CN2924425Y - Semiconductor heat pump type diaphragm pump - Google Patents
Semiconductor heat pump type diaphragm pump Download PDFInfo
- Publication number
- CN2924425Y CN2924425Y CNU2006201040755U CN200620104075U CN2924425Y CN 2924425 Y CN2924425 Y CN 2924425Y CN U2006201040755 U CNU2006201040755 U CN U2006201040755U CN 200620104075 U CN200620104075 U CN 200620104075U CN 2924425 Y CN2924425 Y CN 2924425Y
- Authority
- CN
- China
- Prior art keywords
- pump
- heat pump
- barrier film
- thermoelectric heat
- diaphragm
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
- F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
- F25B2321/023—Mounting details thereof
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- Reciprocating Pumps (AREA)
Abstract
The utility model relates to a semiconductor thermal pump type diaphragm pump which includes a semiconductor thermal pump and a diaphragm. The semiconductor thermal pump closely contacts the diaphragm; the diaphragm is filled with volatile medium; the diaphragm is a extension-type diaphragm. The utility model has the advantages of avoiding the use of shaft type motor, which simplifies the structure of the ordinary pump, so the pump is small in volume and light in weight. Furthermore, the semiconductor thermal pump is used as the heat exchange source for expand or contract the air, so the energy density is high and the cooling speed is fast. Additionally, as no mechanically rotating part is used, the utility model is noiseless, vibration-free, wear-free and has long service life and high reliability.
Description
Technical field
The utility model relates to a kind of pump, particularly a kind of thermoelectric heat pump formula membrane pump.
Background technology
Pump is to utilize power with the device of fluid from a position transfer to the another location.Existing pump its generally by motor as driving force because the general volume of motor, weight are bigger, so the volume and weight of entire pump is also bigger, can not be applied to less place, space, its scope of application is less.
Thermoelectric heat pump also claims semiconductor cooler, or title thermoelectric cooling module, electronic refrigerator etc., it utilizes semi-conductive Peltier effect and Thomson effect to produce, because participate in the carrier average energy difference of conduction in two kinds of conductors, when carrier when the high conductor of energy moves into the low conductor of energy, just discharge unnecessary energy (heat release), on the contrary, then absorb energy (heat absorption) from the external world.Therefore utilize its these characteristics, just can heat or coolant seal holds the medium in the body and makes its gasification or condensation, hold the body motion thereby promote sealing.
Summary of the invention
Technical problem to be solved in the utility model is to overcome the above-mentioned defective of technology and little, the lightweight thermoelectric heat pump formula of a kind of volume membrane pump is provided.
The utility model solves the problems of the technologies described above the technical scheme that is adopted:
Thermoelectric heat pump formula membrane pump is characterized in that: comprise thermoelectric heat pump and barrier film, described thermoelectric heat pump is close on the barrier film, is filled with the effumability medium in the described barrier film, and barrier film is scalable barrier film.
Above-mentioned thermoelectric heat pump formula membrane pump relies on the transducing head of thermoelectric heat pump as medium in the barrier film, thermoelectric heat pump makes the effumability medium in the seal cavity of barrier film produce transfer of heat, thereby thereby the medium in evaporation and the condensation barrier film promotes the barrier film reciprocating motion.
When above-mentioned thermoelectric heat pump formula membrane pump uses, place needs to carry the confined space of liquid,, therefore reach the purpose of carrying fluid by the turnover of the fluid in the confined space that motion promotes with barrier film is connected of barrier film.
Above-mentioned thermoelectric heat pump formula membrane pump also can directly connect barrier film the object that need to promote, the reciprocating motion of the object that the reciprocating motion by barrier film promotes to be close to it.
Working media in the above-mentioned barrier film, the liquid that is more or less the same than operating ambient temperature of boiling point can both be as medium in theory, it is relevant that but the stability of medium, corrosivity, ratio of specific heat appearance, heat of evaporation, vapour pressure are directly connected to security, cost and the operating efficiency of whole device, and directly have influence on the material of barrier film and exocoel guest materials and research staff's security.
The shape of barrier film can be decided according to the environment that is suitable for.
Compared with prior art, advantage of the present utility model is: saved axis motor, simplified common pump structure, therefore volume is little, in light weight, also as the heat exchange source gas is expanded with thermoelectric heat pump or shrink because of it, its energy density height, refrigeration speed is fast, in addition because no mechanical running gear, so noiseless, friction, nothing are worn and torn, the life-span is long, reliability is high.
Description of drawings
Fig. 1 is the structural representation of the utility model embodiment.
Fig. 2 is the structural representation of another embodiment of the utility model.
The specific embodiment
Embodiment describes in further detail the utility model below in conjunction with accompanying drawing.
As shown in Figure 1, thermoelectric heat pump formula membrane pump, it comprises thermoelectric heat pump 2 and barrier film 1, barrier film 1 usefulness screw 8 is connected on the pedestal 4, add the effumability medium in the diaphragm cavity 11, cover plate 5 with holes is pushed down in the middle of the barrier film external application, and pedestal 4 opposite sides connect thermoelectric heat pump 2, thermoelectric heat pump 2 places connect fin 3, pass fin 3 and cover plate 5 back nuts 6 with screw 7 again.
Also available welding manner connects between above-mentioned cover plate, barrier film, pedestal.
Above-mentioned effumability medium is an ether, also can be freon etc.
During the energising of above-mentioned thermoelectric heat pump formula membrane pump, the one side heats up, and barrier film 1 heats up thereupon, the ether absorption heat in the diaphragm cavity 11 and be evaporated to certain pressure and promote barrier film 1 and outwards move.Otherwise too, when the logical electricity in the other direction of thermoelectric heat pump 2, barrier film 1 cooling, the ether in the diaphragm cavity 11 become liquid, and the pressure in the barrier film descends and barrier film shrinks.Therefore the available current direction is controlled the direction of motion of barrier film, controls the movement rate of barrier film with size of current.
The material of barrier film can be according to the impulse stroke of product, operating pressure, work inside and outside medium, and operating frequency or the like is chosen, choosing interior media is ether, external agency is water or air, in the present embodiment when operating frequency 1HZ, operating pressure 0.2MP, working diameter 32mm, under the condition of unidirectional stroke 10mm, select the polytetrafluorethylecoatings coatings rubber film for use.
As shown in Figure 2, thermoelectric heat pump formula membrane pump is made up of two thermoelectric heat pump formula membrane pumps, and the centre is a thermoelectric heat pump 4, omitted the conducting strip 3 among the embodiment 1, during work, thermoelectric heat pump two sides become cold and hot different state, principle is similar to embodiment 1, no longer is described in detail.
Claims (4)
1, thermoelectric heat pump formula membrane pump is characterized in that: comprise thermoelectric heat pump and barrier film, described thermoelectric heat pump is close on the barrier film, is filled with the effumability medium in the described barrier film, and barrier film is scalable barrier film.
2, thermoelectric heat pump formula membrane pump as claimed in claim 1 is characterized in that: described barrier film one side is fixed on the pedestal, and pedestal links to each other with thermoelectric heat pump, and described barrier film opposite side is fixed by the cover plate of centre band barrier film through hole.
3, thermoelectric heat pump formula membrane pump as claimed in claim 1 or 2, it is characterized in that: described thermoelectric heat pump place is fixing cooling fins also.
4, thermoelectric heat pump formula membrane pump as claimed in claim 1 or 2 is characterized in that: described thermoelectric heat pump opposite side is fixed same thermoelectric heat pump formula membrane pump.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2006201040755U CN2924425Y (en) | 2006-05-26 | 2006-05-26 | Semiconductor heat pump type diaphragm pump |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2006201040755U CN2924425Y (en) | 2006-05-26 | 2006-05-26 | Semiconductor heat pump type diaphragm pump |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2924425Y true CN2924425Y (en) | 2007-07-18 |
Family
ID=38260858
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2006201040755U Expired - Fee Related CN2924425Y (en) | 2006-05-26 | 2006-05-26 | Semiconductor heat pump type diaphragm pump |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2924425Y (en) |
-
2006
- 2006-05-26 CN CNU2006201040755U patent/CN2924425Y/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20070718 |