DD142137A3 - DEVICE FOR SINGLE-SIDED COVERING OF SEMI-FINISHED WASHERS - Google Patents

Abstract

The invention relates to a device for one-sided covering of semiconductor wafers, the other side by means of chemical and / or galvanic processes is processed. The aim of the invention is it, the committee in the chemical processing of semiconductor wafers to lower and achieve higher productivity. The task The invention consists in a device for one-sided Covering and plaguing semiconductor wafers to create a secure cover of a disc surface and a fixed bracket ensured during processing. According to the invention, the task solved that, taking advantage of the vacuum principle, the disc concave is arched by applying to a soft-elastic Disc receiving body is pressed. The device consists of - a hollow body and one or more attached to it on the surface grooved disc receiving body, wherein the grooves through channels with each other and through a bushing and .The cavity are connected to a vacuum system.

Description

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Title of the invention

Device for one-sided masking of semiconductor wafers ·

Field of application of the invention

The invention relates to a device for one-sided masking and plating of semiconductor wafers, which are subjected to galvanic and / or chemical processes. "

Characteristic of the known technical solutions

Both devices and methods for single-sided masking of semiconductor wafers are known in the technological process of semiconductor processes. One known method for covering disc surfaces is to coat the side to be protected with a film which is resistant to aggressive media, preferably lacquer, wax or tar products, for example picein. A disadvantage of this method is the relatively high cost of applying or »detachment of the protective film, Furthermore, it can not be prevented in every PalIe that the aggressive chemicals penetrate under the PiIm and a destructive

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In addition, the above-mentioned covering materials do not meet the purity criteria required in semiconductor fabrication.

Wach the DT-PS 78 287 a device is known, with a one-sided coverage of thin slices ensures and at the same time is given the possibility of Pestschalt the disc during the working process Body, which is compressed by mechanical influence and thus evacuated, a vacuum existiart, which presses through apertures in the receiving surface, the disc to be covered on the plastic body It has proven in this device as a disadvantage that a release of the disc from the receiving surface only by partial lifting of the disk is possible. Destroying already structured chips or the disk by partial or total breakage can not be ruled out.

Furthermore, with this device, it is not always necessary to prevent the aggressive media from penetrating between the disk and the receiving surface and damaging the edge zones of the disk. "

It is respectively (after a device description AMK for AVT 100, VEB Elektromat Dresden, .1974 ·) in the Z _u connexion with the utilization of vacuum, negative pressure for the purpose of locking or Pesthaltens semiconductor wafers known that this is level with a bridge from the lower pressure provided metal bodies are locked in order to prevent slippage during certain operations, for example, two measuring operations on a semiconductor wafer.

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Object of the invention

The aim of the invention is to reduce the Committee in the processing of discs, preferably made of semiconductor material and to increase productivity.

Explanation of the essence of the invention

It is an object of the invention to provide a device for one-sided covering and keeping plaque of semiconductor wafers, which ensures a secure cover of a disc surface and a solid support in the processing of semiconductor wafers. The object is achieved with a device consisting of a body with cavity and a surface-grooved disc receiving body mounted thereon and having the concave shape of the surface of the disc receiving body. It is expedient that the grooves are connected to each other by channels and via a passage and the cavity in the body with a vacuum system.

The device consists of a base body, which consists of a solid plastic material, preferably polyvinylchloride (PVC), and a disc holder body of a soft plastic together. Both parts are firmly connected to one another, for example by gluing.

The main body is a hollow body which has a passage to the disc receiving body mounted thereon and a connection to a vacuum system. By means arranged in this connection pneumatic members, such as pressure gauges and valves, is a defined negative pressure or

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ventilation of the device is reproducible ·

After the semiconductor wafer is placed on the valve in the connection to the vacuum system, a defined negative pressure is established in the device, which acts via the cavity and the passage in the channel-connected grooves by pressing the atmospheric pressure on the wafer of semiconductor material and this into the concave -... · '· ·; molded surface presses. The tension of the disc material counteracts this, whereby the edge zone of the disc acts with increased pressure on the surface and ensures a secure seal on the disc edge. After completion of the machining processes on the semiconductor wafers, the device is ventilated by opening the valve and allows the wafer to be removed from the device. Wheels adhering to the W-elastic surface can be lifted off with the aid of a slight overpressure, whereby damage to the pane can be ruled out.

It is convenient ^ to choose the size of the device so that at the same time find several semiconductor wafers in their place, as well as to provide the inclusion of part discs by the shape of the Scheibenauf body is adapted to the discs.

It is also expedient that several devices according to the invention are combined side by side and / or one behind the other, wherein the supply of the devices must be ensured with negative pressure and optionally with a slight overpressure. As a result, a larger number of semiconductor wafers can be processed simultaneously.

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embodiment

Reference to an exemplary embodiment, the invention is explained in more detail below. The accompanying drawing shows the basic structure of the solution according to the invention, which is applicable in different variants.

A basic body 1 of the device made of plastic material resistant to aggressive inorganic media, preferably PVC, is designed as a hollow body. The circular base area is adapted to the size and shape of the disk so that semiconductor wafers 4 of currently common sizes can be used.

Via a valve, which is arranged together with a pressure gauge in the connection to the vacuum system 2, the device is evacuated and created the condition that the semiconductor wafer 4 is pressed against a disc receiving body 3, since the negative pressure over a cavity 10 and a passage 9 in Grooves 5 comes into effect and is evenly distributed over connecting channels 6. The heddles 5 connected by webs 7 and interconnected with channels are designed to form a concave surface 8. This results in a forced deflection of the semiconductor wafer 4, which in turn causes the edge zone of the disc to act on the wafer receiving body 3 with a greater pressure than that centrally located disc areas and thus creates a safe, well reproducible seal to prevent penetration of chemically-aggressive substances under the disc.

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The embodiment allows a Mehrfachbestückung of the device by the disc receiving body is designed so that, depending on the size and geometry of the semiconductor wafer 4 more discs can be recorded · The geometry of the base body 1 is retained, only the size and the number of disc receiving body 3 is In addition, several "devices are arranged next to and behind one another, which are connected to the vacuum system via a common line. As a result, the number of semiconductor wafers to be processed is substantially increased."

Claims (5)

-7- 204080 claim for invention 1 _# device for one-sided covering and Pesthalten thinner slices, preferably of semiconductor material, comprising a base body with cavity and attached thereto, characterized on the surface with H _u th equipped wheel support body characterized in that the surface (8) of the disc receiving body (3 ) is concavely arched, Device according to item 1, characterized in that the grooves (5) are connected to each other by channels (6) and via a passage (9) and via the cavity (10) in the base body (1) to a vacuum system, 3 »Device according to item 1 and 2, characterized in that the shape of the surface (8) is adapted to the different sizes and shapes of the semiconductor wafers (4), preferably the part discs. 4 # Device according to points 1 to 3i marked in that a plurality of disc receiving bodies (3) are arranged on a base body (1). 5 · Device according to items 1 to 4, characterized in that a plurality of devices according to the invention are combined side by side and / or one behind the other, wherein the vacuum supply can take place via a common device. For this 1 page drawing