreinzelns the laminate package as well as the Proßbloche and the Polstorpapiers or dor Dauorpolster , Dios represents a very economical process.

Outside, the laminates obtained by continuous pre-press, in addition to a uniform quality, have a much better surface quality and dimensional stability,

As binder werdon werdon, for example, the known epoxy resin-Hardenor-Beschlouniger combination, such as medium molecular Dianepoxiclharzo with a share of 0.05 to 0.15kg / kg novolak epoxy resins, which may be optionally halogenated, dicyanidamide as a hardener and Dimothylbonzylamin proposed as an accelerator In order to erroichnn the dioxygen required short curing zonnn, additionally as an accelerator imidazole or pyridine derivatives (EP-PS 0158027, US-PS 4670080, DD-PS 235151).

A disadvantage of the proposed epoxy resin hardener-accelerator combinations, the low storage stability or Gebrauchsdaucr the Lackierlösungen and dor prepregs made with them.

This is expressed boispielswoise in a highly fluctuating Harzfluß boim pre-pressing and thus in oinor strongly fluctuating Flächenmasso dor obtained laminates, especially in Dickontoleranzen between the middle and the edge zones of the laminate tape.

In addition, the laminates made at the same throughput speeds in the double belt press often have too high solvent intakes and low glass transition temperatures due to insufficient crosslink density.

Also known epoxy resin Diandicyamat combination, which have so far found only entry into the batch process for laminate production.

Object of the invention

The solution according to the invention should make it possible that the quality of the base material prepared by the process for printed circuit boards and the storage stability of the starting material is substantially improved.

Explanation of the essence of the invention

The invention has for its object to provide a process for the production of base material, which allows the production of double belt presses and is made of a prepreg with one or both sides aufkaschiertor copper foil whose binder system ensures a higher degree of crosslinking, a more stable basis weight and smaller thickness differentials.

According to the invention the object is achieved in that the prepreg pre-dried prior to entry into the nip formed from an epoxy resin-diandicyamate combination and the carrier fabric and with copper foil at a pressure of 2.5 to 8.0 MPa and a temperature in the range of 423 to 483 ° K is pressed.

The advantage here is the use of a flame-retardant epoxy resin.

Of particular advantage is the application of a pressing pressure in the range of 1.0 to 2.0 MPa, a Preßtomperatur of 433-453 ° K and a flow time of 2.5 to 3.5 minutes.

Ausführungsbelsplelo

Dio invention will be explained nühor to Ausführungsbeispiolon below.

OinGlasgowobo with a surface mass of 163g / m is varnished with a varnishing solution according to the Rezopturon listed in dor Tabollo Woiso and dried under the conditions in dor Tabollo angogobonon. Thereafter, Proproglngon oin odor is vorproped on both sides with oinor Cu folio from 35μιη to oom 1,5mm standard laminate under don in the table angcgebonon conditionon.

Dio prepreg and laminates are not available in Tabolle.

Tabollei

Product of equality is the hour of technology

Product 1 b C Product 2 b C O a Resin content (kg) 100 100 Epoxidäquivalont 500 500 Diandicyanat (kg) - - Diandicyamid (kg) 3.3 3.2 Mothylglykol (kg) 80.0 80.0 Acetone (kg) - - Dimothylbonzylamine (kg) 0.15 0.14 2-Mothylimidazol (kg) 0.28 - 2-amino-4-mothylpyridin - 0.30 "erarboitungstag 7 2 7 2 (Lackiorlösung) " 2 433 433 2 433 433 Drying temperature (k) 433 283 278 433 280 278 Basis weight prepreg (g / m ² ) 278 4.7 4.8 278 7.0 7.5 Resin flow prepreg (%) 4.8 42 40.9 7.5 41.8 40.8 Resin content prepreg (%) 40.9 3 30 40.8 3 30 Processing day (prepreg) " 3 473 473 J 473 473 ProßtomperaturCK) 473 3.5 3.5 473 3.5 3.5 Press Press (MPa) 3.5 0.024 31 3.5 0,030 0,025 Thickness tolerance laminate (mm) 0.028 403 405 0,035 400 402 Glass transition temperature ( ⁰ K) 401 0.4 0.7 398 0.6 0.8 Solvent uptake ²¹ (%) 0.3 0.5

1 day of preparation after the day of manufacture

2 N-methylpyrrolidone

3 can not be determined, since due to light edges format reduction

Table 2

Comparative products based on the solution according to the invention

example 1 b C example b C Example 3 b C a a a resin content 100 100 100 epoxide 190 500 190 Diandicyanat 110 41.7 31.4 dicyandiamide - - - methylene glycol - - - acetone 140 141.7 87.6 dimethylbenzylamine - - - 2-methylimidazole - - - 2-amino-4-methyl- pyridine - - - Processing day 7 2 7 2 7, 2 Lackierlösung 2 443 443 2 443 443 2 443 44S drying temperature 443 443 443 Fi ^ chenmasse 279 278 281 280 280 280 prepreg 278 4.0 4.0 280 4.7 4.8 280 Resin flow prepreg 4.0 41.0 41.0 4.8 41.0 41.0 Resin content prepreg 41.0 41.0 Processing day 3 30 3 30 3 30 prepreg 3 200 200 3 200 200 3 200 200 pressing temperature 200 3.5 3.5 200 3.5 3.5 200 3.5 3.5 pressing pressure 3.5 0,010 0,010 3.5 0.019 0019 3.5 0.14 0.1B Thickness tolerance laminate 0,010 472 473 0.019 454 453 0.15 459 459 glass transition temperature 473 0.02 0.02 453 0,030 0,035 453 0.03 0.03 Solvent uptake 0.02 0,035 0.03

to Table 2

Comparative products based on the invention solution

BoispieM b C Example 5 b C a a Harzantoil 100 100 epoxide 500 190 Diandicyanat 11.9 292.6 dicyandiamide - - methylene glycol - - acetone 111.9 392.6 dimethylbenzylamine - - 2-Mothylimidazol - - 2-amino-4-methylpyridine - - Processing day 7 2 7 2 Lackierlösung 2 443 443 2 443 443 drying temperature 443 279 277 443 277 278 Basis weight prepreg 277 278 Resin flow prepreg Resin content prepro Processing day 3 30 3 30 prepreg 3 200 200 3 200 200 pressing temperature 200 3.5 3.5 200 3.5 3.5 pressing pressure 3.5 0.019 0,020 3.5 0.10 " 0,10 ²¹ Thickness tolerance laminate 0,020 444 444 0,10 ²¹ 482 483 glass transition temperature 443 0.05 0.05 483 0.01 0.01 Solvent uptake 0.05 0.01

Claims (3)

1. Ancestors for the production of base material for printed circuit boards, which is copper-clad on one or both sides, by pre-pressing pre-dried Propregs based on epoxy resin combinations and carrier fabric with Kupforfolio in a double belt press, characterized in that dor prepreg formed from an epoxy resin Diandicyanat combination and Trägergewobo and pressed with Kupferfolio under a pressure of 2.5 to 8.0 MPa and a temperature in the range of 423 to 483 ⁰ K. 2. ancestor for the production of base material for printed circuit boards according to claim 1, characterized in that the epoxy resin to be used is flame-retardant. 3. A process for the production of base material for printed circuit boards according to claim 1 and 2, characterized in that the pressing pressure 1.0 to 2.0 MPa, the temperature 433 to 453 ° K and the cycle time 2.5 to 3.5 minutes during prepressing amount.