CN85204855U

CN85204855U - Mechanism for automatic transfer plate

Info

Publication number: CN85204855U
Application number: CN 85204855
Authority: CN
Inventors: 严金龙; 汤德余; 沈国雄; 吴钰铭; 蔡根寿
Original assignee: Shanghai Institute of Metallurgy of CAS
Current assignee: Shanghai Institute of Optics and Fine Mechanics of CAS
Priority date: 1985-10-26
Filing date: 1985-10-26
Publication date: 1986-11-05

Abstract

The utility model relates to a mechanism for automatic transfer plate, which is the improvement of the mechanism for transfer plate of a semiconductor processing device and belongs to the processing devices for manufacturing semiconductors. A transfer rod robot manipulator and a lifter top plate rod are connected with a microcomputer, the plates can be sent automatically, and the palates can be taken back continuously after processed. The utility model has the advantages of simple structure, convenient operation and no chippings. The plates are homogeneous and uniform after processed. The mechanism for automatic transfer plate is suitable for the devices which need the plates to be transferred in semiconductor manufacturing process, such as plasma etching devices, reactive ion etching devices, chemical vapor deposition devices, magnetron sputtering devices, etc.

Description

Mechanism for automatic transfer plate

The invention relates to the improvement of transmission sheet mechanism in the semiconductor manufacturing equipment, belong to semiconductor fabrication process equipment.

In the semiconductor fabrication process process, often need in the vacuum environment of cleaning, handle, process flaky material.For in the chamber that prevents to deal with the work because of frequent load exposes staining that air causes, generally before the vacuum treatment operating room, all have prechamber to be communicated with it.Slice, thin piece is packed in prechamber or is taken out.In order to guarantee the high-quality of product, make slice, thin piece be in processing in the vacuum environment of cleaning all the time, the equipment that has has the multi-stage vacuum chamber, in each vacuum chamber, finish respectively and deal with processing or detection separately, develop into semiconductor vacuum continuous processing technology equipment.For example the Japan Patent spy opens the equipment that the invention of clear 58-77239 is exactly this continuous processed.Thin slice transmits in vacuum chamber, and people have adopted diverse ways and mechanism.In equipment such as plasma etching, chemical vapour deposition (CVD), the employing that has belt transmission, mechanical pinch-grip agency.What must draw attention to is to adopt the vacuum pinch-grip agency directly to catch thin slice to transmit and tend to make slice, thin piece cracked.Thus, the Japan Patent spy opens clear 58-118124 and has invented " thin slice stowage ".Transmit, put fork, lifting top flat bar, normalization annulus and mechanical gripping arm by belt and form transmission sheet mechanism.The advantage of this mechanism is, cancelled the gathering sill of pulldown in the direct pulldown transfer approach, thereby made slice, thin piece in processing, can not produce defective because non-uniform electric, temperature distributing disproportionation that gathering sill causes are even.Simultaneously, also make the very high machining of required precision obtain simplifying behind the cancellation gathering sill.Secondly, this mechanism has adopted the normalization annulus to transmit, and has avoided mechanical gripping arm directly to grasp slice, thin piece fully, has solved the fragment problems in transmitting.But still there is big weak point in the transmission sheet mechanism after this improvement invention.At first, the slice, thin piece that sends from belt must pass through lifting, swinging fork transmission, normalization annulus load, gripping arm and pick up annulus and send into multiple working procedures such as work of treatment chamber, seem quite loaded down with trivial details, complex structure, operation is also inconvenient.Secondly, the words that leave mechanical gripping arm space on the normalization annulus also can influence the uniformity of slice, thin piece processing.The present invention has done further improvement for this reason.

The objective of the invention is, complex mechanisms such as former feed belt, swinging fork, lifting top flat bar, normalization annulus and mechanical gripping arm are combined together, link with simple and effective driven rod manipulator and lifting top flat bar and microcomputer and transmit thin slice automatically with direct convenience ground.

The present invention is finished by the mode as Fig. 1: take out slice, thin piece the film magazine (4) of the driven rod manipulator (2) that links with microcomputer from the film magazine crane (5) that links with microcomputer, the flat fork (11) of driven rod manipulator front portion is held slice, thin piece (13).Because flat the sticking before the manipulator is provided with anchor point, so the slice, thin piece that takes off from film magazine is in the centre of fork.Then, driven rod is by screw mandrel or pneumatic, magnetic driving mechanism (3) drive operation, the flat slice, thin piece of sticking is admitted to the rotating light-operated location of processing chamber (7), the top of temperature control workbench double as bottom electrode (10).Also the workbench that links with microcomputer locates, and slice, thin piece just in time is in the top of lifting top flat bar (14).Slide glass seat (15) on the push rod of rise lifting push rod (14) back is with the flat fork of slice, thin piece top from the manipulator front portion, and at this moment manipulator is extracted out, returns to prechamber.The slice, thin piece that is on the slide glass seat is steadily fallen along with the landing of push rod.Because slide glass seat plane and place, workbench plane are at grade, the slice, thin piece and the platform plane that fall are close to naturally.Transmit in this way, slice, thin piece neither can damage cracked, can not stay external carbuncle again, and having got rid of the people is the various defect factors that cause.After the slice, thin piece processing is finished, open the valve (6) that leads to the chamber of dealing with the work.Rise push rod (14) slide glass seat (15) with slice, thin piece jack-up again.The driven rod manipulator runs to the processing chamber, the flat machinery fork of its front portion injects the slice, thin piece below, after the landing of lifting push rod, thin slice is in situ gone up by flat mechanical hand rest again, return the driven rod manipulator, slice, thin piece is put back in the film magazine on the film magazine crane (5).Transmit so one by one after the slice, thin piece of predetermined number is sent into or withdrawed from and stop automatically.

This transmission sheet method of the present invention, mechanical structure is clear simple.Driven rod manipulator, the lifting of film magazine frame, rotating light-operated location workbench and lifting top flat part link with microcomputer, and be easy to operate.Mechanical Component Design in addition, processing are also than being easier to.Particularly transmit and reduced failure rate after operation is simplified, can fragment.In addition, the workbench of slice, thin piece and double as electrode is close to, and the slice, thin piece uniformity after the processing has reached more satisfactory result.

Fig. 1 is the transmission sheet structural scheme of mechanism.In prechamber 1, driven rod manipulator 2 is by screw mandrel or pneumatic, magnetic drive device 3 drive operations.The film magazine 4 that is contained on the film magazine crane 5 is used to provide the slice, thin piece of processing or collects the slice, thin piece of completion.Vacuum valve 6 is valves of passage between prechamber and the vacuum treatment Processing Room.Comprise water-cooled top electrode 9 in the vacuum treatment Processing Room 7, lifting top flat bar 14 under rotating light-operated location temperature control workbench double as water-cooled bottom electrode 10 and the workbench, slide glass seat 15 is arranged on the platform, the number of slide glass seat can be on demand and slice, thin piece diameter, workbench size design become a plurality of.The 16th, the prechamber bleeding point, the 17th, processing chamber air inlet, the 18th, the top electrode cooling water outlet and inlet, the 19th, the bottom electrode cooling water outlet and inlet, the 20th, the bottom electrode radome, the 8th, the processing chamber interface of bleeding, 13 is slice, thin piece.

Fig. 2 is the driven rod manipulator.Comprising the flat machinery fork 11 of supporting spring, determine the just unlikely anchor point that departs from 12 of slice, thin piece and be placed on the slice, thin piece 13 that flat machinery is stuck of flap position.

Fig. 3 is the rotating light-operated location temperature control workbench and the lifting top flat bar part of double as bottom electrode.Comprise rotating light-operated location temperature control workbench double as water-cooled bottom electrode 10; Accept the slide glass seat 15 of slice, thin piece on lifting push rod 14 and the push rod.19 is inlet and outlet pipe lines.

One embodiment of the present of invention: the present invention is used for transmitting the semiconductor monocrystal silicon chip in reactive ion etching machine.The silicon chip of diameter 2 inch-3 inch is put into pending processing in the film magazine 4 in advance.Film magazine is placed on the film magazine crane 5 of prechamber, closes the prechamber cover plate and be evacuated down to 10 ^-2Torr is opened the vacuum valve 6 that leads to the work of treatment chamber, and the work of treatment chamber communicates with prechamber.Fall flat mechanical the pitching on 11 that a slice silicon chip in the film magazine is placed the band anchor point of driven rod manipulator 2 with the film magazine frame that microcomputer links.Machinery is pitched the silicon chip holder in the centre, the driven rod that links with microcomputer drives the top that the rotating light-operated water-cooled temperature control workbench 10 of work of treatment chamber is delivered to silicon chip in operation by screw mandrel 3, the workbench that links with microcomputer is by light-operated location, and silicon chip is just above lifting top flat bar 14.The lifting push rod that links with microcomputer rises, and jack-up slide glass seat 15, slide glass seat hold up silicon chip and leave flat machinery fork, withdraw from the driven rod manipulator to former preliminary treatment vacuum chamber.Fall lifting top flat bar, the slide glass seat on the push rod falls thereupon.Because the plane of slide glass seat and workbench plane are in same plane, silicon chip under the landing is adjacent to workbench, the temperature of temperature control workbench is exactly the temperature of silicon chip, silicon chip under the sd so condition is even through the reactive ion etching rear surface, high conformity.In this example, the slide glass seat on the workbench has ten, can ten silicon chips of an etching.The silicon chip that etching is finished is sent back in the former film magazine in reverse order successively one by one by micro-processor controlled connecting gear, stops automatically after having transmitted the silicon chip of handling well.Reactive ion etching machine adopts this connecting gear transmission silicon chip to carry out the etching result does not have the fragment phenomenon, and the silicon chip that etching is good is even, and the pattern line border is smooth on the silicon chip, and step is steep, the resolution height.

This transmission sheet mechanism is applicable to the equipment such as plasma etching, reactive ion etching, chemical vapour deposition (CVD) and magnetron sputtering that need transmission sheet in the semiconductor fabrication process.

Claims

1. the transmission sheet mechanism that comprises machinery fork, lifting top flat bar, film magazine, mechanical transmission bar and temperature control workbench in the semiconductor manufacturing equipment, it is characterized in that having the driven rod manipulator (2) of the direct transmission sheet automatically that a driven rod that is driven by transmission device and machinery fork fuse and one to have above it a plurality ofly changes light-operated location temperature control workbench (10) by lifting top flat bar (14) jack-up or the slide glass seat (15) fallen.

2. by the described transmission sheet of claim 1. mechanism, it is characterized in that the machinery of transfer robot front portion is stuck the anchor point (12) of placing slice, thin piece.

3. by the described transmission sheet of claim 1. mechanism, slide glass seat (15) plane and platform (10) plane be at grade when elevating lever falls to it is characterized in that slide glass seat on the workbench.

4. by claim 1,2,3 described transmission sheet mechanisms, it is characterized in that control driven rod manipulator (2) film magazine crane (5) is arranged, can change the microcomputer of light-operated location temperature control workbench (10) and lifting top flat part.