CN85100021A - Deposited au-sic composite coat - Google Patents
Deposited au-sic composite coat Download PDFInfo
- Publication number
- CN85100021A CN85100021A CN85100021.5A CN85100021A CN85100021A CN 85100021 A CN85100021 A CN 85100021A CN 85100021 A CN85100021 A CN 85100021A CN 85100021 A CN85100021 A CN 85100021A
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- Prior art keywords
- sic
- gold
- composite deposite
- composite
- deposited
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- Electroplating Methods And Accessories (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Abstract
A kind of wear resistant composite plating that is used for the anti-electric etch of relay1 contact is to be deposited on copper alloy or other metallic matrixes with electro-plating method.Disperse accounts for coating volume 0.1～10% in the composite deposite, and particle diameter is less than 0.5 micron SiC particulate.This auri composite deposite has the microhardness higher than proof gold, low frictional coefficient, and contact resistance is slightly larger than gold, but is lower than au-alloy, and anti-electric erosion, anticorrosive and anti-tarnishing ability is strong.This Au-SiC composite deposite can contain the SiC particulate, obtains in gold plating solution prussiate, tart and sulphite.
Description
The invention belongs to selecting for use of relay1 contact material.
Make the electrical contact of weak current, small power, highly sensitive rly., adopt proof gold (comprise and electroplate proof gold) or au-alloy (comprising the electrogilding alloy) usually.Gold utensil has good electrical and thermal conductivity performance, and extraordinary solidity to corrosion and anti-tarnishing ability are also very little to the susceptibility of organic contamination.But the hardness of gold is low, and anti-liquid bridge etch ability, and frictional coefficient big (being about 0.94) wear no resistance, and cost an arm and a leg.
Since the sixties in this century, composite electrodeposition technique develops rapidly.Training Fil people such as (Peiffer) in 1969 once reported Means of Electrodeposition and obtained the electrical contact that the Au-WC composite deposite is used for dry reed relay.CA in 1961 to 1984 finds no record is used for rly. and electrochemistry formation technology thereof about the Au-SiC composite deposite document or patent by retrieval.
The objective of the invention is to, on copper alloy or other metal material matrixes, form skim Au-SiC composite skin with composite plating technology.This composite layer is with the good electrical and thermal conductivity of gold, the excellent chemical stability and the heat-resistant antifriction of silicon carbide combine, form a kind of composite deposite of condensation excellent property, be used on the contact of rly., the reliability of rly. work and work-ing life are increased substantially.
Feature of the present invention is to adopt the method for electrochemical deposition, deposition skim Au-SiC composite deposite on copper alloy or other metallic matrixes, and the content of SiC particulate accounts for 0.1～10% of coating volume, and particle diameter is less than 0.5 micron.This composite deposite has the hardness height, and Hv reaches 100～180, and the Hv of electrogilding layer is about 90, and the Hv of electrogilding-cobalt-base alloy is 140～180, and wear resistance is good; Frictional coefficient is less than 0.5.Electrical contact as rly., the contact resistance of Au-SiC composite deposite is low, in contact pressure is 10 grams, under 10～40 milliamperes of conditions of electric current, contact resistance≤5m Ω is under similarity condition, the contact resistance of gold is 3.5m Ω, gold-cobalt-base alloy is 7m Ω, and anti-electric etch, and is anticorrosive and anti-tarnishing ability is strong.
The characteristics of composite plating process of the present invention are, can add a certain amount of SiC particulate in the electrolytic solution such as acid gold plating solution and sulphite gold plating liquid at the cyaniding gold plating liquid, in whole electroplating process, particulate are fully suspended in electrolytic solution.Au-SiC composite plating process embodiment of the present invention is as follows:
Gold (with KAu(CN)
2Form 8～12 grams per liters
Add)
Diammonium hydrogen citrate 80～110 grams per liters
Silicon-carbide particles (particle diameter＜0.5 0.1～10 grams per liters
Micron)
pH 5.4～5.8
30～50 ℃ of bath temperatures
Cathode current density 0.1～0.5 peace/decimetre
2
Anode is with proof gold or titanium base platinized electrode.Adopt the circulation of mechanical stirring or plating bath that the SiC particulate is fully suspended in plating bath.Thickness of coating can be selected between 2～50 microns as required.
Claims (2)
1, a kind of composite deposite with Jin Weiji is used for the electrical contact of rly., it is characterized in that depositing on copper alloy or other metallic matrixes layer of Au-SiC composite deposite.Disperse has the SiC particulate that accounts for coating volume 0.1～10% in the composite deposite, and particle diameter is less than 0.5 micron.
2, be to be added with particle diameter less than 0.5 micron SiC particulate according to claim 1 described auri composite deposite, deposit in gold-plated electrolytic solution prussiate, tart or sulphite.The addition of SiC is 0.1～10 grams per liter.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN85100021.5A CN1004528B (en) | 1985-04-01 | 1985-04-01 | Deposited au-sic composite coat |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN85100021.5A CN1004528B (en) | 1985-04-01 | 1985-04-01 | Deposited au-sic composite coat |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN85100021A true CN85100021A (en) | 1986-01-10 |
| CN1004528B CN1004528B (en) | 1989-06-14 |
Family
ID=4790820
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN85100021.5A Expired CN1004528B (en) | 1985-04-01 | 1985-04-01 | Deposited au-sic composite coat |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1004528B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1074574C (en) * | 1998-09-18 | 2001-11-07 | 北京工业大学 | Metal base composite electric packaging heat sink material and its preparing method |
| CN105401181A (en) * | 2015-12-23 | 2016-03-16 | 苏州市金星工艺镀饰有限公司 | Electroplating method of environmentally-friendly cyanide-free gold-plating electroplating fluid |
| CN105401180A (en) * | 2015-12-23 | 2016-03-16 | 苏州市金星工艺镀饰有限公司 | Electroplating liquid of wear-resistant gold-plated film and electroplating method thereof |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1308496C (en) * | 2003-06-06 | 2007-04-04 | 吴化 | Electrodeposition composite plating method for improving metal surface high temperature and abrasion resistant performance |
-
1985
- 1985-04-01 CN CN85100021.5A patent/CN1004528B/en not_active Expired
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1074574C (en) * | 1998-09-18 | 2001-11-07 | 北京工业大学 | Metal base composite electric packaging heat sink material and its preparing method |
| CN105401181A (en) * | 2015-12-23 | 2016-03-16 | 苏州市金星工艺镀饰有限公司 | Electroplating method of environmentally-friendly cyanide-free gold-plating electroplating fluid |
| CN105401180A (en) * | 2015-12-23 | 2016-03-16 | 苏州市金星工艺镀饰有限公司 | Electroplating liquid of wear-resistant gold-plated film and electroplating method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1004528B (en) | 1989-06-14 |
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