DD117488A5 - - Google Patents
Info
- Publication number
- DD117488A5 DD117488A5 DD185707A DD18570775A DD117488A5 DD 117488 A5 DD117488 A5 DD 117488A5 DD 185707 A DD185707 A DD 185707A DD 18570775 A DD18570775 A DD 18570775A DD 117488 A5 DD117488 A5 DD 117488A5
- Authority
- DD
- German Democratic Republic
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
- C23C18/40—Coating with copper using reducing agents
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/42—Coating with noble metals
- C23C18/44—Coating with noble metals using reducing agents
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US464666A US3917885A (en) | 1974-04-26 | 1974-04-26 | Electroless gold plating process |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DD117488A5 true DD117488A5 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1976-01-12 |
Family
ID=23844812
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DD185707A DD117488A5 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1974-04-26 | 1975-04-25 |
Country Status (10)
Families Citing this family (28)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4082908A (en) * | 1976-05-05 | 1978-04-04 | Burr-Brown Research Corporation | Gold plating process and product produced thereby |
| DE2747562A1 (de) * | 1977-10-20 | 1979-05-03 | Schering Ag | Verfahren und anlage zur wiedergewinnung von im abwasser von anlagen zur chemischen oberflaechenbehandlung befindlichen metallen und anderen wertstoffen |
| US4162337A (en) * | 1977-11-14 | 1979-07-24 | Bell Telephone Laboratories, Incorporated | Process for fabricating III-V semiconducting devices with electroless gold plating |
| FR2441666A1 (fr) * | 1978-11-16 | 1980-06-13 | Prost Tournier Patrick | Procede de depot chimique d'or par reduction autocatalytique |
| US4340451A (en) * | 1979-12-17 | 1982-07-20 | Bell Telephone Laboratories, Incorporated | Method of replenishing gold/in plating baths |
| DE3029785A1 (de) * | 1980-08-04 | 1982-03-25 | Schering Ag, 1000 Berlin Und 4619 Bergkamen | Saures goldbad zur stromlosen abscheidung von gold |
| US4337091A (en) * | 1981-03-23 | 1982-06-29 | Hooker Chemicals & Plastics Corp. | Electroless gold plating |
| US4374876A (en) * | 1981-06-02 | 1983-02-22 | Occidental Chemical Corporation | Process for the immersion deposition of gold |
| US4474838A (en) * | 1982-12-01 | 1984-10-02 | Omi International Corporation | Electroless direct deposition of gold on metallized ceramics |
| JPS60179127U (ja) * | 1984-05-09 | 1985-11-28 | ヤンマー農機株式会社 | コンバイン |
| US4822641A (en) * | 1985-04-30 | 1989-04-18 | Inovan Gmbh & Co. Kg | Method of manufacturing a contact construction material structure |
| US4863766A (en) * | 1986-09-02 | 1989-09-05 | General Electric Company | Electroless gold plating composition and method for plating |
| US4798626A (en) * | 1986-09-30 | 1989-01-17 | Lamerie, N.V. | Solutions and creams for silver plating and polishing |
| US4925491A (en) * | 1986-09-30 | 1990-05-15 | Lamerie, N.V. | Solutions and creams for silver plating and polishing |
| US4919720A (en) * | 1988-06-30 | 1990-04-24 | Learonal, Inc. | Electroless gold plating solutions |
| ATE79563T1 (de) * | 1988-11-15 | 1992-09-15 | Holland Biotechnology | Verfahren zur herstellung von elementarsolen. |
| US5130168A (en) * | 1988-11-22 | 1992-07-14 | Technic, Inc. | Electroless gold plating bath and method of using same |
| US4978559A (en) * | 1989-11-03 | 1990-12-18 | General Electric Company | Autocatalytic electroless gold plating composition |
| US4979988A (en) * | 1989-12-01 | 1990-12-25 | General Electric Company | Autocatalytic electroless gold plating composition |
| US5206055A (en) * | 1991-09-03 | 1993-04-27 | General Electric Company | Method for enhancing the uniform electroless deposition of gold onto a palladium substrate |
| US5338343A (en) * | 1993-07-23 | 1994-08-16 | Technic Incorporated | Catalytic electroless gold plating baths |
| EP1245697A3 (de) * | 2002-07-17 | 2003-02-19 | ATOTECH Deutschland GmbH | Verfahren zum aussenstromlosen Abscheiden von Silber |
| JP2004176171A (ja) * | 2002-09-30 | 2004-06-24 | Shinko Electric Ind Co Ltd | 非シアン電解金めっき液 |
| US20060141149A1 (en) * | 2004-12-29 | 2006-06-29 | Industrial Technology Research Institute | Method for forming superparamagnetic nanoparticles |
| US20090139264A1 (en) * | 2007-11-30 | 2009-06-04 | Rachel Brown | Antique jewelry articles and methods of making same |
| US20150345039A1 (en) * | 2015-07-20 | 2015-12-03 | National Institute Of Standards And Technology | Composition having alkaline ph and process for forming superconformation therewith |
| US11579344B2 (en) | 2012-09-17 | 2023-02-14 | Government Of The United States Of America, As Represented By The Secretary Of Commerce | Metallic grating |
| CN102925933B (zh) * | 2012-11-05 | 2015-03-04 | 福州大学 | 一种Au-FeNi两段式合金纳米马达及其制备方法 |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3230098A (en) * | 1962-10-09 | 1966-01-18 | Engelhard Ind Inc | Immersion plating with noble metals |
| US3515571A (en) * | 1963-07-02 | 1970-06-02 | Lockheed Aircraft Corp | Deposition of gold films |
| US3294578A (en) * | 1963-10-22 | 1966-12-27 | Gen Aniline & Film Corp | Deposition of a metallic coat on metal surfaces |
| US3589916A (en) * | 1964-06-24 | 1971-06-29 | Photocircuits Corp | Autocatalytic gold plating solutions |
| US3506462A (en) * | 1966-10-29 | 1970-04-14 | Nippon Electric Co | Electroless gold plating solutions |
| US3482974A (en) * | 1966-12-27 | 1969-12-09 | Gen Electric | Method of plating gold films onto oxide-free silicon substrates |
| US3700469A (en) * | 1971-03-08 | 1972-10-24 | Bell Telephone Labor Inc | Electroless gold plating baths |
| US3697296A (en) * | 1971-03-09 | 1972-10-10 | Du Pont | Electroless gold plating bath and process |
-
1974
- 1974-04-26 US US464666A patent/US3917885A/en not_active Expired - Lifetime
-
1975
- 1975-04-09 MX MX157698A patent/MX146110A/es unknown
- 1975-04-23 CA CA225,269A patent/CA1038559A/en not_active Expired
- 1975-04-24 IT IT49280/75A patent/IT1035454B/it active
- 1975-04-24 GB GB1712775A patent/GB1448659A/en not_active Expired
- 1975-04-24 FR FR7512789A patent/FR2268595B1/fr not_active Expired
- 1975-04-24 JP JP50050163A patent/JPS5818430B2/ja not_active Expired
- 1975-04-25 DE DE19752518559 patent/DE2518559A1/de not_active Ceased
- 1975-04-25 DD DD185707A patent/DD117488A5/xx unknown
- 1975-04-25 BR BR3224/75A patent/BR7502540A/pt unknown
Also Published As
| Publication number | Publication date |
|---|---|
| AU8052375A (en) | 1976-10-28 |
| MX146110A (es) | 1982-05-18 |
| JPS5818430B2 (ja) | 1983-04-13 |
| GB1448659A (en) | 1976-09-08 |
| FR2268595A1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1975-11-21 |
| JPS50149542A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1975-11-29 |
| DE2518559A1 (de) | 1975-11-13 |
| FR2268595B1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1981-03-20 |
| BR7502540A (pt) | 1976-03-03 |
| IT1035454B (it) | 1979-10-20 |
| US3917885A (en) | 1975-11-04 |
| CA1038559A (en) | 1978-09-19 |