CS159563B1 - - Google Patents

Info

Publication number
CS159563B1
CS159563B1 CS9004A CS900472A CS159563B1 CS 159563 B1 CS159563 B1 CS 159563B1 CS 9004 A CS9004 A CS 9004A CS 900472 A CS900472 A CS 900472A CS 159563 B1 CS159563 B1 CS 159563B1
Authority
CS
Czechoslovakia
Application number
CS9004A
Other languages
Czech (cs)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to CS9004A priority Critical patent/CS159563B1/cs
Priority to CH1728673A priority patent/CH565453A5/xx
Priority to DD175285A priority patent/DD108173A5/xx
Priority to FR7344631A priority patent/FR2327640A1/fr
Priority to US05/427,225 priority patent/US3952797A/en
Priority to JP744804A priority patent/JPS5422875B2/ja
Priority to DE2364773A priority patent/DE2364773C2/de
Priority to GB6007973A priority patent/GB1413922A/en
Priority to SE7317603A priority patent/SE394344B/xx
Publication of CS159563B1 publication Critical patent/CS159563B1/cs
Priority to US05/596,588 priority patent/US3989095A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F13/003—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by using permeable mass, perforated or porous materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Thermal Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Dispersion Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Details Of Measuring And Other Instruments (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
CS9004A 1972-12-28 1972-12-28 CS159563B1 ( )

Priority Applications (10)

Application Number Priority Date Filing Date Title
CS9004A CS159563B1 ( ) 1972-12-28 1972-12-28
CH1728673A CH565453A5 ( ) 1972-12-28 1973-12-10
DD175285A DD108173A5 ( ) 1972-12-28 1973-12-12
FR7344631A FR2327640A1 (fr) 1972-12-28 1973-12-13 Dispositif pour refroidir des composants semi-conducteurs
US05/427,225 US3952797A (en) 1972-12-28 1973-12-21 Semi conductor cooling system
JP744804A JPS5422875B2 ( ) 1972-12-28 1973-12-25
DE2364773A DE2364773C2 (de) 1972-12-28 1973-12-27 Einrichtung zum Kühlen von Leistungs-Halbleiterbauelementen
GB6007973A GB1413922A (en) 1972-12-28 1973-12-28 Cooling system for semiconductor devices
SE7317603A SE394344B (sv) 1972-12-28 1973-12-28 Anordning for kylning av halvledarkomponenter
US05/596,588 US3989095A (en) 1972-12-28 1975-07-17 Semi conductor cooling system

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CS9004A CS159563B1 ( ) 1972-12-28 1972-12-28

Publications (1)

Publication Number Publication Date
CS159563B1 true CS159563B1 ( ) 1975-01-31

Family

ID=5441334

Family Applications (1)

Application Number Title Priority Date Filing Date
CS9004A CS159563B1 ( ) 1972-12-28 1972-12-28

Country Status (9)

Country Link
US (1) US3952797A ( )
JP (1) JPS5422875B2 ( )
CH (1) CH565453A5 ( )
CS (1) CS159563B1 ( )
DD (1) DD108173A5 ( )
DE (1) DE2364773C2 ( )
FR (1) FR2327640A1 ( )
GB (1) GB1413922A ( )
SE (1) SE394344B ( )

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5239849A (en) * 1975-09-25 1977-03-28 Meidensha Electric Mfg Co Ltd Cooling apparatus
GB2066487B (en) * 1979-12-18 1983-11-23 Philips Electronic Associated Alignment of exposure masks
US4694119A (en) * 1983-09-07 1987-09-15 Sundstrand Data Control, Inc. Heat shielded memory unit for an aircraft flight data recorder
GB2151769B (en) * 1983-12-21 1987-11-04 Marconi Electronic Devices Heat sink arrangement
DE3642723A1 (de) * 1986-12-13 1988-06-23 Grundfos Int Statischer frequenzumrichter, insbesondere frequenzumrichter zur steuerung und/oder regelung von leistungsgroessen eines elektromotors
DE3642727A1 (de) * 1986-12-13 1988-06-23 Grundfos Int Unterwasser-motorpumpe
DE3642729C3 (de) * 1986-12-13 1997-05-07 Grundfos Int Pumpenaggregat zur Förderung von Flüssigkeiten oder Gasen
DE3642726A1 (de) * 1986-12-13 1988-06-23 Grundfos Int Drehzahlgeregeltes pumpenaggregat
US5308920A (en) * 1992-07-31 1994-05-03 Itoh Research & Development Laboratory Co., Ltd. Heat radiating device
US5289694A (en) * 1993-02-26 1994-03-01 At&T Bell Laboratories Circuit card mounting assembly
US5472043A (en) * 1994-03-22 1995-12-05 Aavid Laboratories, Inc. Two-phase component cooler with radioactive initiator
US20040011509A1 (en) * 2002-05-15 2004-01-22 Wing Ming Siu Vapor augmented heatsink with multi-wick structure
GB2404009B (en) * 2003-07-17 2005-06-15 Enfis Ltd Cooling method and apparatus
US7353860B2 (en) * 2004-06-16 2008-04-08 Intel Corporation Heat dissipating device with enhanced boiling/condensation structure
US20060196640A1 (en) * 2004-12-01 2006-09-07 Convergence Technologies Limited Vapor chamber with boiling-enhanced multi-wick structure
US8176972B2 (en) * 2006-08-31 2012-05-15 International Business Machines Corporation Compliant vapor chamber chip packaging
WO2008109804A1 (en) * 2007-03-08 2008-09-12 Convergence Technologies Limited Vapor-augmented heat spreader device
RU2566679C1 (ru) * 2014-07-29 2015-10-27 Частное образовательное учреждение дополнительного профессионального образования "Саранский Дом науки и техники Российского Союза научных и инженерных общественных организаций" (ЧОУ ДПО "Саранский Дом науки и техники РСНИИОО") Система жидкостного охлаждения силового полупроводникового прибора
CN113513934B (zh) * 2021-06-30 2022-05-06 西安交通大学 一种基于双动力驱动强化传热的重力热管

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1714910U (de) * 1953-10-19 1956-01-12 Licentia Gmbh Elektrisch unsymmetrisch leitendes system.
US3298427A (en) * 1964-12-24 1967-01-17 Robert A Erb Method and apparatus for dropwise condensation
CA926033A (en) * 1969-04-01 1973-05-08 Sebastian W. Kessler, Jr. Device transcalent assembly
SE354943B ( ) * 1970-02-24 1973-03-26 Asea Ab
SE350874B ( ) * 1970-03-05 1972-11-06 Asea Ab
US3673306A (en) * 1970-11-02 1972-06-27 Trw Inc Fluid heat transfer method and apparatus for semi-conducting devices
US3834454A (en) * 1971-02-13 1974-09-10 Bbc Brown Boveri & Cie Cooling arrangement for thyristor discs
CH528817A (de) * 1971-03-11 1972-09-30 Bbc Brown Boveri & Cie Halter für mindestens ein scheibenförmiges Halbleiterelement
US3739235A (en) * 1972-01-31 1973-06-12 Rca Corp Transcalent semiconductor device

Also Published As

Publication number Publication date
JPS5422875B2 ( ) 1979-08-09
FR2327640B1 ( ) 1978-03-24
DE2364773C2 (de) 1982-06-24
DE2364773A1 (de) 1974-07-11
JPS4998584A ( ) 1974-09-18
GB1413922A (en) 1975-11-12
SE394344B (sv) 1977-06-20
FR2327640A1 (fr) 1977-05-06
CH565453A5 ( ) 1975-08-15
US3952797A (en) 1976-04-27
DD108173A5 ( ) 1974-09-05

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