CS271886B1 - Unit-built system for electronic device - Google Patents

Abstract

The unit assembly system for electronic devices solves the problem of self-support and solidity, in particular of communication and/or mobile type location devices, which are exposed to the forces generated by the acceleration up to 20,000 ms<-2> and centrifugal forces arising at the rotation up to 20,000 rpm. The unit assembly boards (2a to 2d) includes extending sub-circuits (21), which are interconnected by means of cut-outs (2a) and plug-in members (28) into the self supporting functional subsystem (20) of the box-shaped character. The self-supporting functional subsystem is also connected to the baseboard (1), which is equipped with the topological structure (11), by means of cut-outs (1a) and plug-in members (28). To achieve the required solidity of the unit assembly system, the consecutive soldering points (Ca and Cd) of the sub-circuits (21) and of the topological structure (11) are soldered together. The unit assembly boards (2a to 2d) are in places of mutual contacts and glued to the baseboard (1) with the bottom edges.<IMAGE>

Description

(57) The modular system for electronic devices solves the problem of self-supportingness and stiffness of primarily mobile-type communication and / or location devices, subjected to forces due to accelerations of up to 20 000 ms ‘* and centrifugal forces generated at rotations up to 20 000 rpm. The modular boards (2a to 2d) with adjacent sub-circuits (21) are connected to each other by means of slits (2A) and plug-in members (2B) to a self-supporting box-like functional subsystem (20). The self-supporting functional subsystem is also connected to the base plate (1) provided with the topological structure (11) by means of slots (IA) and plug-in members (2B). In order to achieve the required rigidity of the modular system, the soldering points (Ca and Cd) of the sub-circuits (21) and the topological structure (11) are soldered. The modular panels (2a to 2d) are glued together at their points of contact and are glued to the base plate (1) at their lower edges.

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CS 271886 Bl

The present invention relates to a modular system for electronic devices, in particular a mobile-type communication and / or location device, subjected to forces induced by accelerations of up to 20,000 ms- ² and to centrifugal forces occurring at a rotation of up to 20,000 rpm.

Modular systems for electronic devices composed of a base plate and modular plates mounted thereon are known to be connected to each other either directly or by means of interconnecting plates, all of the plates of the modular system having printed circuit boards forming sub-circuits of the respective electronic device. The interconnection of the individual boards of the modular systems is based on the use of detachable connectors, which allows easy replacement of individual boards as well as their easy repair.

The disadvantage of the existing modular systems is their low mechanical stiffness and the resulting occurrence of electronic system malfunctions. Connector solutions are not suitable for use in mobile devices of all kinds that place considerable demands on the self-supporting and rigidity of modular systems in terms of accelerating forces.

The above-mentioned drawbacks are eliminated by the modular system for electronic devices according to the invention, consisting of a printed circuit board and associated modular boards or auxiliary connecting boards, which are provided with printed circuit boards of sub-circuits on at least one side. SUMMARY OF THE INVENTION The individual modular panels are provided on vertical edges with plug-in members formed as components of the modular tablet and / or in the area of the modular tablet with cut-outs for mutual mechanical connection into a self-supporting functional subsystem of the box-like character. shaped as parts of the modular boards at their lower edge, abutting the base plate with cut-outs for mutual mechanical connection, the adjacent sub-boards of the modular boards and the topological structure of the overall electronic circuit of the base plate being provided with adjacent soldering points.

The advantages of the modular system for electronic devices according to the invention consist in the creation of a solid self-supporting modular system with the necessary shape rigidity, ensuring stability and faultless functioning of the electronic system created thereon, especially for communication and / or location devices of mobile type extremely high accelerating forces.

The modular system for electronic devices according to the invention is further described in the exemplary embodiment by means of the attached drawings. Giant. 1 shows a simplified configuration of a base plate of a modular system with a topological structure with soldering points indicated. Giant. 2 shows a simplified configuration of a modular board of a self-supporting functional system with cut-outs and plug-in members and with a sub-circuit with solder points indicated. Giant. Fig. 3 shows a modular board configuration of a self-supporting functional subsystem to be coupled to the modular board of Fig. 2. 4 illustrates an overall simplified configuration of a modular system wherein a self-supporting functional subsystem consisting of four modular boards is provided on the motherboard.

The base plate 4 of the modular system shown in FIG. 1 is provided with a hinted topographical structure of the total electronic circuit, the terminals of which are provided with solder points Ca, and four slots 4A for connection to the plug-in members 26 forming the individual elements. components of each of the four modular panels 2a., 2b, 2c. 2d. The building blocks 2a and 2b shown in FIGS. 2 and 3 are provided on the left surface with adjacent sub-circuits 21 of the overall electronic circuit of the building block system in the form of a printed circuit board. By interconnecting the two modular panels 2a and 2b with two other modular panels 2c and 2d with interconnected soldering points Cb, Cc, the sub-circuits 21 are formed into a self-supporting functional subsystem 20, shown in FIG.

The self-supporting functional subsystem 20 is connected to the motherboard by means of the slots IA in the motherboard and the members 28 formed therein at the lower edge of adjacent modular panels 2a to 2d, thereby forming the overall modular system shown in Figure 4.

CS 271886 Bl

In the exemplary embodiment of FIG. 4, the reliable interconnection of modular panels 2a to 2d, either ceramic hard or soft plastic clad with copper-clad plastic, is achieved by mechanical bonding through slots 2A of the push-in plug-in members 2B. J2c are formed at the ends of the adjacent sub-circuits 21 at the points of interconnection of the individual building blocks 2a to 2d and mainly by gluing together all the adjacent building blocks 2a to 2d. In order to achieve the required rigidity of the whole modular system, the soldering points Cd of the sub-circuits 21 at the bottom edge of the modular boards 2a to 2d are soldered with the soldering points Ca of the topological structure terminals 11 on the motherboard 2. 2 ·

The modular system for electronic devices according to the invention can be reliably used in all mobile-type devices which are resistant to extremely high mechanical stress, even at the cost of a permanent connection of boards. In particular, it is the action of accelerating forces with an acceleration of up to 20,000 ms and centrifugal forces induced by a rotation of up to 20,000 rpm around an axis passing through the self-supporting subsystem 20 perpendicular to the motherboard.

Claims (1)

SUBJECT OF THE INVENTION A modular system for electronic devices, in particular a communication and / or location device of the mobile type, consisting of a printed circuit board and associated modular boards or auxiliary interconnecting boards, provided with printed circuit boards of at least one side, characterized in that the individual modular panels (2a to 2d) are provided on vertical edges with plug-in members (2B) formed as components of the modular panels (2a to 2d) and / or in the area of the modular panels (2a to 2d) formed by notches (2A) for mutual mechanical connection to a self-supporting box-like functional subsystem (20) provided with plug-in members (2B) formed as components of the modular boards (2a to 2d) at their lower edge abutting the base plate (1) with cutouts (IA) formed thereon mechanically connected, taking on each other The subassemblies (21a to 21d) of the modular boards (2a to 2d) and the topological structure (11) of the overall electronic circuit of the motherboard (1) are provided with successive soldering points (Ca, Cb, Cc, Cd).