CS239225B1 - Line for encapsulation of microelectronic components in plastic cases - Google Patents

Abstract

The purpose of the invention is to increase the technical and economic level of encapsulation of microelectronic components. The stated purpose is achieved by a line for encapsulating, in particular, microelectronic components into plastic casings, the essence of which is that a rectilinear conveyor of the base frames is arranged transversely next to the encapsulation press and on the other side is a mold cleaning mechanism, which are connected by a guide track. A return conveyor of tablets is located behind the encapsulation press.

Description

The present invention relates to a solution for encapsulating, in particular, microelectronic components in plastic housings.

So far, the handling of the microelectronic components is done by manual manipulation · The operator of the packaging device reloads the loading frames from the loading position into the heating furnace and into the packaging press · Also handling 8 tablets ea is done manually * Disadvantages of the manual manipulation are considerable physical effort and danger operator with harmful encapsulating material

These drawbacks are overcome and the problem is solved by a line for encapsulating, in particular, microelectronic components according to the invention, in which the transverse guide of the capsule press is a rectilinear conveyor of loading frames, and a mold cleaning mechanism, the mold cleaning mechanism is interconnected by a guide track * A tablet return conveyor is located behind the capsule press *

A line for encapsulating especially microelectronic components in plastic cases ensures that all handling operations are performed automatically, thereby relieving the operator from all the stressful and harmful work * Another advantage of the device is the possibility of using a more powerful encapsulating press and large-scale mold, thus increasing performance

In the attached drawing, an exemplary line for encapsulating integrated circuits in plastic housings is shown in the drawing.

239 22S

The line for encapsulating the integrated circuits in the plastic casings consists of a capsule press 1, on which the slide 2 and the top plate 3 is fixed in a two-piece mold 4. On the left side of the capsule press 1 is a rectilinear conveyor 5 6 of the parts and a preheating furnace 7 is located on the rear part. Above the straight conveyor 5 in the working space of the sleeve 1 a guide track 9 extends on the right side outside the sleeve 1. The guide track is mounted on pillars 10 by a sleeve. A transverse support 8 is mounted at the right end of the guiding track 9. On the right side of the guiding track 9, there is a purging mechanism 14 on the back of the press. The return conveyor 14 comprises a tablet dispenser 13 in the loading position 17. , high frequency heating of 12 tablets from which the path leads to the injection chamber 15 of the mold 4 of the encapsulating lie 1;

The function of the line for encapsulation of integrated circuits in plastic cases is as follows. Starting from the state of ks3 the encapsulation mold 4 is open, empty, heated to working temperature and the loading frame 16 loaded with encapsulating parts is in preheating furnace 7. frame 16 and a dose of tablets is prepared in the RF heating 12 on the tablet return conveyor 14;

After starting the line, the cleaning mechanism 11 is actuated, which is moved along the guide track 9 into the open mold space 4, which is mechanically cleaned and returned to the initial position. After visual inspection of the cleanliness of the mold 4, the line is restarted. filled and preheated foundation frame 16 with components from the preheating furnace 7 to the transverse support 8, which transports it along the guide track 9 to the lower part of the open mold 4 and immediately returns to the starting position. closes the mold 4 with the set force · When the set closing force is reached, the high-frequency heating of 12 tablets is automatically started, which preheats the dose of tablets and transports it to the injection chamber 15 of the mold 4.

- 4,239,225 of the chamber 15 begins the actual encapsulation process *, whereby the molten encapsulant is pressed into the cavities of the mold 4 under pressure.

In this state, the mold 4 remains until the encapsulant has cured. After the dispensing of the preheated tablets, the tablet return conveyor 14 is moved to the loading position 17 where the dispenser 13 loads a new batch of tablets to be transferred to the high frequency heating 12. the second support frame 16 is transported to the preheating furnace 7 by means of a casing and by means of a straight conveyor 5 ea. After completion of the casing limited by the curing time of the casing mass ea, the mold 4 opens the casing press 1 via a slide 2. enters the open mold space 4 grasping the base frame 16 with encapsulated e-mails and transporting it to a straight conveyor 5, which then moves the base frame 16 to the loading station 6 where the e-mailing molding is removed, the base frame 16 is cleaned and filled with a new batch of parts The preheating frame 16 and the encapsulated materials leave the mold space 4 and actuate the cleaning mechanism 11 of the mold 4 and repeat the encapsulation cycle.

Claims (1)

BRIEF DESCRIPTION OF THE INVENTION 239 223 A line for encapsulating particularly microelectronic plastic housing components consisting of a casing press for a friction conveyor of a loading frame, a cleaning mechanism and a tablet return conveyor characterized in that the transversely extending casing press (1) is arranged in a straight line to a reading mechanism (11) is provided on the other side of the sheathing press (1), and a reading mechanism (11) is provided on the other side of the sheathing press (1), wherein the linear conveyor (5) of the loading frames (16), and a molding mechanism (11) are guided by a guide track (9), while a return conveyor (14) of the tablets (1) is located behind the housing press (1).