CN101092725A - Gold plating solution, and method for plating gold - Google Patents
Gold plating solution, and method for plating gold Download PDFInfo
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- CN101092725A CN101092725A CN 200710020884 CN200710020884A CN101092725A CN 101092725 A CN101092725 A CN 101092725A CN 200710020884 CN200710020884 CN 200710020884 CN 200710020884 A CN200710020884 A CN 200710020884A CN 101092725 A CN101092725 A CN 101092725A
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- gold
- ionic liquid
- room temperature
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Abstract
This invention discloses a gold-plating solution and gold-plating method. The method comprises: utilizing gold salt-containing room temperature ionic liquid as the gold-plating solution, gold as the anode, and material to be plated as the cathode, and performing DC electrolysis to reduce the cathode and obtain a shinning gold plating layer. The gold salt is Au (PPh3) Cl or Au (PPh3) Br; the room temperature ionic liquid is [bmim] BF4 or [bmim] PF6; the concentration of the gold salt in the ionic liquid is 0.005 mol/L to saturation concentration. The gold-plating solution does not contain hypertoxic cyanide, and has such advantages as high stability in air and water, no volatility, low flammability, and no harm to environment or operators.
Description
Technical field
The present invention relates to a kind of gold plating liquid and gold plating method thereof, or rather, relating to a kind of is gold plating liquid with the ionic liquid at room temperature that contains golden salt, the method for electrogilding in ionic liquid at room temperature.
Background technology
Gold utensil has beautiful color, good ductility and conduction, thermal conductivity are arranged, the chemical stability height, high temperature resistant, corrosion-resistant, therefore usually be plated on the surface of some part and instrument, give its some specific function, be used widely at aspects such as electrical equipment, electronic component, science and techniques of defence and decorations.
Gold-plated common employing aqueous systems is carried out in alkaline cyanide plating bath and the little cyanogen plating bath of acidity-neutral buffer systems.The remarkable defective of this gold-plated technology just has been to use prussiate.Prussiate is a highly toxic substance, has both influenced the healthy of operator, again environment is produced very big destruction.The non-prussiate plating bath that adopts is not good enough because of its stability as sulfurous acid gold salt gold plating liquid at present, is restricted in the application.Gold-plated research in a small amount of relevant organic solvent is also arranged, but organic solvent is generally poisonous, volatile, inflammable, therefore is subjected to certain limitation in actual applying.
Ionic liquid at room temperature is meant main by organic cation and fused salt inorganic or that organic anion constitutes, be in a liquid state under near temperature room temperature or the room temperature, is called for short ionic liquid.Because the full ionic structure of its uniqueness is regarded as the candidate of novel environment friendly electroplate liquid, thereby aspect metal electrodeposition, be subjected to paying close attention to widely.But the bibliographical information of deposited Au is few in relative chamber's temperature ionic liquid.Present disclosed data one is that X.H.Xu in 1992 etc. have reported at AlCl
3Carry out the galvanic deposit of Au in the type ionic liquid.Two is that Eric R.Schreiter in 1999 etc. have reported ionic liquid [emim] Cl-AuCl
3Preparation.Under the room temperature, AuCl
3With the mol ratio of [emim] Cl be liquid in 1/2～1/3 scope, can carry out the galvanic deposit of Au.But this AlCl
3The type ionic liquid need be operated under the condition of vacuum and protection of inert gas air and water sensitive, therefore adopts AlCl
3The type ionic liquid is gold-plated, and the popularization in actual production is restricted.
In recent years, people synthesize many to the stable ionic liquid of empty G﹠W, and gold-plated technology provides possibility in the ionic liquid at room temperature that can be applied in actual production in order to develop.But to contain golden salt Au (PPh
3) Cl or Au (PPh
3) ionic liquid at room temperature [bmim] BF of Br
4Or [bmim] PF
6Be gold plating liquid, in this gold plating liquid, carry out gold-plated technology and do not appear in the newspapers.
Summary of the invention
The objective of the invention is to shortcoming, make full use of ion liquid advantage, little, eco-friendly gold plating liquid of a kind of pollution and gold plating method thereof are provided at the prior art existence.
For achieving the above object, the technical scheme that gold plating liquid of the present invention adopts is: a kind of gold plating liquid, constitute by the ionic liquid at room temperature that contains golden salt, and described golden salt adopts Au (PPh
3) Cl or Au (PPh
3) Br; Ionic liquid at room temperature is [bmim] BF
4Or [bmim] PF
6, the concentration of golden salt in ionic liquid at room temperature is 0.005mol/L～saturation concentration.In this programme, the ionic liquid at room temperature that contains golden salt specifically has following four kinds of combinations: 1, contain Au (PPh
3) [bmim] BF of Cl
4Ionic liquid at room temperature; 2, contain Au (PPh
3) [bmim] PF of Cl
6Ionic liquid at room temperature; 3, contain Au (PPh
3) [bmim] BF of Br
4Ionic liquid at room temperature;
4, contain Au (PPh
3) [bmim] PF of Br
6Ionic liquid at room temperature.
For achieving the above object, the technical scheme that gold plating method of the present invention adopts is: a kind of gold plating method, in electrolyzer, with the ionic liquid at room temperature that contains golden salt is electrolytic solution, with gold is anode, and material to be plated is a negative electrode, adopts the mode of dc electrolysis, obtain bright gold plate in cathodic reduction, it is characterized in that: described golden salt adopts Au (PPh
3) Cl or Au (PPh
3) Br; Ionic liquid at room temperature is [bmim] BF
4Or [bmim] PF
6In; The concentration of gold salt in ionic liquid at room temperature is 0.005mol/L～saturation concentration.
Related content in the technique scheme is explained as follows:
1, in above-mentioned gold plating liquid and the gold plating method scheme, the preferably concentration range of golden salt in ionic liquid at room temperature is 0.006mol/L～0.015mol/L, and wherein, optimum concn is 0.01mol/L.
2, in above-mentioned gold plating liquid and the gold plating method scheme, described golden salt adopts Au (PPh
3) Cl or Au (PPh
3) Br, wherein, Au (PPh
3) the Cl chemical name is chlorinated triphenyl base phosphine alloy (I), Au (PPh
3) the Br chemical name is bromination triphenylphosphine alloy (I).Described ionic liquid at room temperature is [bmim] BF
4Or [bmim] PF
6, chemical name is 1-butyl-3-methyl imidazolium tetrafluoroborate and 1-butyl-3-Methylimidazole hexafluorophosphate, and wherein bmim is 1-butyl-3-Methylimidazole, and chemical structural formula is:
3, in the above-mentioned gold plating method scheme, described material to be plated is divided into metal and nonmetal two classes, and metallic substance is selected one of following material: iron, stainless steel, titanium, copper, nickel etc.Non-metallic material are selected one of following material: graphite, conductive plastics etc., but with non-metallic material during directly as material to be plated, these non-metallic material need have certain electroconductibility.
4, in the above-mentioned gold plating method scheme, adopting the galvanized mode of continuous current, is 1.5～2.3V at bath voltage, and current density is 0.01～0.2A/dm
2, pole span is to carry out under the condition of 5～50mm.Galvanized temperature is 80～120 ℃.
Because the technique scheme utilization, the present invention compared with prior art has following advantage and effect:
1. compare with traditional aqueous systems is gold-plated, it is Jin Yuan that the present invention does not adopt the prussiate of severe toxicity;
2. compare with organic solvent system is gold-plated, the present invention has avoided adopting poisonous, volatile, inflammable organic solvent.
Therefore the present invention is significant aspect safety in production and environment protection.
Description of drawings
Accompanying drawing 1 is the stereoscan photograph of copper sheet of the present invention after gold-plated;
Accompanying drawing 2 is analyzed synoptic diagram for the gold-plated Coating composition of copper sheet of the present invention;
Accompanying drawing 3 is the stereoscan photograph of nickel sheet of the present invention after gold-plated;
Accompanying drawing 4 is analyzed synoptic diagram for the gold-plated Coating composition of nickel sheet of the present invention.
Embodiment
Below in conjunction with drawings and Examples the present invention is further described:
Embodiment 1: in the 25ml single-cell, add 0.05 gram Au (PPh successively
3) Cl and 10 milliliters of ionic liquids [bmim] BF
4, be warming up to 80 ℃ golden salt fully be dissolved in the ionic liquid.With this ionic liquid that contains golden salt is electrolytic solution, and logical direct current is electroplated, and is anode with gold plaque (10mm * 12mm, purity are 99.9%), copper sheet (12mm * 14mm, purity 99.5%) is a negative electrode, and negative electrode and anode are vertical arrangements, and electrode surface is parallel to each other, stir current density 0.08A/dm
2, bath voltage 1.8～2.0V, pole span 10mm, 80 ℃ of electroplating temperatures.Switch on and obtain the gold plate of light after 2 hours.Effect is referring to Fig. 1 and Fig. 2.
Embodiment 2: in the 25ml single-cell, add 0.05 gram Au (PPh successively
3) Cl and 10 milliliters of ionic liquids [bmim] BF
4, be warming up to 90 ℃ golden salt fully be dissolved in the ionic liquid.With this ionic liquid that contains golden salt is electrolytic solution, and logical direct current is electroplated, and is anode with gold plaque (10mm * 12mm, purity are 99.9%), nickel sheet (8mm * 10mm, purity 99.5%) is a negative electrode, and negative electrode and anode are vertical arrangements, and electrode surface is parallel to each other, stir current density 0.18A/dm
2, bath voltage 1.8～2.0V, pole span 15mm, 90 ℃ of electroplating temperatures.Switch on and obtain the gold plate of light after 2 hours.
Embodiment 3: in the 25ml single-cell, add 0.05 gram Au (PPh successively
3) Cl and 10 milliliters of ionic liquids [bmim] PF
6, be warming up to 90 ℃ golden salt fully be dissolved in the ionic liquid.With this ionic liquid that contains golden salt is electrolytic solution, and logical direct current is electroplated, and is anode with gold plaque (10mm * 12mm, purity are 99.9%), copper sheet (12mm * 14mm, purity 99.5%) is a negative electrode, and negative electrode and anode are vertical arrangements, and electrode surface is parallel to each other, stir current density 0.05A/dm
2, bath voltage 2.0～2.3V, pole span 10mm, 90 ℃ of electrolysis temperatures.Switch on and obtain the gold plate of light after 2 hours.
Embodiment 4: in the 25ml single-cell, add 0.05 gram Au (PPh successively
3) Cl and 10 milliliters of ionic liquids [bmim] PF
6, be warming up to 100 ℃ golden salt fully be dissolved in the ionic liquid.With this ionic liquid that contains golden salt is electrolytic solution, and logical direct current is electroplated, and is anode with gold plaque (10mm * 12mm, purity are 99.9%), nickel sheet (8mm * 10mm, purity 99.5%) is a negative electrode, and negative electrode and anode are vertical arrangements, and electrode surface is parallel to each other, stir current density 0.10A/dm
2, bath voltage 2.0～2.3V, pole span 15mm, 100 ℃ of electrolysis temperatures.Switch on and obtain the gold plate of light after 2 hours.Effect is referring to Fig. 3 and Fig. 4.
Embodiment 5: in the 25ml single-cell, add 0.05 gram Au (PPh successively
3) Br and 10 milliliters of ionic liquids [bmim] BF
4, be warming up to 90 ℃ golden salt fully be dissolved in the ionic liquid.With this ionic liquid that contains golden salt is electrolytic solution, and logical direct current is electroplated, and is anode with gold plaque (10mm * 12mm, purity are 99.9%), nickel sheet (8mm * 10mm, purity 99.5%) is a negative electrode, and negative electrode and anode are vertical arrangements, and electrode surface is parallel to each other, stir current density 0.15A/dm
2, bath voltage 2.0V, pole span 10mm, 90 ℃ of electrolysis temperatures.Switch on and obtain the gold plate of light after 2 hours.
Embodiment 6: in the 25ml single-cell, add 0.05 gram Au (PPh successively
3) Br and 10 milliliters of ionic liquids [bmim] PF
6, be warming up to 90 ℃ golden salt fully be dissolved in the ionic liquid.With this ionic liquid that contains golden salt is electrolytic solution, and logical direct current is electroplated, and is anode with gold plaque (10mm * 12mm, purity are 99.9%), nickel sheet (8mm * 10mm, purity 99.5%) is a negative electrode, and negative electrode and anode are vertical arrangements, and electrode surface is parallel to each other, stir current density 0.08A/dm
2, bath voltage 2.0～2.3V, pole span 10mm, 90 ℃ of electrolysis temperatures.Switch on and obtain the gold plate of light after 3 hours.
The foregoing description only is explanation technical conceive of the present invention and characteristics, and its purpose is to allow the personage who is familiar with this technology can understand content of the present invention and enforcement according to this, can not limit protection scope of the present invention with this.All equivalences that spirit is done according to the present invention change or modify, and all should be encompassed within protection scope of the present invention.
Claims (6)
1, a kind of gold plating liquid is made of the ionic liquid at room temperature that contains golden salt, it is characterized in that: described golden salt adopts Au (PPh
3) Cl or Au (PPh
3) Br; Ionic liquid at room temperature is [bmim] BF
4Or [bmim] PF
6The concentration of gold salt in ionic liquid at room temperature is 0.005mol/L～saturation concentration.
2, a kind of gold plating method in electrolyzer, is a gold plating liquid with the ionic liquid at room temperature that contains golden salt, with gold is anode, and material to be plated is a negative electrode, adopts the mode of dc electrolysis, obtain bright gold plate in cathodic reduction, it is characterized in that: described golden salt adopts Au (PPh
3) Cl or Au (PPh
3) Br; Ionic liquid at room temperature is [bmim] BF
4Or [bmim] PF
6The concentration of gold salt in ionic liquid at room temperature is 0.005mol/L～saturation concentration.
3, gold plating liquid according to claim 1 and 2 is characterized in that: the concentration of golden salt in ionic liquid at room temperature further is 0.006mol/L～0.015mol/L.
4, gold-plated method according to claim 2 is characterized in that: described material to be plated is selected one of following material: iron, stainless steel, titanium, copper, nickel, graphite, conductive plastics.
5, gold-plated method according to claim 2 is characterized in that: described gold-plated be 1.5～2.3V at bath voltage, current density is 0.01～0.2A/dm
2, pole span is to carry out under the condition of 5～50mm.
6, gold-plated method according to claim 2 is characterized in that: described gold-plated temperature is 80～120 ℃.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2007100208847A CN100570013C (en) | 2007-04-12 | 2007-04-12 | A kind of gold plating liquid and gold plating method thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2007100208847A CN100570013C (en) | 2007-04-12 | 2007-04-12 | A kind of gold plating liquid and gold plating method thereof |
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|---|---|
| CN101092725A true CN101092725A (en) | 2007-12-26 |
| CN100570013C CN100570013C (en) | 2009-12-16 |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105018980A (en) * | 2015-07-23 | 2015-11-04 | 珠海元盛电子科技股份有限公司 | Electroplating solution and method for metalized ionic liquid gold-plating of holes of printed circuit boards |
| CN106676595A (en) * | 2017-01-18 | 2017-05-17 | 哈尔滨工业大学 | Ionic liquid gold plating solution containing coordination agent and additive and gold plating method adopting ionic liquid gold plating solution |
| CN110230079A (en) * | 2015-01-16 | 2019-09-13 | 哈钦森技术股份有限公司 | Golden electroplating solution and method |
-
2007
- 2007-04-12 CN CNB2007100208847A patent/CN100570013C/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110230079A (en) * | 2015-01-16 | 2019-09-13 | 哈钦森技术股份有限公司 | Golden electroplating solution and method |
| CN110230079B (en) * | 2015-01-16 | 2022-03-11 | 哈钦森技术股份有限公司 | Gold plating solution and method |
| CN105018980A (en) * | 2015-07-23 | 2015-11-04 | 珠海元盛电子科技股份有限公司 | Electroplating solution and method for metalized ionic liquid gold-plating of holes of printed circuit boards |
| CN106676595A (en) * | 2017-01-18 | 2017-05-17 | 哈尔滨工业大学 | Ionic liquid gold plating solution containing coordination agent and additive and gold plating method adopting ionic liquid gold plating solution |
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|---|---|
| CN100570013C (en) | 2009-12-16 |
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