CS212924B1 - A method of treating a metal chip packet - Google Patents

Abstract

The invention relates to a method of treating a metal chip package, which ensures an increase in the compactness of the package. The essence of the method of treating a metal chip package is that a package manufactured in a conventional manner is placed in a high-frequency field, where at least a part of the surface layer of the package is heated, locally welded and strengthened. Another essence of this method is that the package is finally pressed.

Description

(54) Method of modifying the metal chip packet

BACKGROUND OF THE INVENTION The present invention relates to a method for modifying a metal chip packet to increase packet compactness.

The essence of the method of treating the metal chip packet is that the conventional packet produced is inserted into a high-frequency field, where at least a portion of the surface layer of the packet is heated, locally welded and strengthened. Another principle of this method is that the packet is still compressed at the end.

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The invention relates to a method for treating a metal chip packet. Processing of metal chips with. At present, it is carried out either by briquetting on briquetting presses or by baling the chips together with other steel waste on baling presses. Briquetting presses require demanding chip treatment prior to briquetting and very high pressures must be used to ensure consistency. The second most widespread method, where the chips are mixed with other well compressible waste, thus allows the chips to be processed into packets with low packet consistency.

The advantage of this method of chip processing is the high performance of the baler at lower operating costs; The main disadvantage of briquetting is the lower density and contamination of the chips with other metal waste * *.

Another known type of chip treatment is their pressing in sheet metal containers. The advantage of this technology is the ability to ensure consistency at known pressures; the drawback is the consumption of packaging materials and the relatively complex production equipment. Another known method is to pack the chips after they have been preheated in the original untreated state to a temperature of 700 ° C. The advantage of this technology is to ensure good packet consistency at low pressing pressures, the disadvantage is the need for perfect heating of the entire packed amount of chips.

These drawbacks are eliminated by a method of metal-chip packet conditioning, which is based on the fact that a conventional packet is inserted into a high-frequency field where at least a portion of the surface layer of the packet is heated, welded and finally consolidated. Another object of the invention is that the packet is finally compressed.

Examples of a possible method of processing packets according to the invention are shown in FIGS. 1 and 2 in longitudinal and cross-sectional views of the packet. The packet in Fig. 1 of the cuboid is formed by the core Ϊ of the packet and the surface thermally or thermomechanically treated layer 2. The layer 2 covers part of the surface of the packet. Layer 2 has different mechanical properties than the packet core. The roller-shaped package in FIG. 2 consists of a core 1 and a surface thermally or thermally-mechanically treated chip layer. The chip layer 2 passes continuously in the core 1 of the packet and in terms of both the mechanical and metallographic properties of the chips and the arrangement of the chips in the packet as a whole.

Claims (2)

SUBJECT OF THE INVENTION A method of treating a metal chip packet characterized in that a conventional packet ee is inserted into a high frequency field where at least a portion of the surface layer of the packet is heated, welded and finally consolidated. 2. A method according to claim 1, characterized in that the packet is finally compressed.