CN2930029Y - Laser lamp package structure improvement - Google Patents

Abstract

An improved laser light packing structure comprises a first bracket on which a concave bowl portion is arranged and under which a first contact foot is extended, a second bracket which is next to the first bracket with an interval and under which a second contact foot is arranged, a VCSEL type laser diode chip which is arranged inside the bowel portion of the first bracket and connected with the second bracket by use of a mental line conductor as an electrical conduction, a packing stuff which packs the fist bracket, the second bracket, the laser chip or the like with only the first contact foot and the second contact foot exposed, wherein, the top face of the packing stuff is provided with a groove face capable of being vertical to the proceeding direction of the laser path, thereby lowering the changing volume of the interactions between the laser and the organic resin material, decelerating the aging of the organic resin material, producing nonlinear optic phenomena which ensures the oriented transmission of the laser buddle and maintains the original properties of the laser.

Description

The improvement of laser lamp encapsulating structure

Technical field

The utility model relates to the improvement of a kind of laser lamp encapsulating structure, particularly be that a kind of package material end face has the groove plane vertical with the laser road.

Background technology

Because laser coherence makes received signal have very high signal to noise ratio (S/N ratio) and resolution (Resolution), monochromatic performance make us obtain the focusing of near ideal, and the high strength of focus point makes system noise in signal detection process (System noise) be submerged.Therefore, laser just becomes the only available light sources of application system such as optical communication, accurate measurement and location, pattern identification, optical Information Processing and holography, but no matter laser is in the application aspect which, all be unable to do without the transmission of laser beam, so the transmission form of research laser beam in different medium and transmission rule, and design practical laser optics system, be the important topic that laser technology is used.

Past; the sensitivity of transmission medium is relatively low; thereby must adopt bigger gas or the solid type generating laser of power; cost costliness not only; the operating voltage height; its volume is also huger; but quick progress and development along with science and technology; various high density; the product of high sensitivity medium also constantly is developed release; the fast development of semiconductor light emitting and laser laser diode process technique; thereby realized that volume is minimum; very light in weight; the frequency height of modulated laser; power is little; required operating voltage laser diode emitters low and that production prices are cheap in a large number (Laser diode); as distinguishing with laser lasing fluorescence geometry; laser diode emitters can be the limit again and penetrates type (LD type) and two kinds of wall emissions (VCSEL type); wherein the development of type (LD type) laser diode emitters is penetrated early in the limit; the laser that a variety of photovoltaic applications of event system is adopted is the limit and penetrates type (LD type) laser diode emitters; and wall emission (VCSEL type) laser diode emitters is by in the accurate crystalline substance of heap of stone of needs and the technology of processing procedure; its relevant development is but very slow; operation when topmost restriction is high temperature; so encapsulation of wall emission (VCSEL type) laser diode emitters; it is the most important to solve heat dissipation problem; next is how to keep to possess most important four the characteristic-coherences of former laser; monochromaticjty; directivity and high strength; so all adopt metal can encapsulation (To-Can package) mode usually; shown in Fig. 3 and Fig. 3 A to Fig. 3 C; it mainly is by one first contact feet 312; second contact feet 321; wall emission (VCSELtype) laser diode chip 33 and hollow metal lid 34 are formed; the bottom surface 311 of this hollow metal lid 34 is to join with this first contact feet 312; and wall emission (VCSEL type) laser diode chip 33 is arranged in the bottom surface 311 of this hollow metal lid 34; the anode of wall emission (VCSEL type) laser diode chip 33 is to utilize a plain conductor 35 to be connected with second contact feet 321 to electrically conduct; the laser beam 37 that its wall emission (VCSEL type) laser diode chip 33 is sent can be penetrated by the hollow part 341 of these hollow metal lid 34 end faces; outer rim in these hollow metal lid 34 bottoms is provided with the projection 36 of location usefulness; this type of metal can encapsulation (To-Can package) mode; its cost is higher and encapsulation procedure is also complicated, the surface emitting laser transistor reflector that production prices are cheap in a large number.

In recent years by at building crystal to grow in conjunction with speculum and active layer material process technique, and can obtain high-temperature behavior is good wall emission (VCSEL type) laser diode, just do not need to consider its heat dissipation problem in the encapsulation that is wall emission (VCSEL type) laser diode emitters, the packaged type of organic resin (EPOXY) as material all used in existing again light-emitting diode (light-emitting diode) encapsulation, not only simplify encapsulation procedure and its (organic resin (EPOXY) encapsulant 44 that shows different external forms as Fig. 4 to Fig. 8 with low cost, 54,64,74,84 external form), but laser diode is different with traditional lumination of light emitting diode performance, wherein the most obvious and most important is exactly the coherence of laser, this is that interaction between material is most important to understand laser and organic resin in research, in other words, the variation that the organic resin material took place when laser contacted with the organic resin material, so we it should be noted that the not only variation of the caused organic resin material of laser, also comprise the variation of the caused laser of organic resinous substances, and laser causes that the variation of organic resin material can be divided into two classes: optical physics mechanism and photochemical reaction, the organic resin material causes that the variation of laser also can be divided into internal disturbance type and external disturbance type, this depends in the variation of laser in communication process and is caused by the effect at the trimmed book body, still by in the disturbance of material but not light caused.Therefore, the internal disturbance type comprises various nonlinear optical phenomena again, the main process of external disturbance type then is considered to the fluctuating caused (light scattering phenomenon etc.) of medium refraction index, or the interaction between the electromagnetic field caused (electro optic effect, magneto optical effect etc.).Light scattering phenomenon is caused by " material induct light change ", because radiation field has comprised the electromagnetism composition, this variation not only originates from the internal factor of material, and is also relevant with sound wave and electromagnetic field.Material itself is to be made of atom and molecule, and atom and molecule are yes to link with electromagnetic field, thereby all these phenomenons all can take place in material, and the interaction of this light/material is " inside " perturbation (Perturbation).Under normal conditions, when handling traditional light (as light emitting diode light) propagation, suppose the electromagnetism light field and form and satisfy a kind of linear closing between the corresponding atomic system of medium and be, yet, as a mechanical oscillation device, when external force is enough big, can provide a nonlinear response, and the great light beam of intensity equally also can produce nonlinear effect, too little with the link electric field that is of conventional light source (as LED source), just be not enough to produce such nonlinear response, the appearance of laser just makes observation, analysis and the application of nonlinear optical phenomena become possibility.But using high-intensity light source is not the only requirement that produces nonlinear effect, must be phase matched between its interactional light wave yet, and this condition then can be easy to occur as using relevant laser.

Therefore, transmission the produce nonlinear optical phenomena of research laser beam in organic resin (EPOXY) medium, and can design practical laser optics system, it is the extremely important problem that laser technology is used, such as the encapsulation of wall emission (VCSEL type) laser diode emitters is directly continued to use existing light-emitting diode (light-emitting diode) encapsulation the organic resin that uses (EPOXY) be the packaged type of material, its encapsulating structure is the bowl portion that chip is placed on support, inside optical path length from chip to closed top end is that a segment length is arranged, that is laser contacts distance when longer with the organic resin material, more increase the variable quantity of the caused organic resin material of its laser, the variable quantity that also comprises the caused laser of organic resinous substances, this effect not only can make the accelerated ageing of organic resin material and produce nonlinear optical phenomena, more can influence four characteristic (coherences of laser, monochromaticjty, directivity and high strength) performance, and the utmost point is treated our in addition further research improvement.

Mirror is arranged at this, for improving above-mentioned disappearance, the utility model the people concentrate on studies, and the application of cooperation scientific principle, and through continuous effort, test and improvement, eventually a kind of design is cleverly being proposed, and can effectively solve institute gives off laser beam and can advance in the same direction, and reach evenly, be concerned with and high-intensity laser function, and the encapsulation of wall emission of the present utility model (VCSEL type) laser diode emitters is used in order, reaches laser and can and can keep with direction propagation and possess most important four the characteristic-coherences of former laser, monochromaticjty, directivity and high-intensity purpose.

Summary of the invention

Main purpose of the present utility model, be to provide a kind of laser lamp encapsulating structure improvement, not only simplify encapsulation procedure and with low cost, allow the laser that it sent with direction propagation and can keep the purpose of possessing most important four characteristic-coherences, monochromaticjty, directivity and high-intensity performances of former laser;

Another purpose of the present utility model is to be to provide a kind of laser lamp encapsulating structure improvement, compares in traditional inclined design, makes it can obtain better light harvesting effect;

Another purpose of the present utility model, be to be to provide a kind of laser lamp encapsulating structure improvement, not only simple in structure, easy to manufacture and can increase manufacturing cost hardly, have advantage on the price in the technology of existing wall emission (VCSEL type) laser diode emitters metal can encapsulation (To-Can package) mode relatively.

For achieving the above object, the technical solution adopted in the utility model is, is existing wall emission (VCSELtype) metal can that laser diode emitters adopts encapsulation (To-Can package) mode to be changed use the packaged type of organic resin (EPOXY) as material; It is made up of support, wall emission (VCSEL type) laser diode chip and organic resin (EPOXY) encapsulant, its medium-height trestle is provided with a bowl portion that can supply ccontaining wall emission (VCSEL type) laser diode chip, wherein, should be rounded shape in order to the bowl portion that wall emission (VCSEL type) laser diode chip is set, change the structure of organic resin (EPOXY) encapsulant.

The shaped design technology that the utility model is compared at the structure of existing laser lamp metal can encapsulation (To-Can package) mode and other organic resin encapsulation end face has following several advantages:

1. can solve the structure of conventional metals potting dress (To-Can package) mode, its wall emission (VCSELtype) laser diode chip is to expose in air, be subjected to such environmental effects such as humiture and dust during use easily, at static (ESD) protection and reliability test, the shortcoming of all performing poor etc.

2. it is higher and encapsulation procedure is also complicated, the surface emitting laser transistor reflector that production prices are cheap in a large number to solve the cost of conventional metals potting dress (To-Can package) mode.

3. dwindle the inner distance that laser beam enters organic resin (EPOXY) encapsulant, reduced the variable quantity of the caused organic resin material of laser significantly, the variable quantity that also comprises the caused laser of organic resinous substances, this not only makes the organic resin material not have accelerated ageing and the situation that produces nonlinear optical phenomena.

4. can obtain to possess most important four the characteristic-coherences of former laser, monochromaticjty, directivity and high-intensity performance.

5. can increase the scope of its use in application systems such as optical communication, accurate measurement and location, pattern identification, optical Information Processing and holographys.

Below in conjunction with accompanying drawing, to this novel above-mentionedly is described in more detail with other technical characterictic and advantage.

Description of drawings

Fig. 1 is first design diagram of organic resin of the present utility model (EPOXY) encapsulating structure improvement;

Figure 1A is the vertical view of Fig. 1 structure;

Figure 1B and Fig. 1 C are the stereoscopic figure of the different angles of Fig. 1 structure;

Fig. 2 is second design diagram of organic resin of the present utility model (EPOXY) encapsulating structure improvement;

Fig. 2 A is the vertical view of Fig. 2 structure;

Fig. 2 B and Fig. 2 C are the stereoscopic figure of the different angles of Fig. 2 structure;

Fig. 3 is the design diagram of metal can encapsulation (To-Can package) mode of existing laser lamp;

Fig. 3 A is the vertical view of Fig. 3 structure;

Fig. 3 B and Fig. 3 C are the stereoscopic figure of the different angles of Fig. 2 structure;

Fig. 4 is packaged into the design diagram of arc shape (concavees lens effect) for the organic resin (EPOXY) of existing light-emitting diode;

Fig. 5 is packaged into the design diagram of arc shape (convex lens effect) for the organic resin (EPOXY) of existing light-emitting diode;

Fig. 6 is packaged into the design diagram of flat-top shape for the organic resin (EPOXY) of existing light-emitting diode;

Fig. 7 is packaged into the design diagram of flat-top shape for the organic resin (EPOXY) of existing light-emitting diode;

Fig. 8 is packaged into the design diagram of three limit flat shapes for the organic resin (EPOXY) of existing light-emitting diode;

Fig. 9 is laser beam (Gaussian beam) schematic cross-section;

Figure 10 is that laser beam (Gaussian beam) is propagated schematic diagram.

Description of reference numerals

The utility model: 11,21-first support; 111,211-bowl portion; 112,212-first contact feet; 12,22-second support; 121,221-second contact feet; 13,23-wall emission (VCSEL type) laser diode chip; 14,24-organic resin (EPOXY) encapsulant; 141,241-groove plane; 15,25-plain conductor; 16-truncation limit; The 26-projection; 17,27-laser beam;

Prior art: the bottom surface of 311-hollow metal lid; 312-first contact feet; 321-second contact feet; 33-wall emission (VCSEL type) laser diode chip; 34-hollow metal lid; The 341-hollow part; The 35-plain conductor; The 36-projection; The 37-laser beam; 44,54,64,74,84-organic resin (EPOXY) encapsulant; The 441-cancave cambered surface; 47,57,87-laser beam; The 541-convex globoidal; 641,741-flat-head type outgoing plane; The 841-sphere; The amplitude of A-beam wave surface; W (z)-beam cross section radius.

Embodiment

At first see also shown in Fig. 1 and Figure 1A, it is respectively front view of the present utility model and top view, the utility model discloses the improvement of laser lamp encapsulating structure, it mainly is by first support 11, second support 12, surface emitting laser transistor chip 13 and organic resin (EPOXY) encapsulant 14 is formed, wherein, this first support 11 is provided with the bowl portion 111 of an indent, the below extension is provided with first contact feet 112, and second support 12 is adjacently to keep a spacing distance at first support 11 but with first support 11, below second support 12, be provided with second contact feet 121, to in 13 of wall emission (VCSEL type) laser diode chips are arranged on the bowl portion 111 of first support, 11 tops, anode in this wall emission (VCSEL type) laser diode chip 13 is to utilize a plain conductor 15 to be connected with second support 12 to electrically conduct, extremely at organic resin (EPOXY) encapsulant 14, be with aforesaid first support 11, second support 12, wall emission (VCSEL type) laser diode chip 13 wrappers such as grade are within it attached, only expose first contact feet 112 and second contact feet 121, the end face of this organic resin (EPOXY) encapsulant 14 be provided with can with wall emission (VCSEL type) the laser diode chip 13 rounded groove plane 141 of the vertical section of 17 direct of travels that gives off laser beam.

The utility model has aforesaid design, mainly be because the utility model people finds through test repeatedly, the light beam that is emitted when wall emission (VCSEL type) laser diode chip 13 horizontal directions, enter organic resin (EPOXY) encapsulant 14 inside, when distance is longer, more increase the variable quantity of the caused organic resin material of its laser, the variable quantity that also comprises the caused laser of organic resinous substances, this effect not only can make the accelerated ageing of organic resin material and produce nonlinear optical phenomena, more can influence four characteristic (coherences of laser, monochromaticjty, directivity and high strength) performance, when laser beam enters in the air via organic resin (EPOXY) encapsulant 14 end faces again, and when investing the demand direction of wanting and advancing, if the design of organic resin (EPOXY) encapsulant 14 end face camber shapes, cancave cambered surface 441 as shown in Figure 4, convex globoidal 541 shown in Figure 5, or sphere 841 shown in Figure 8, quite in the design of convex lens or concavees lens effect, its laser beam 47 then, 57,87 also can be subjected to very big change, when the imaging of research ordinary optical system, we suppose that the luminous intensity of spherical wave on all directions that the conventional point light source is sent is identical, be that the amplitude of each point equates on the beam wave surface, and laser is as a kind of light source, light distribution in its beam cross section is inhomogeneous, be that the amplitude of each point is unequal (as shown in Figure 9) on the beam wave surface, as seen from Figure 9, the amplitude A of beam wave surface is to be Gauss (Gauss) type function to distribute, so laser beam is called Gaussian beam again, we also can find out from Figure 10, when Gaussian beam is propagated in uniform transparent medium, its beam cross section radius W (Z) is that non-linear pass is with the Z axle, but a kind of nonlinear dependence is, these are different fully with the propagation of the homocentric pencil of rays in uniform dielectric, so the section radius track of Gaussian beam is a pair of hyperbola, we can not handle the angle of divergence of Gaussian beam and have intrinsic astigmatism with the angle of divergence of handling the concentric spherical light beam, therefore the arc shape design of organic resin encapsulation end face, it is little to use the design of convex lens or concavees lens effect all can't obtain divergence, the laser beam that collimation is high, so the end face encapsulating structure at laser lamp is modified to the design with groove plane, can possess most important four the characteristic-coherences of former laser, monochromaticjty, directivity and high-intensity performance, this part promptly is the maximum break through direction that the utility model people is found, and the application of cooperation scientific principle and the continuous effort of process, test and improvement are proposing a kind of new laser lamp encapsulating structure eventually.

The utility model is by becoming to have the flat-top encapsulation (the groove plane 141 as shown in Figure 1) on groove plane with laser lamp encapsulating structure improvement design, its characteristic is to dwindle the inner distance that laser beam enters organic resin (EPOXY) encapsulant 14, reduced the variable quantity of the caused organic resin material of laser significantly, the variable quantity that also comprises the caused laser of organic resinous substances, this not only makes the organic resin material not have accelerated ageing and the situation that produces nonlinear optical phenomena, possesses most important four the characteristic-coherences of former laser and can keep, monochromaticjty, directivity and high-intensity performance; To the degree of depth that is caved on this groove plane 141, then do not touch mutually to principle gets final product with this plain conductor 15 with its bottom, decide on these plain conductor 15 packaged height.

Please consult shown in Fig. 1 and Figure 1A to Fig. 1 C simultaneously, this organic resin (EPOXY) encapsulant 14 bottom outer rims have truncation limit 16, this truncation limit 16 is the usefulness for the location, can limit its rotation, except that this, see also shown in Fig. 2 and Fig. 2 A to Fig. 2 C, this embodiment mainly is by first support 21, second support 22, wall emission (VCSEL type) laser diode chip 23 and organic resin (EPOXY) encapsulant 24 are formed, wherein, this first support 21 is provided with the bowl portion 211 of an indent, the below extension is provided with first contact feet 212, and second support 22 is adjacently to keep a spacing distance at first support 21 but with first support 21, below second support 22, be provided with second contact feet 221, to in 23 of wall emission (VCSEL type) laser diode chips are arranged on the bowl portion 211 of first support, 21 tops, anode in this wall emission (VCSEL type) laser diode chip 23 is to utilize a plain conductor 25 to be connected with second support 22 to electrically conduct, extremely at organic resin (EPOXY) encapsulant 24, be with aforesaid first support 21, second support 22, wall emission (VCSELtype) laser diode chip 23 wrappers such as grade are within it attached, only expose first contact feet 212 and second contact feet 221, the end face of this organic resin (EPOXY) encapsulant 24 be provided with can with the vertical groove plane 241 of wall emission (VCSEL type) laser diode chip 23 27 direct of travels that give off laser beam; The characteristics of present embodiment are that the outer rim of the bottom of this organic resin (EPOXY) encapsulant 24 forms a projection 26, the effect of this projection 26 is the groove (not shown)s that can snap in a holder, reach the usefulness that restriction is rotated and located by this, its effect is identical with truncation limit 16 shown in Figure 1.

What must emphasize in addition is, as Fig. 1, shown in Figure 2, the utility model is at this organic resin (EPOXY) encapsulant 14,24 end face is provided with this groove plane 141,241, need not change former encapsulation Outside Dimensions, both can shorten laser beam 17,27 distances that penetrate, can keep simultaneously this organic resin (EPOXY) encapsulant 14 again, 24 existing intensity, compare at Fig. 6 and Fig. 7 flat-head type outgoing plane 641,741 design, the utility model can reduce this organic resin (EPOXY) encapsulant 14 really significantly, 24 pairs of these laser beams 17,27 may impact four characteristic (coherences of laser, monochromaticjty, directivity and high strength) performance performance.

In sum, the improvement of the utility model laser lamp encapsulating structure, its alteration of form by encapsulant top on the laser lamp is designed to have the flat-top encapsulation on groove plane, laser lamp of the present utility model can be produced possess most important four the characteristic-coherences of former laser, monochromaticjty, directivity and high-intensity performance, make laser lamp of the present utility model can increase the scope of its use in application systems such as optical communication, accurate measurement and location, pattern identification, optical Information Processing and holographys.

More than explanation is novel just illustrative for this; and it is nonrestrictive; those of ordinary skills understand; under the situation of the spirit and scope that do not break away from following claims and limited; can make many modifications; change, or equivalence, but all will fall in the protection range of the present utility model.

Claims (4)

1. laser lamp encapsulating structure improvement mainly includes:

First support, this first support is provided with the bowl portion of an indent, and the below extension is provided with first contact feet;

Second support, this second support are adjacent at first support but keep a spacing distance with first support, are provided with second contact feet below second support;

Surface emitting laser transistor chip, this chip are arranged in the bowl portion of first support top;

Encapsulant is that wrappers such as aforesaid first support, second support, laser chip is within it attached, only exposes first contact feet and second contact feet, it is characterized in that: the end face of this encapsulant be provided with can be vertical with laser road direct of travel the groove plane.

2. laser lamp encapsulating structure as claimed in claim 1 improvement is characterized in that, set bowl portion on this first support, and its section is rounded.

3. laser lamp encapsulating structure improvement as claimed in claim 1 is characterized in that an end of this plain conductor is the anode that is connected the surface emitting laser transistor chip.

4. laser lamp encapsulating structure improvement as claimed in claim 1 is characterized in that this encapsulant is to use the organic resin material to make.

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