CS272649B1

CS272649B1 - Soldering solution

Info

Publication number: CS272649B1
Application number: CS268589A
Authority: CS
Inventors: Milan Rndr Csc Melnik; Jozef Doc Mudr Csc Zlatos; Dusan Marusinec
Original assignee: Melnik Milan; Jozef Doc Mudr Csc Zlatos; Dusan Marusinec
Priority date: 1989-05-02
Filing date: 1989-05-02
Publication date: 1991-02-12
Also published as: CS268589A1

Abstract

The solution concerns replacement of colofonic-based flux soldering by a solution with good physical and soldering qualities. The principle of the soldering solution for soft soldering mainly in electrotechnics and electronics is the fact that it consists of 20 to 40 percent by weight of isopropyl alcohol, from 40 to 60 percent by weight of denaturated ethyl alcohol, from 5 to 10 percent by weight of colofonia and from 3 to 7 percent by weight of cyclohexyl amine.

Description

CS 272649 BlCS 272649 Bl

Vynález sa týká spájkovacieho roztoku na makké spájkovanie elektrotechnických súčiastok různého druhu.BACKGROUND OF THE INVENTION The present invention relates to a brazing solution for the soldering of electrical components of various kinds.

Účelom vynálezu je nahradit kolofóniové spájkovanie taviva, kvalitativně róznorodých vlastností a najma technologicky náročné na proces čistenia plošných spojov po spájkovaní, kedy najma po zostatku, zbytkoch taviva po spájkovaní nastáva korózia a tým po čase znehodnotenie spájkovacieho procesu. Tieto nevýhody sa do istej miery odstraňujú spájkovacími vodorozpustnými tavivamx na makké spájkovanie, ktoré obsahujú 20 až 70 % hmotnosti nízkomolekulárnych alkoholov, 25 až 70 % hmotnosti etylénglykolov ako modifikátorov hustoty, tenzie pár a stability taviva, Sálej obsahujú 2 až 10 % hmotnosti kyseliny fluorovodíkovej připadne fosforečnej a 0,05 až 5 % hmotnosti vysokomolekulárneho polyetylénglykolu ako aditívnu zložku s funkciou plnidla, zmáčadla a saponifikátora.The purpose of the invention is to replace rosin flux soldering, qualitatively diverse properties and, in particular, a technologically demanding process for cleaning PCBs after brazing, in which, in particular, residual flux residues after brazing are subject to corrosion and hence degradation of the brazing process. These drawbacks are somewhat overcome by brazing water-soluble fluxes containing 20 to 70% by weight of low molecular weight alcohols, 25 to 70% by weight of ethylene glycols as modifiers for density, vapor pressure and flux stability. % phosphorous and 0.05 to 5% by weight of high molecular weight polyethylene glycol as an additive component with the function of filler, wetting agent and saponifier.

Podstatou vynálezu je spájkovací roztok na makké spájkovanie elektrotechnických súčiastok pozostávajúci z 20 až 40 % hmot. izopropylalkoholu, 40 až 60 % hmot. denaturovaného etylalkoholu, 5 až 10 % hmot. kolofónie a 3 až 7 % hmot. cyklohexylamínu hydrochloridu. Používanie tohoto spájkovacieho roztoku má celý rad výhod a to, že spájkovaciu masu možno nanášať vefmi rovnoměrně a najma ak je to potřebné vo vefmi tenkých vrstvách, vytvára stálu homogennú pěnu, znižuje tenziu pár fahko prchavých rozpúšťadiel zaručuje dokonalá homogenitu, znižuje teplotu tavenia a teplotu varu aktivačných zložiek, vyznačuje sa dobrou stabilitou pri spájkovacích teplotách.The subject of the invention is a soldering solution for the soldering of electrical components consisting of 20 to 40% by weight. % isopropyl alcohol, 40 to 60 wt. % of denatured ethyl alcohol, 5 to 10 wt. % of rosin and 3 to 7 wt. cyclohexylamine hydrochloride. The use of this solder solution has a number of advantages and the fact that the solder mass can be applied very evenly and, if necessary in very thin layers, creates a stable homogeneous foam, reduces the vapor pressure of the readily volatile solvents ensures perfect homogeneity, activating components, it has good stability at soldering temperatures.

Spájkovací roztok podfa vynálezu je nielen nenáročný na přípravu, ale má vefmi dobré vlastnosti spájkovacie a fyzikálně. Tieto dobré vlastnosti vefmi priaznivo ovplyvňujú najma cyklohexylamín hydrochlorid. Sledoval sa rozny poměr zastúpenia jednotlivých zložiek spájkovacích roztokov.The brazing solution according to the invention is not only easy to prepare, but has very good soldering and physical properties. These good properties have a particularly favorable effect on cyclohexylamine hydrochloride. Various proportions of the components of the brazing solutions were observed.

PříkladExample

Claims

The brazing solution was prepared as follows: to 30 wt. of isopropyl alcohol is added 52.5 wt. % of denatured ethyl alcohol, 7.5% wt. % of colony and finally 5 wt. cyclohexylamine hydrochloride was thoroughly mixed and the solution thus prepared proved to be most suitable for soldering.

The electrotechnical component is immersed in a bath of the brazing solution thus prepared, or simply rubbed with the solution and then soldering can be carried out.

OBJECT OF THE INVENTION

A brazing solder solution, in particular in electrical engineering and electronics, characterized in that it is comprised of 20 to 40 wt. % isopropyl alcohol, 40 to 60 wt. % of denatured ethyl alcohol, 5 to 10 wt. % of rosin and 3 to 7 wt. cyclohexylamine.