CN87200235U - Combined multistage refrigeration set - Google Patents
Combined multistage refrigeration set Download PDFInfo
- Publication number
- CN87200235U CN87200235U CN87200235U CN87200235U CN87200235U CN 87200235 U CN87200235 U CN 87200235U CN 87200235 U CN87200235 U CN 87200235U CN 87200235 U CN87200235 U CN 87200235U CN 87200235 U CN87200235 U CN 87200235U
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- CN
- China
- Prior art keywords
- semiconductor
- power supply
- refrigeration
- utility
- model
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- 238000005057 refrigeration Methods 0.000 title claims abstract description 27
- 239000004065 semiconductor Substances 0.000 claims abstract description 33
- 238000007710 freezing Methods 0.000 claims abstract description 8
- 230000008014 freezing Effects 0.000 claims abstract description 8
- 230000006835 compression Effects 0.000 claims description 10
- 238000007906 compression Methods 0.000 claims description 10
- 230000003247 decreasing effect Effects 0.000 claims 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 6
- 238000012360 testing method Methods 0.000 abstract description 5
- 238000002474 experimental method Methods 0.000 abstract description 2
- 239000000463 material Substances 0.000 abstract 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 4
- 238000001816 cooling Methods 0.000 description 4
- 229910052731 fluorine Inorganic materials 0.000 description 4
- 239000011737 fluorine Substances 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 238000003466 welding Methods 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 2
- 238000005265 energy consumption Methods 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 230000008646 thermal stress Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000005679 Peltier effect Effects 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 239000004035 construction material Substances 0.000 description 1
- 239000000498 cooling water Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005485 electric heating Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000011056 performance test Methods 0.000 description 1
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Abstract
The utility model discloses a combined multistage refrigeration set, namely a refrigerating plant and system which comprises a compressing and freezing set and a semiconductor refrigerator. The combined multistage refrigeration set does not need to cool by water and can use a single-phase source. The utility model has the advantages of convenient operation, high speed, high reliability, high efficiency, low cost and saved power consumption, and simultaneously refrigerating capacity is large. Direct current can be supplied by adopting a switching power supply so that the volume of the power supply is reduced. Ripple coefficient is small, performance is good and temperature is low. The utility model is used for test stands, instruments and meters which are needed to conduct scientific experiments and material properties tests under cold conditions. The combined multistage refrigeration set provides a low-temperature cold source with an excellent control performance.
Description
The utility model belongs to the multistage freezing unit of the freezing and peltier effect of applied compression.
Multistage low temperature refrigerator group is total head compression type refrigerating or all-semiconductor refrigeration normally.The compression-type refrigeration unit is made up of compressor, condenser, evaporimeter, choke valve, bulky, and multistage compression-type refrigeration unit not only complex structure but also control performance are poor, particularly wish to get when being lower than-70 ℃ low temperature, need with cascade refrigeration unit and two kinds of cold-producing mediums, cause structure more complicated, heavy, be not suitable for doing the low-temperature receiver of test instrumentation.The all-semiconductor refrigerating plant, three grades can reach-70 ℃, but must use water cooling, drag a water pipe very inconvenient, the in short supply and regional difficulty that just more increased of cold weather at the water source; Powerful three level semiconductor refrigerating plant thermal stress are big, and poor reliability and use the three-phase bridge full-wave rectification usually in order to obtain little, the high-power dc source of ripple factor causes power volume big and heavy.
The purpose of this utility model is the refrigeration system that semiconductor of design and compression mix, and selects the optimum Match of refrigeration at different levels, so that a not water to be provided, adopts single phase poaer supply, and cooling is rapid, the low temperature cold source that unfailing performance is good.
The first order refrigeration of this hybrid multistage low temperature refrigerator group is by compressor, fan, condenser, capillary-compensated, the freezing unit of compression that evaporimeter is formed, second level refrigeration is by evaporimeter, the semiconductor cooler that the semiconductor refrigerating piece is formed, below the semiconductor refrigerating pieces that successively decrease by refrigerating capacity at different levels form.The hot junction of second level semiconductor refrigerating piece is by through transpiration-cooled in evaporimeter of one-level compressor compresses, condensed working media.Working media can be used fluorine Lyons 12, fluorine Lyons 22,502 or other cold-producing mediums.
The semiconductor cooler of hybrid multistage low temperature refrigerator group can adopt Switching Power Supply to supply with direct current, and this power volume is little, and ripple factor is little, the efficient height.
The mixed refrigerating device group has been brought into play the superiority of compression and semiconductor refrigerating, makes it to be in optimum Working.At first, prescinded semiconductor refrigerating the water pipe that must drag, greatly facilitate operation; One-level refrigeration has adopted the compression freezing type, and the unit refrigerating capacity is increased, and refrigerating speed is accelerated and greatly reduced cost; Mix unit and can obtain generally more unobtainable-70 ℃～80 ℃, even the low temperature cold source of low temperature more, and because the little reliability that improves refrigeration unit of semiconductor refrigerating piece thermal stress; The employing Switching Power Supply has not only reduced the volume of power supply, and has replaced three phase mains with single phase poaer supply, has reduced ripple factor again simultaneously, has improved power source performance.Mix the unit power consumptive province, it is about 50% generally can to save energy consumption, is rarely seen stable cryogenic refrigeration systems both at home and abroad.
This mixed refrigerating device group is installed in the instrument and meter of testing under the experimental bench that needs to carry out scientific experiment under cryogenic conditions and the low temperature, the mensuration of oil freezing point, cold filter plugging point, pour point for example, the rubber brittleness test, the performance test of construction material and the demarcation of low-reading thermometer etc. provide control performance good low temperature cold source.
Accompanying drawing has been described an embodiment of the present utility model.
Fig. 1 is the structure chart of hybrid multistage low temperature refrigerator group.
Fig. 2 is the system diagram of hybrid multistage low temperature refrigerator group.
This is to mix unit is used for the oil kryoscopy as low-temperature receiver a embodiment.
Compressor (1), fan (2), condenser (3), capillary-compensated (4), evaporimeter (5), fan electromotor (9), Filter dryer (10) has been formed first order refrigeration, evaporimeter (5), semiconductor refrigerating piece (6) has been formed second level refrigeration, and semiconductor refrigerating piece (7) has been formed third level refrigeration.Four group of second third level semiconductor refrigerating piece quadrate formed cold well (11).First order compression freezing type refrigeration unit power is 200W, second level semiconductor refrigerating piece (6) is the ceramic component that is become 50 * 50 * 10.5mm by the semiconductor refrigerating element assembly welding of 18 couples of 6 * 6 * 5mm, third level semiconductor cold (7) is the ceramic component by the element And joint group weldering of two groups of 5 couples of 5 * 5 * 6mm, and the second level and the third level are with 93 ℃ of scolding tin assembly weldings.The evaporimeter that 65 * 65 * 12mm that makes with red copper is square (5) is with second level semiconductor refrigerating piece (6) assembly welding.The compressed machine of cold-producing medium fluorine Lyons steam (1) compression enters condenser (3) condensation, and condensate liquid enters evaporimeter (5) evaporation through capillary-compensated (4).Four evaporimeters are that two and two polyphones connect.Enter the liquid freon of evaporimeter (5), the heat that absorbs second level semiconductor refrigerating piece (6) hot junction by evaporation makes it cooling, and gaseous fluorine Lyons returns compressor (1), so carries out closed circulation, as Fig. 2.Second, third level semiconductor refrigerator is supplied with the 25A electric current by Switching Power Supply (8), and voltage is reduced to about 5.6V.The secondary semiconductor temperature difference electric heating pump of four groups of semiconductor cooler compositions continues temperature is descended, and makes cold well temperature reach-70 ℃～-80 ℃.
The power ratio of first order compression-type refrigeration and second, third level semiconductor refrigeration is 1.4～1.6:1, and Switching Power Supply power is 150W, ripple system＜1%, and the size of Switching Power Supply is 250 * 180 * 100mm.This embodiment compares with the full compression formula refrigeration unit of said function, and simple in structure, volume is little, and is in light weight; To compare cost low with the all-semiconductor refrigerator, and cooling is fast, and energy consumption is low, good reliability.Hybrid power consumption is 350W, and all-semiconductor is 650-700W, economizes on electricity about about 50%.Hybridly when 30 ℃ of environment temperatures, can drop to-70 ℃ in 50 minutes, can drop to-80 ℃ during 15 ℃ of environment temperatures, and the all-semiconductor formula be when cooling water is 25 ℃, reduced to-70 ℃ of need 1 and a half hours, desiring to reduce temperature need be with 4 grades of refrigeration again, and cost can be multiplied, and reliability is poorer.
Claims (2)
1, a kind of multistage low temperature refrigerator group is made up of semiconductor refrigerating piece and three-phase bridge full-wave rectifier power supply that refrigerating capacity is successively decreased.It is characterized in that first order refrigeration is the freezing unit of compression.Second level refrigeration is by the evaporimeter (5) of first order refrigeration unit, the semiconductor cooler that semiconductor refrigerating piece (6) is formed, below the semiconductor refrigerating pieces that successively decrease by refrigerating capacity at different levels form.
2,, it is characterized in that semiconductor cooler adopts Switching Power Supply (8) according to the described hybrid multistage low temperature refrigerator group of claim 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN87200235U CN87200235U (en) | 1987-01-19 | 1987-01-19 | Combined multistage refrigeration set |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN87200235U CN87200235U (en) | 1987-01-19 | 1987-01-19 | Combined multistage refrigeration set |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN87200235U true CN87200235U (en) | 1987-10-21 |
Family
ID=4816693
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN87200235U Expired - Lifetime CN87200235U (en) | 1987-01-19 | 1987-01-19 | Combined multistage refrigeration set |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN87200235U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101690902A (en) * | 2009-09-28 | 2010-04-07 | 秦丙泉 | Ultralow temperature ice trough |
| CN1603718B (en) * | 2003-07-31 | 2010-05-05 | 高能加速器研究所 | Method for cooling an article using a cryocooler and cryocooler |
| CN110094899A (en) * | 2019-05-23 | 2019-08-06 | 哈尔滨工业大学 | A kind of temperature control device for material at low temperature surface characteristic research |
-
1987
- 1987-01-19 CN CN87200235U patent/CN87200235U/en not_active Expired - Lifetime
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1603718B (en) * | 2003-07-31 | 2010-05-05 | 高能加速器研究所 | Method for cooling an article using a cryocooler and cryocooler |
| CN101690902A (en) * | 2009-09-28 | 2010-04-07 | 秦丙泉 | Ultralow temperature ice trough |
| CN101690902B (en) * | 2009-09-28 | 2013-10-16 | 秦丙泉 | Ultralow temperature ice trough |
| CN110094899A (en) * | 2019-05-23 | 2019-08-06 | 哈尔滨工业大学 | A kind of temperature control device for material at low temperature surface characteristic research |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CX01 | Expiry of patent term |