CN103700602A - Wafer aligning method for wafer-level testing of image sensor - Google Patents
Wafer aligning method for wafer-level testing of image sensor Download PDFInfo
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- CN103700602A CN103700602A CN201310684987.9A CN201310684987A CN103700602A CN 103700602 A CN103700602 A CN 103700602A CN 201310684987 A CN201310684987 A CN 201310684987A CN 103700602 A CN103700602 A CN 103700602A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
- H01L22/34—Circuits for electrically characterising or monitoring manufacturing processes, e. g. whole test die, wafers filled with test structures, on-board-devices incorporated on each die, process control monitors or pad structures thereof, devices in scribe line
Abstract
The invention relates to a wafer aligning method for wafer-level testing of an image sensor. The method comprises the following steps of moving a light source unit or a bearing device in the vertical direction, so as to enable the light source unit and the bearing device to get close in the vertical direction, and enabling a testing probe card device to move downwards in the vertical direction; providing a positioning window arranged on a testing probe card, and providing at least two positioning points in the testing wafer; enabling the testing probe card device to find the positioning point on the testing wafer by the positioning window through a camera, further adjusting the angle of the wafer, enabling the testing probe card device to be parallel with the testing wafer, and matching the position of the testing wafer; providing an auxiliary probe aligning unit which is arranged on the testing probe card device, and enabling at least two auxiliary probe heads of the probe aligning unit to expose out of the lower surface of the testing probe card device; enabling the auxiliary probe heads of the auxiliary probe aligning unit to be in contact with a welding ball point of a wafer particle, and matching the testing probe card device and the position of the welding ball point of the wafer particle, so as to align the testing probe card device and the testing wafer.
Description
Technical field
The present invention relates to semiconductor test technical field, particularly a kind of wafer alignment method that is applicable to imageing sensor wafer-level test.
Background technology
CMOS(Complementary Metal Oxide Semiconductor, complementary metal oxide semiconductors (CMOS)) manufacturing process of imageing sensor is: design, wafer(wafer) productions, colored filter membrane, CSP(Chip Scale Package, wafer-level package), test.In On-Wafer Measurement step, need to carry out testing electrical property to described crystal grain, to guarantee that the crystal grain on Silicon Wafer is qualified product before encapsulation, so wafer sort is to improve one of committed step of semiconductor device yield.
Generally speaking, the cmos image sensor product that arrives test is the single product of well cutting, but along with the size of the more and more less single test products of cmos image sensor size is also more and more less, the test operation of single test products is more and more difficult.On the other hand, in single product test, need to repeatedly carry out the Pick-and-Place operations of one single chip, easily damage chip and cause rate of finished products to reduce, therefore reduce the production capacity that testing efficiency affects final chip; And pick up and put the non-cutting time that action need to be longer, therefore also reduced testing efficiency.
The groundwork principle of cmos image sensor wafer-level test is: in LED-backlit source, provide under bright, dark two kinds of different light environment, by being connected with the testing needle card of other corollary apparatus, contact with the soldered ball point of each crystal grain in wafer the information of extracting relevant voltage, electric current and image, thereby realize the judgement to product yield.
Yet, in existing technique, along with the cmos sensor product of test is more and more less, because the alignment precision of testing needle card and soldered ball point is low, the alignment precision demand of unapproachable cmos image sensor wafer-level test, thereby can not to each crystal grain in wafer, carry out testing electrical property exactly, reduce the accuracy of cmos image sensor wafer-level test.
Therefore, provide a kind of wafer alignment method that is applicable to imageing sensor wafer-level test, become those skilled in the art's problem demanding prompt solution.
The information that is disclosed in this background of invention technology part is only intended to deepen the understanding to general background technology of the present invention, and should not be regarded as admitting or imply that in any form this information structure has been prior art known in those skilled in the art.
Summary of the invention
For solving the deficiencies in the prior art, the invention provides a kind of wafer alignment method that is applicable to imageing sensor wafer-level test of high alignment precision and low complex degree.
In order to achieve the above object, the invention provides a kind of wafer alignment method that is applicable to imageing sensor wafer-level test, light source cell is provided, be located thereon portion testing needle card device, be carried on the test wafer on a bogey, the photosurface of described test wafer is towards bogey setting, between light source cell described in described test wafer is vertically placed in and described testing needle card device, the one side of described testing needle card device is provided with at least two testing needles, and described wafer alignment method comprises step as described below:
A) by vertical direction mobile light source unit or bogey make described light source cell and described bogey vertically mutually close; Accordingly, testing needle card device vertically moves down;
B) provide the anchor window that is arranged at described testing needle card; The anchor point of at least two is provided in described test wafer; Described testing needle card device is found the anchor point on test wafer by described anchor window by camera, and then adjusts the angle of wafer, makes described testing needle card device parallel with described test wafer, the position of matching test wafer;
C) provide and be arranged at the auxiliary to pin unit of testing needle card device; The described auxiliary lower surface that at least two of pin unit auxiliary syringe needles is exposed to described testing needle card device; Described testing needle card device is near described test wafer, the described auxiliary soldered ball point that the auxiliary syringe needle of pin unit is contacted with to described crystal grain, the position of the crystal grain of matching test pin card device and test wafer, realizes aiming at of testing needle card device and test wafer.
Preferably, described assisting is the cellular type material of pin type material or printing opacity to pin unit, and it runs through the testing needle card device described in being arranged at.
Preferably, described assisting is the intercrystalline distance of N* to the distance of pin unit and adjacent described testing needle, and wherein, N is more than or equal to 1 natural number.
Preferably, described anchor window is two, and it is arranged at intervals at described testing needle card device middle part, and runs through the testing needle card device described in being arranged at.
Preferably, described assisting is arranged at the region between two described anchor windows to pin unit, and runs through the testing needle card device described in being arranged at.
Preferably, described step C) in, the described auxiliary soldered ball point that the auxiliary syringe needle of pin unit is contacted with to described crystal grain, is transmitted in a terminal by corresponding positional information, and whether described terminal mates by the position described in analysis confirmation;
Wherein, if coupling finishes wafer alignment;
If do not mate, by described bogey, control described test wafer and finely tune a distance in horizontal direction, the further corresponding positional information of transmission that contacts by described auxiliary syringe needle and described soldered ball point is analyzed in described control terminal, replicate analysis with fine setting until mate.
The invention has the beneficial effects as follows: the wafer alignment method that is applicable to imageing sensor wafer-level test of the present invention is not in the situation that increasing system complexity, can make testing needle card device accurately aim at wafer, thereby can to each crystal grain in wafer, carry out testing electrical property exactly, improve the accuracy of cmos image sensor wafer-level test, and adopted wafer-level test to improve the efficiency of test.
Accompanying drawing explanation
By Figure of description and the embodiment that is used from subsequently explanation the present invention some principle with Figure of description one, the further feature that the present invention has and advantage will become and know or more specifically illustrated.
Fig. 1 is the structural representation that the present invention utilizes imageing sensor wafer-level test device.
Fig. 2 is the schematic diagram of testing needle card device of the present invention.
Fig. 3 is the flow chart that is applicable to the wafer alignment method of imageing sensor wafer-level test of the present invention.
Should understand, Figure of description might not show concrete structure of the present invention pari passu, and in Figure of description for illustrating that the n-lustrative feature of some principle of the present invention also can take the technique of painting of slightly simplifying.Specific design feature of the present invention disclosed herein for example comprises that concrete size, direction, position and profile will partly will be applied and the environment of use is determined by concrete.
In several accompanying drawings of Figure of description, identical Reference numeral represents the identical or part that is equal to of the present invention.
Embodiment
A lot of details have been set forth in the following description so that fully understand the present invention.But the present invention can implement to be much different from alternate manner described here, and those skilled in the art can do similar popularization without prejudice to intension of the present invention in the situation that, so the present invention is not subject to the restriction of following public specific embodiment.
The invention provides a kind of wafer alignment method that is applicable to imageing sensor wafer-level test, the method can provide higher alignment precision and implementation complexity low.
First described alignment methods provides imageing sensor wafer-level test device, described testing apparatus comprises: light source cell, be positioned at the testing needle card device on described light source cell top and be carried on the test wafer on a bogey, described test wafer photosurface is towards bogey setting, described test wafer is placed between described light source cell and described testing needle card device in vertical direction, wherein, described testing needle card, described test wafer and described light source cell are vertically arranged in order, and described test wafer flatly arranges between described light source cell and described testing needle card device, the one side of described testing needle card device is provided with at least two testing needles, with a plurality of crystal grain in while test wafer.Wherein, in the present invention, related vertical direction refers to the direction that is basically perpendicular to ground, and the angular range between ground is between 85 ° to 95 °.
Described wafer alignment method comprises step as described below:
A) by vertically mobile light source unit or bogey make described light source cell and described bogey vertically mutually close; Correspondingly, testing needle card device vertically moves down, and makes described light source cell and testing needle card device in the vertical direction near wafer;
B) provide the anchor window being arranged in described testing needle card device; At least two anchor points in described test wafer are provided; Described testing needle card device is found the anchor point on test wafer by being positioned at the trap setting of testing needle card device top via described anchor window, and then the angle of adjustment wafer, make described testing needle card device parallel with described test wafer, the position of matching test wafer, thus described testing needle card device is aimed at described test wafer; Wherein, described anchor window is two, and it is arranged at intervals at described testing needle card device middle part, and runs through and be arranged at described testing needle card device; Described trap setting can be camera, video camera and any suitable device that can catch image;
Particularly, during two anchor points on the corresponding wafer of testing needle card device, by finding out described two anchor points position in the XY coordinate system of the Electromechanical Control XY motor platforms of imageing sensor wafer-level test device, by adjusting described XY motor platforms to adjust the angle of wafer, make two anchor points in the value coupling of the Y-direction of XY coordinate system, thereby make testing needle card device parallel with wafer.Wherein, described XY motor platforms is carried described wafer bogey for driving moves, thereby by described XY motor platforms, adjusts the position of wafer.
C) provide and be arranged at the auxiliary to pin unit of testing needle card device; The described auxiliary lower surface that at least two of pin unit auxiliary syringe needles is exposed to described testing needle card device; Described testing needle card device is near described test wafer, the described auxiliary soldered ball point that the auxiliary syringe needle of pin unit is contacted with to described crystal grain, the position of the crystal grain of matching test pin card device and test wafer, realizes testing needle card device and aims at the further of test wafer.Wherein, described auxiliary to pin unit, be the cellular type material of pin type material or printing opacity, and run through and be arranged at described testing needle card device.Described assisting is N * intercrystalline distance to the distance of pin unit and adjacent described testing needle, wherein, N is more than or equal to 1 natural number, make at described testing needle card device parallel with described test wafer, in the situation of the position of matching test wafer, at described testing needle card device during near test wafer, described auxiliary to the auxiliary syringe needle of the unit of pin can engaged test wafer on the soldered ball point of corresponding crystal grain.
Particularly, at described step C) in, the described auxiliary soldered ball point that the auxiliary syringe needle of pin unit is contacted with to described crystal grain, transfers to a terminal by corresponding positional information, and whether described terminal mates by position described in analysis confirmation; Wherein, described positional information is the picture position data of the auxiliary syringe needle in the image obtaining by camera, position that can be by the auxiliary syringe needle of existing software judgement and direction whether with the position data of soldered ball point on the crystal grain of wafer between difference determine whether described auxiliary syringe needle mates with the position of described soldered ball point.
If coupling, finishes wafer alignment;
If do not mate, by described bogey, control described test wafer and finely tune a distance in horizontal direction, by described auxiliary syringe needle, analyze to offer described control terminal with the further corresponding positional information of transmission that contacts of described soldered ball point, replicate analysis with fine setting until mate, the further like this accuracy of aiming at that improved.
Below, by reference to the accompanying drawings specific embodiments of the invention are described.Refer to shown in Fig. 1, Fig. 1 shows the structural representation that the present invention utilizes imageing sensor wafer-level test device.Described imageing sensor wafer-level test device comprises light source cell 101, and described light source cell 101 provides light source and the brightness on the required vertical direction of imageing sensor wafer sort adjustable; Bogey 102, described bogey 102 is arranged at the top of described light source cell 101 vertical directions; Test wafer 103, described test wafer 103 is carried on described bogey 102, and described test wafer 103 photosurfaces, towards light source cell 101, include a plurality of crystal grain on described test wafer 104, the reverse side corresponding to described photosurface of each crystal grain includes a plurality of soldered ball points; Testing needle card device 104, described testing needle card device 104 is positioned at described test wafer 103 tops, and described testing needle card device 104 is provided with at least two testing needles towards the one side of test wafer 103.
Fig. 2 shows the schematic diagram of testing needle card device of the present invention.Described testing needle card device 104 is provided with four testing needles 201,202,203,204 towards the one side of test wafer 103 in the present embodiment, therefore can to four crystal grain on test wafer 103, test simultaneously; And on described test card device 104, be also provided with two anchor windows 205,206, described anchor window 205,206 is arranged at intervals at described testing needle card device 104 middle parts, and run through and be arranged at described testing needle card device 104, the anchor point of finding on test wafers 103 to see through described anchor window 205,206; Describedly auxiliary pin unit is arranged to the region 207 between described two anchor windows 205 and 206, and runs through and be arranged at described testing needle card 104 devices, wherein, described testing needle 201,202,203,204 lays respectively at the both sides of anchor window 205,206.
Fig. 3 shows the flow chart that is applicable to the wafer alignment method of imageing sensor wafer-level test of the present invention, and described wafer alignment method comprises step as described below:
A) by vertical direction mobile light source unit 101 or bogey 102, make described light source cell 101 vertically mutually close with described bogey 102, that is, described light source cell 101 is near the lower surface of test wafer 103; Accordingly, testing needle card device 104 vertically moves down, and makes testing needle card device 104 near the upper surface of test wafer 103;
B) provide the anchor window 205,206 that is arranged at described testing needle card 104; The anchor point (not shown) of at least two is provided on described test wafer 103; At least two anchor points that described testing needle card device 104 is found on test wafer 103 via described anchor window 205,206 by being positioned at the camera of testing needle card device top, and then by least two anchor point positions in the XY coordinate system of the Electromechanical Control XY motor platforms (not shown) of imageing sensor wafer-level test device described in finding out, by adjusting described XY motor platforms to adjust the angle of test wafer 103, make at least two anchor points in the value coupling of the Y-direction of XY coordinate system, thereby make described testing needle card device 104 parallel with test wafer 103.Wherein, described XY motor platforms is carried described test wafer 103 bogey 102 for driving moves, thereby by described XY motor platforms, adjusts the position of described test wafer 103;
What C) provide is arranged at the auxiliary to pin unit of testing needle card device 104; The described auxiliary lower surface that at least two of pin unit auxiliary syringe needles is exposed to described testing needle card device 104, described assisting comprises four auxiliary syringe needles 208 to pin unit in the present embodiment, for illustrate clear for the purpose of, in Fig. 2, only mark one of them auxiliary syringe needle; Described testing needle card device 104 is near described test wafer 103, and the described auxiliary soldered ball point that the auxiliary syringe needle 208 of pin unit is contacted with to the crystal grain of corresponding test wafer 103 is further realized aiming at of testing needle card device 104 and test wafer 103.Wherein, described auxiliary to pin unit, be the cellular type material of pin type material or printing opacity, and run through and be arranged at described testing needle card device 104.Described assisting is N * intercrystalline distance to the distance of pin unit and adjacent described testing needle, and wherein, N is more than or equal to 1 natural number.
At described step C) in, the described auxiliary soldered ball point that the auxiliary syringe needle 208 of pin unit is contacted with to corresponding crystal grain, trap setting, is camera in the present embodiment, corresponding positional information is transmitted in to a terminal, and whether described terminal mates by position described in analysis confirmation; Wherein, described positional information is the picture position data of the auxiliary syringe needle 208 in the image obtaining by camera, position that can be by the auxiliary syringe needle 208 of existing software judgement and direction whether with the position data of soldered ball point on the crystal grain of test wafer 103 between difference determine whether described auxiliary syringe needle 208 mates with the position of described soldered ball point.
If coupling, finishes wafer alignment; If do not mate, by described bogey 102, control described test wafer 103 and finely tune a distance in horizontal direction, by described auxiliary syringe needle 208, analyze to offer described control terminal with the further corresponding positional information of transmission that contacts of described soldered ball point, replicate analysis with fine setting until mate, the further like this accuracy of aiming at that improved.
Described imageing sensor wafer-level test moves in the following manner: first by the anchor point on detent mechanism scanning wafer, find the elements of a fix of the crystal grain of whole wafer, during test according to the distribution map coordinate of crystal grain according to certain regular testing, during test, first light source cell is approached to wafer with supporting wafer and light source is provided, test jack is pressed down, soldered ball point on testing needle contact wafer in test jack, then carry out electrical property and image measurement, test result forms a test pattern, and test pattern is offered and chooses brilliant board and carry out testing classification.
Above-described embodiment is for illustrative principle of the present invention and effect thereof, but the present invention is not limited to above-mentioned execution mode.Those skilled in the art all can, under spirit of the present invention and category, in claim protection range, modify to above-described embodiment.Therefore protection scope of the present invention, should cover as claims of the present invention.
Claims (6)
1. a wafer alignment method that is applicable to imageing sensor wafer-level test, it is characterized in that: light source cell is provided, is positioned at the testing needle card device on described light source cell top and is carried on the test wafer on a bogey, the photosurface of described test wafer is towards bogey setting, described test wafer is placed between described light source cell and described testing needle card device in vertical direction, the one side of described testing needle card device is provided with at least two testing needles, and described wafer alignment method comprises the steps:
A) by vertically mobile light source unit or bogey make described light source cell and described bogey vertically mutually close; Correspondingly, testing needle card device vertically moves down;
B) provide the anchor window being arranged in described testing needle card device; At least two anchor points in described test wafer are provided; The trap setting of the described testing needle card device utilization side of being located thereon is found the anchor point on test wafer by described anchor window, and then adjusts the angle of wafer, makes described testing needle card device parallel with described test wafer, the position of matching test wafer;
C) provide and be arranged at the auxiliary to pin unit of testing needle card device; The described auxiliary lower surface that at least two of pin unit auxiliary syringe needles is exposed to described testing needle card device; Described testing needle card device is near described test wafer, the described auxiliary soldered ball point that the auxiliary syringe needle of pin unit is contacted with to the crystal grain of described test wafer, the position of the crystal grain of matching test pin card device and test wafer, realizes aiming at of testing needle card device and test wafer.
2. according to the wafer alignment method that is applicable to imageing sensor wafer-level test described in claim 1, it is characterized in that: described auxiliary to pin unit, be the cellular type material of pin type material or printing opacity, it runs through and is arranged at described testing needle card device.
3. according to the wafer alignment method that is applicable to imageing sensor wafer-level test described in claim 1, it is characterized in that: described assisting is N * intercrystalline distance to the distance of pin unit and adjacent described testing needle, and wherein, N is more than or equal to 1 natural number.
4. according to the wafer alignment method that is applicable to imageing sensor wafer-level test described in claim 1, it is characterized in that: described anchor window is two, it is arranged at intervals at described testing needle card device middle part, and runs through and be arranged at described testing needle card device.
5. according to the wafer alignment method that is applicable to imageing sensor wafer-level test described in claim 4, it is characterized in that: describedly auxiliary pin unit is arranged to the region between described two anchor windows, and runs through and be arranged at described testing needle card device.
6. according to the wafer alignment method that is applicable to imageing sensor wafer-level test described in claim 1, it is characterized in that: described step C), the described auxiliary soldered ball point that the auxiliary syringe needle of pin unit is contacted with to described crystal grain, corresponding positional information is transmitted in to a terminal, and whether described terminal mates by position described in analysis confirmation;
Wherein, if coupling finishes wafer alignment;
If do not mate, by described bogey, control described test wafer and finely tune a distance in horizontal direction, by described auxiliary syringe needle, further corresponding positional information is transferred to described control terminal with contacting of described soldered ball point and analyzes, replicate analysis with fine setting until mate.
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| CN201310684987.9A CN103700602B (en) | 2013-12-13 | 2013-12-13 | Wafer alignment method suitable in imageing sensor wafer-level test |
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| CN201310684987.9A CN103700602B (en) | 2013-12-13 | 2013-12-13 | Wafer alignment method suitable in imageing sensor wafer-level test |
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| CN103700602B CN103700602B (en) | 2016-06-29 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN107328784A (en) * | 2017-08-17 | 2017-11-07 | 歌尔股份有限公司 | Wrist strap screen detection means and method |
| US11056529B2 (en) | 2019-10-11 | 2021-07-06 | Omnivision Technologies, Inc. | Image-sensor chip-scale package and method for manufacture |
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| WO2010071277A1 (en) * | 2008-12-19 | 2010-06-24 | Secron Co., Ltd. | Probe station |
| CN102435787A (en) * | 2011-09-15 | 2012-05-02 | 嘉兴景焱智能装备技术有限公司 | Testing method and testing probe platform for image sensor chip |
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| CN2916645Y (en) * | 2006-02-17 | 2007-06-27 | 原相科技股份有限公司 | Support base for image sensor test |
| US20090014762A1 (en) * | 2007-07-06 | 2009-01-15 | Mie Matsuo | Back-illuminated type solid-state image pickup device and camera module using the same |
| WO2010071277A1 (en) * | 2008-12-19 | 2010-06-24 | Secron Co., Ltd. | Probe station |
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| CN103700602B (en) | 2016-06-29 |
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