CN2938716Y

CN2938716Y - Heat sink device

Info

Publication number: CN2938716Y
Application number: CN 200620058315
Authority: CN
Inventors: 刘中炎
Original assignee: Mitac Precision Technology Shunde Ltd
Current assignee: Mitac Precision Technology Shunde Ltd
Priority date: 2006-04-28
Filing date: 2006-04-28
Publication date: 2007-08-22
Anticipated expiration: 2016-04-28

Abstract

The utility model discloses a novel heat dissipating device which can be used to cool the electronic components of a circuit board and comprises a foundation plate, a plurality of heat dissipating fin pieces and a buckle; wherein the foundation plate can be pasted to the surface of the electronic components and is provided with a groove. A plurality of salient points molded into a whole are arranged at two sides of the groove; A plurality of heat dissipating fins are molded into a whole on the foundation plate; the buckle is composed of a press part and two hooks extended from two ends of the press part. The press part of the buckle can be embedded in the groove. A plurality of salient points can be pressed toward the groove to lean against the to press part of the buckle, the two hooks can be blocked on the circuit board as as to fix the heat dissipating foundation plate on the surface of the electronic component. For the novel heat dissipating device disclosed in the utility model, the matching mode of the foundation plate with the buckle is simpler than common matching mode. Therefore the heat dissipating device saves material and reduces processing procedure.

Description

The heat sinking device

Technical field

The utility model relates to a kind of heat sinking device.

Background technology

As everyone knows, along with development of science and technology, the function of electronic product and processing speed are able to raising at full speed, the thing followed is that each the electronic component caloric value on the electronic product is also increasing, and caloric value will become the bottleneck that promotes electronic product performance if can not get effectively discharging with the control temperature of electronic component.As shown in Figure 1, it is the schematic perspective view of a present conventional heat abstractor.The heat radiation of the electronic component that this heat abstractor can be used for being provided with on the circuit board, it comprises a substrate 110, some radiating fins 120, an one V-type wedge 140 and a fastener 130, this substrate 110 can be covered on the surface of this electronic component, these some radiating fins are shaped on this substrate 110, also be provided with a groove 111 on this substrate 110, these groove 111 both sides are one-body molded some salient points 112, this fastener 130 comprises a pressure section 131 and by extended two grabs 132 in these pressure section 131 two ends, these pressure section 131 backs of these wedge 140 clampings embed in this groove 111, thereby these some salient points 112 can form the restriction of this wedge 140 is fixed this pressure section 131 on this substrate 110, this grab 132 can be fastened on this circuit board in addition, thereby this fastener 130 can be fixed this substrate 110 on this electronical elements surface.

The above-mentioned problem that should the routine heat abstractor exists is, the cooperation of this fastener 130 and this substrate 110 need be passed through this wedge 140, this wedge 140 need produce deformation with this pressure section 131 of clamping by instruments such as pliers, and therefore this fin 120 of easy scratch also produced metal fillings when this wedge 140 embedded in this groove 111, this metal fillings drops on the foregoing circuit plate, may cause the short circuit of the other electron component that is provided with on this circuit board or this circuit board.

Summary of the invention

In view of above-mentioned, the purpose of this utility model is to provide a kind of heat sinking device, and this heat sinking device has reduced parts than conventional heat abstractor, has still realized identical functions, has also avoided short risk simultaneously.

For achieving the above object, the utility model has adopted following technical scheme, promptly a kind of heat sinking device, and the heat radiation of the electronic component that it can be used for being provided with on the circuit board, this heat sinking device comprises a substrate, some radiating fins and a fastener; This substrate can be covered on the surface of this electronic component, and this substrate is provided with a groove, and these groove both sides are one-body molded some salient points; These some radiating fins are shaped on this substrate; This fastener comprises a pressure section and by extended two grabs in these pressure section two ends, this pressure section can be embedded in this groove, these some salient points can be to this groove pressing to be resisted against on this fastener pressure section, thereby these some salient points have formed restriction to this pressure section to fix this pressure section on this substrate, this two grab can fix on this circuit board, thereby this fastener can be fixed this substrate on the surface of this electronic component.

Compared with prior art, the heat sinking device that the utility model disclosed, it directly utilizes on the substrate integrated some salient points against the pressure section of this fastener, and omitted wedge, than conventional heat abstractor, the fit system of its substrate and fastener is more simple, has saved material, has also reduced operation.

Description of drawings

Fig. 1 is the schematic perspective view of a present conventional heat abstractor.

Fig. 2 is the schematic perspective view of the heat sinking device of the utility model.

Fig. 3 is the cutaway view along A-A line among Fig. 2.

Embodiment

Below in conjunction with accompanying drawing the utility model is described in further detail.

Consult shown in Figure 2ly, it is the schematic perspective view of the heat sinking device of the utility model.The heat radiation of the electronic component that this heat sinking device can be used for being provided with on the circuit board, this heat sinking device comprises a substrate 110, some radiating fins 120 and a fastener 130, this substrate 110 can be covered on the surface of this electronic component, this substrate 110 is provided with a groove 111, these groove 111 both sides are one-body molded some salient points 112, these some fins 120 are shaped on this substrate 110, this fastener 130 includes a pressure section 131 and by extended two grabs 132 in these pressure section 131 two ends, please consult shown in Figure 3 simultaneously, this pressure section 131 can be embedded in this groove 111, these some salient points 112 can to these groove 111 pressings with the pressure section 131 that is resisted against this fastener 130 on, thereby these some salient points 112 have formed restriction to this pressure section 131 to fix this pressure section 131 on this substrate 110, this two grab 132 can fix on this circuit board, thereby this fastener 130 can be fixed this substrate 110 on this electronical elements surface.

Than conventional heat abstractor, the substrate 110 that this heat sinking device comprises and the fit system of fastener 130 are more simple, it directly utilizes, and integrated some salient points 112 when having saved material, have also reduced operation against the pressure section 131 of this fastener 130 on the substrate 110.

Claims

1. a heat sinking device is characterized in that, comprising:

One substrate, it is provided with a groove, and these groove both sides are one-body molded some salient points;

Some radiating fins, these some fins are shaped on the aforesaid substrate; And

One fastener, this fastener comprise a pressure section and by extended two grabs in these pressure section two ends, this pressure section can be embedded in the above-mentioned groove, and above-mentioned some salient points can be to this groove pressing.