CN2916645Y - Support base for image sensor test - Google Patents
Support base for image sensor test Download PDFInfo
- Publication number
- CN2916645Y CN2916645Y CN 200620002361 CN200620002361U CN2916645Y CN 2916645 Y CN2916645 Y CN 2916645Y CN 200620002361 CN200620002361 CN 200620002361 CN 200620002361 U CN200620002361 U CN 200620002361U CN 2916645 Y CN2916645 Y CN 2916645Y
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- China
- Prior art keywords
- stacker
- image sensor
- sheet material
- testing image
- sensor according
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Abstract
The utility model relates to a bearing base for picture sensor comprising a base and a plate material with high transparency rate. The base is provided with a capacity room for placing the picture sensor to be tested. The side wall of the capacity room can restrict the position of the picture sensor. The plate material is fixed on the base and forms a sealing end with the side wall. The picture sensor is arranged in the capacity room an opening end opposite the base, and the picture sensing area of the picture sensor is against the plate surface. The plate area should be bigger than that of the picture sensing area, so that the test beams can enter the picture sensing area thoroughly.
Description
Technical field
This creation relates to a kind of stacker that is used for testing image sensor, relates in particular to a kind of CMOS (Complementary Metal Oxide Semiconductor) (Complementary Metal-Oxide Semiconductor that is applicable to; CMOS) imageing sensor is with irradiated area that improves test light and the stacker that shines quality.
Background technology
Cmos image sensor is the photovalve that the standard semiconductor processing procedure produces, and can utilize the conventional semiconductor device fabrication, has the integrated characteristic of height system simultaneously, so gradually towards the integrated technique direction development of single-chip.Cmos image sensor has been widely applied at present in each side such as digital camera, picture-phone and third generation mobile phones, with the optical sensor as the image retrieval purposes.With development time charge coupled cell (Charge Coupled Device more of a specified duration; CCD) compare, cmos image sensor has become another main flow of image development in science and technology.
Because the function of imageing sensor is the image of retrieval object, except in the test processing procedure, needing to detect when exporting and receive electronic signal whether correct reaction is arranged, the more important thing is and to confirm correctly sensed image of imageing sensor as other semiconductor element.In other words, imageing sensor is after encapsulation is finished, the specification of being scheduled to when needing check whether to meet design, for example: correlation parameters such as pixel, focal length and image range drift rate, after can guaranteeing that so just imageing sensor is installed in application system or electronic product, can sense correct image and make system or electronic product that the performance of correct performance be arranged.
Along with the continuous progress of encapsulation technology, the outward appearance of the photovalve after the encapsulation all changes towards light, thin, short, little trend.Conventional image sensor is no guide feet chip bearing (the Leadless Chip Carrier with large volume; LCC) pattern encapsulates, yet gradually by chip size encapsulation (Chip Scale Package; CSP) technology of pattern replaces.Fig. 1 is the schematic appearance of the imageing sensor of a conventional chip size packages pattern.Packaging body 13 surfaces of described imageing sensor 10 have an image sensing district 11 that can accept light, and another surface then is provided with a plurality of tin balls 12 as element I/O (I/O).On the other hand, along with the lifting of pixel quantity, also more and more near packaging body 13 edges, just the area of non-sensing unit or proportion become littler in the periphery in image sensing district 11.
When test, imageing sensor 10 is to place on the stacker 20 of a test usefulness, and common described stacker 20 can allow four edges of described packaging body 13 or three edge breastings on it, as shown in Figure 2.Stacker 20 has the room 21 that can place imageing sensor to be tested, and a flange 23 is arranged at contiguous again room 21 bottoms, can be for the surperficial breasting in tool image sensing district 11 on the packaging body 13.Shine when test light 80 is made progress by flange 23, image sensing district 11 can accept described test light 80.Last imageing sensor 10 will be tested light 80 and be converted to electric signal, and output to Test Host (not shown) by the tin ball 12 of top.
With regard to current chip size encapsulation pattern, the width h of the non-image sensing unit of imageing sensor 10 is about 0.1mm, and stacker 20 upper flanges 23 width H then are difficult to accomplish less than 0.1mm still can have the breasting function relatively, so H must be greater than h.The enlarged drawing of a-quadrant among Fig. 2 as shown in Figure 3, the breasting face 22 of flange 23 not only covers the edge in image sensing district 11 thus, make the edge in image sensing district 11 can't accept to test light 80, can cause and test the integrality that goes up the dead angle and influence test result; Or produce shade and make image sensing district 11 localized distortions, and can influence the correctness of test result equally.
In sum, need in a hurry a kind of not only effective still image sensor on the market, can also promote the stacker of test result integrality and correctness.
The utility model content
The purpose of this creation provides a kind of stacker that is used for testing image sensor, and it improves the supporting structure of stacker and promotes the integrality and the correctness of test result.
Another purpose of this creation provides a kind of stacker that is compatible with present testing apparatus, except effective still image sensor, does not need any conversion just can be directly used in present testing apparatus.
For achieving the above object, this creation discloses a kind of stacker that is used for testing image sensor, and it comprises the sheet material of a pedestal and a high transmission rate.Described pedestal has the room that can place imageing sensor to be tested, and the sidewall of described room can limit described imageing sensor in position to be measured.Described again sheet material is to be fixed on the described pedestal, and forms a blind end of described room with described adjacent sidewalls.Described imageing sensor is by inserting in the described room with respect to the open end of described pedestal, and the image sensing district of described imageing sensor is resisted against described plate surface.The area of described sheet material is greater than the area in described image sensing district, therefore tests light and can fully enter in the described image sensing district.Described sheet material can be a clear glass or an equal mating plate, so that test light passes.
By above-mentioned design, the load bearing seat of this creation has used the sheet material of high transmission rate, can be when not covering image sensing district or its edge, the load image sensor, thereby can not stop the test light in irradiation image sensing district, influence the integrality of test result or make image sensing district localized distortion.Thereby this creation provides a kind of effectively still image sensor and has promoted the load bearing seat of test result integrality and correctness.
In addition, can stack an equal mating plate, optical filter, polaroid or light damping plate in described plate surface, described test light penetrates described sheet material to image sensing again through described equal mating plate, optical filter, polaroid or light damping plate earlier.
Description of drawings
Fig. 1 is the schematic appearance of the imageing sensor of a conventional chip size packages pattern;
Fig. 2 is the cut-open view that routine is used for the stacker of testing image sensor;
Fig. 3 is the zoomed-in view of A part among Fig. 2;
Fig. 4 is the cut-open view that this creation is used for the stacker of testing image sensor; With
Fig. 5 is this cut-open view of creating the stacker of another embodiment.
Embodiment
Fig. 4 is the cut-open view that this creation is used for the stacker of testing image sensor.Stacker 40 comprises the sheet material 42 of a pedestal 41 and a high transmission rate, and described pedestal 41 has the room 411 that can place imageing sensor 10 to be tested.The size of room 411 can be held the packaging body 13 of imageing sensor 10 just, and promptly the sidewall 412 of room 411 can limit described imageing sensor 10 in a position to be measured.Described again sheet material 42 is to be fixed in the pickup groove 413 of described pedestal 41, and forms a blind end of described room 411 with sidewall 412 adjacency, and its surface can be held entire image sensing unit 11 and but do not covered entering of test light 80.Sheet material 42 is not limited by present embodiment with the affixed mode of pedestal 41, can also fixture (scheming not show) or alternate manner sheet material 42 edges are locked on the pedestal 41 admittedly.
Fig. 5 is this cut-open view of creating the stacker of another embodiment.Stacker 40 ' comprise an equally pedestal 41 ' and the sheet material 42 of a high transmission rate, described pedestal 41 ' have can place the room 411 of imageing sensor 10 to be tested '.Room 411 ' size can hold the packaging body 13 of imageing sensor 10 just, promptly room 411 ' sidewall 412 ' can limit described imageing sensor 10 in illustrated position to be measured.Described again sheet material 42 be fixed in described pedestal 41 ' pickup groove 413 ' in, and form with sidewall 412 ' adjacency described room 411 ' a blind end, what its surface can hold that entire image sensing unit 11 but do not cover test light 80 enters sheet material 42.
Compare with Fig. 4, Fig. 5 is in the stacked optical processing sheet 43 in sheet material 42 surfaces of high transmission rate, for example: equal mating plate, optical filter, polaroid or light damping plate, described test light 80 penetrates described sheet material 42 to image sensing district 11 again through described optical processing sheets 43 earlier.And can with pedestal 41 ' near test light 80 upstream ends form comprise inclined-plane 414 ' corner angle, so can avoid oblique ray to be blocked and cause shade in the image sensing district 11.
The sheet material 42 of this creation Cheng Alto is really lived imageing sensor 10.Compare with Fig. 2 flange 23, then may be, and support is lived imageing sensor 10 really because imageing sensor 10 be inserted the angular deviation of stacker 20, even allow imageing sensor 10 block or fall below and damage.
The technology contents and the technical characterstic of this creation disclose as above, yet the those skilled in the art still may be based on the teaching of this creation and announcement and made all substitutions and modifications that do not deviate from this creation spirit.Therefore, the protection domain of this creation should be not limited to the content that embodiment discloses, and should comprise the various substitutions and modifications that do not deviate from this creation, and is contained by appending claims.
Claims (11)
1. a stacker that is used for testing image sensor can make at least one imageing sensor to be tested be defined in test position, and allows the image sensing district of test irradiate light described imageing sensor, it is characterized in that comprising:
One pedestal has the room that can place described imageing sensor, and the sidewall of described room can limit described imageing sensor in described test position; With
The sheet material of one high transmission rate is to be fixed in described pedestal and adjacent with described sidewall, and the first surface of described sheet material can be held described imageing sensor;
The area of wherein said sheet material is greater than the area in described image sensing district, the test penetrable described sheet material of light and entering in the described image sensing district.
2. the stacker that is used for testing image sensor according to claim 1 is characterized in that described sheet material is a blind end that forms described room with described sidewall.
3. the stacker that is used for testing image sensor according to claim 1 is characterized in that described sheet material is a clear glass or an equal mating plate.
4. the stacker that is used for testing image sensor according to claim 1 is characterized in that described stacker comprises an optical processing sheet that is stacked and placed on the second surface of described sheet material in addition.
5. the stacker that is used for testing image sensor according to claim 4 is characterized in that described optical processing sheet is an equal mating plate, optical filter, polaroid or light damping plate.
6. the stacker that is used for testing image sensor according to claim 1 is characterized in that described pedestal has the pickup groove that can fix described sheet material.
7. the stacker that is used for testing image sensor according to claim 1 is characterized in that it is a tapered configuration that described pedestal is accepted the described test light place of entering.
8. the stacker that is used for testing image sensor according to claim 1 is characterized in that it is the inclined-plane that described pedestal is accepted the sidewall at the described test light place of entering, and described inclined-plane is around the taper surface that forms cone part.
9. the stacker that is used for testing image sensor according to claim 1 is characterized in that described room can hold the packaging body of described imageing sensor just.
10. the stacker that is used for testing image sensor according to claim 1 is characterized in that described imageing sensor is the element of CMOS (Complementary Metal Oxide Semiconductor) pattern.
11. the stacker that is used for testing image sensor according to claim 1 is characterized in that described imageing sensor is to adopt chip size packages.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200620002361 CN2916645Y (en) | 2006-02-17 | 2006-02-17 | Support base for image sensor test |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200620002361 CN2916645Y (en) | 2006-02-17 | 2006-02-17 | Support base for image sensor test |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2916645Y true CN2916645Y (en) | 2007-06-27 |
Family
ID=38187559
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200620002361 Expired - Lifetime CN2916645Y (en) | 2006-02-17 | 2006-02-17 | Support base for image sensor test |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2916645Y (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103700602A (en) * | 2013-12-13 | 2014-04-02 | 格科微电子（上海）有限公司 | Wafer aligning method for wafer-level testing of image sensor |
| CN103730385A (en) * | 2013-12-13 | 2014-04-16 | 格科微电子（上海）有限公司 | Wafer level testing system and method for image sensor |
| CN111474465A (en) * | 2020-04-27 | 2020-07-31 | 上海精密计量测试研究所 | Flat package semiconductor device clamp for EMMI analysis and analysis method |
-
2006
- 2006-02-17 CN CN 200620002361 patent/CN2916645Y/en not_active Expired - Lifetime
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103700602A (en) * | 2013-12-13 | 2014-04-02 | 格科微电子（上海）有限公司 | Wafer aligning method for wafer-level testing of image sensor |
| CN103730385A (en) * | 2013-12-13 | 2014-04-16 | 格科微电子（上海）有限公司 | Wafer level testing system and method for image sensor |
| CN103730385B (en) * | 2013-12-13 | 2016-05-25 | 格科微电子（上海）有限公司 | The wafer-level test system and method for imageing sensor |
| CN103700602B (en) * | 2013-12-13 | 2016-06-29 | 格科微电子（上海）有限公司 | Wafer alignment method suitable in imageing sensor wafer-level test |
| CN111474465A (en) * | 2020-04-27 | 2020-07-31 | 上海精密计量测试研究所 | Flat package semiconductor device clamp for EMMI analysis and analysis method |
| CN111474465B (en) * | 2020-04-27 | 2022-06-24 | 上海精密计量测试研究所 | Flat package semiconductor device clamp for EMMI analysis and analysis method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20070627 |
|
| EXPY | Termination of patent right or utility model |