CN2914335Y - Light leakage preventing type surface-tack lighting diode supporting frame - Google Patents
Light leakage preventing type surface-tack lighting diode supporting frame Download PDFInfo
- Publication number
- CN2914335Y CN2914335Y CNU2006201156569U CN200620115656U CN2914335Y CN 2914335 Y CN2914335 Y CN 2914335Y CN U2006201156569 U CNU2006201156569 U CN U2006201156569U CN 200620115656 U CN200620115656 U CN 200620115656U CN 2914335 Y CN2914335 Y CN 2914335Y
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- CN
- China
- Prior art keywords
- light
- emitting diode
- rubber base
- supporting structure
- tool according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- Fastening Of Light Sources Or Lamp Holders (AREA)
Abstract
A light-leakage preventing bracket for surface-bond light-emitting diode is provided. The bracket includes a rubber seat, two or more metal pins and a barrier layer; the rubber seat has a hollow functional region, and the metal pins are respectively arranged inside the rubber seat and extend from the functional region to outer side of the rubber seat; an isolation block is arranged among the metal pins to define the polarity of cathode and anode of the metal pins; and the barrier layer is formed at the periphery of the rubber seat. The barrier layer can prevent light transmission from the rubber seat to improve light emergent efficiency, therefore suppressing darkness and nonuniformity of light-emitting diode.
Description
Technical field
The utility model relates to a kind of light-emitting diode support structure, relates in particular to a kind of SMD (surface mount) light-emitting diode support structure, and it has leakproof (thoroughly) light effect.
Background technology
LED is widely used at coml, have the life-span long, volume is little, the superior electrical and the mechanical features of power saving etc., can be applicable on every electronics, the information products, as the backlight of mobile phone, PDA etc.
As shown in Figures 1 and 2, be existing SMD (Surface Mount Device, surface mount) light-emitting diode support structure, the side light type backlight source that it can be applicable to as mobile phone, PDA etc. includes the metal pin 50 of a rubber base 40, two different electrodes.Wherein rubber base 40 inside have the functional areas 41 of a hollow form, metal pin 50 somes are located at respectively in the functional areas 41, another partly is revealed in outside the rubber base 40 respectively and is positioned at the same side (being side light type), with as follow-up contact, be formed with an interval block 42 in the functional areas 41, to separate two metal pins 50.Wherein on the metal pin 50 luminescence chip 70 can be installed; be connected with a lead 31 on luminescence chip 70 and another metal pin 50; and in functional areas 41, cover last layer epoxy resin 13, with protection luminescence chip 70, can make luminescence chip 70 luminous if apply voltage in two metal pins 50.
Yet electronics, information products are pursued frivolous, short and small ideal state invariably now, certainly will reduce above-mentioned SMD light-emitting diode support structure size, to meet the demand of electronics, information products.Get under the narrow and small situation in dimensional requirement, the functional areas 41 of rubber base 40 are subject to luminescence chip 70 sizes and can't dwindle, and cause the wall thickness D of functional areas 41 upper and lower two sides of rubber base 40 the reduction slimming just to be satisfied above-mentioned demand.Excessively the wall thickness D of slimming is after luminescence chip 70 is luminous, light produces the situation of leaking (thoroughly) light from the functional areas 41 of rubber base 40 easily, and further influence whole light extraction efficiency, promptly luminous dark partially or inhomogeneous etc., and cause the situation of the backlight generation flaw of electronics, information products.
Summary of the invention
The purpose of this utility model, the SMD light-emitting diode support structure of the anti-light leak of a kind of tool is provided, it is formed with the screening resistance layer and penetrates rubber base in order to avoid radiance, and the whole light extraction efficiency of loss light-emitting diode, produce dark partially or uneven situation, can further meet electronics, information products and pursue frivolous, short and small ideal state, and can avoid the situation of its backlight non-uniform light etc.
For realizing above-mentioned purpose, the utility model provides the SMD light-emitting diode support structure of the anti-light leak of a kind of tool, comprising: a rubber base, and it has the functional areas of a hollow form; Metal pin more than two, it is arranged at respectively in this rubber base, and by extending out to this rubber base outside in the functional areas of this rubber base respectively, is formed with block at interval between these metal pins, to separate the polarity of these metal pins; And one hide resistance layer, and it is formed at this rubber base outer rim place.
Below in conjunction with the drawings and specific embodiments the utility model is described in detail, but not as to qualification of the present utility model.
Description of drawings
Fig. 1 is the stereogram of existing SMD light-emitting diode support structure;
Fig. 2 is the plane graph of existing SMD light-emitting diode support structure;
Fig. 3 is the side light type stereogram of the SMD light-emitting diode support structure of the anti-light leak of the utility model tool;
Fig. 4 is the side light type plane graph of the SMD light-emitting diode support structure of the anti-light leak of the utility model tool;
Fig. 5 is another stereogram of side light type of the SMD light-emitting diode support structure of the anti-light leak of the utility model tool;
Fig. 6 is the positive light type stereogram of the SMD light-emitting diode support structure of the anti-light leak of the utility model tool.
Wherein, Reference numeral
13 epoxy resin, 31 leads
The D wall thickness
40 rubber bases
41 functional areas 42 are block at interval
43 adhesive layers
50 metal pins
60 hide resistance layer
70 luminescence chips
71 first leads
80 electrostatic defending chips
81 second leads
Embodiment
See also Fig. 3 and shown in Figure 4, the utility model provides SMD (surface mount) light-emitting diode support structure of the anti-light leak of a kind of tool, includes a rubber base 40, the metal pin 50 and more than two hides resistance layer 60.
Wherein, rubber base 40 external forms are the rectangle shape, and its inside has functional areas 41 that are hollow form, and its external form is oblong, also can be square, circle or rectangle etc.Rubber base 40 is a macromolecule non-conducting material spare, as polyphthalamide (Polyphthalamide, PPA), polybutylene terephthalate (Polybutylene Terephthalte, PBT) etc., or other known thermoplastic resin.
In the accompanying drawing of the present utility model, metal pin 50 is an example with two, and it can further be provided with several metal pins 50 according to the demand of design.Metal pin 50 is metalwork such as copper, the iron etc. of same material, and a metallic reflector on the metal pin 50 surperficial electrodepositables (figure slightly) is as metals such as silver, to increase light reflectivity.Metal pin 50 is arranged at rubber base 40 inside respectively, extend out to the same side of rubber base 40 outsides respectively by 41 bottoms, functional areas of rubber base 40, and extend one section suitable length, fit on rubber base 40 two side faces so that be revealed in the outer metal pins 50 of rubber base 40 respectively, with as follow-up contact (being side light type) bently; Or as shown in Figure 6, metal pin 50 also can be extended out to left and right two sides of rubber base 40 outsides by 41 bottoms, functional areas respectively, and extends one section suitable distance and be bending (being positive light type) respectively.Yet, between the metal pin 50 in functional areas 41, be formed with an interval block 42, with the polarity (negative electrode, anode) that separates two metal pins 50.In addition, the quantity of block 42 at interval can be according to the design quantity of metal pin 50, and further increases.
Hide resistance layer 60 and can have the characteristics of non-conductive and low-transmittance, it is formed at rubber base 40 outer rim places, hide resistance layer 60 and can be the dope layer (as paint etc.) of a dark pigment layer (as dark ink etc.) or a low light transmittance, the mode of adhering to coating is formed on the upper and lower two side faces of rubber base 40 outer rims (as Fig. 3 and Fig. 4), or is formed at four sides (as Fig. 5 or Fig. 6) of rubber base 40 outer rims.
Please consult shown in Figure 4 again, can an affixed luminescence chip 70 on the wherein metal pin 50 in the functional areas 41, be connected with 2 first leads 71 on the luminescence chip 70, and be connected to respectively on the two metal pins 50, can a further affixed electrostatic defending chip 80 on another metal pin 50, be connected with at least one second lead 81 on the electrostatic defending chip 80, and be connected on another relative metal pin 50, and in functional areas 41, cover the adhesive layer 43 of one deck light transmission, as epoxy resin or other thermoplastic resin etc., cover luminescence chip 70, electrostatic defending chip 80 and first and second lead 71,81, if can make luminescence chip 70 luminous to apply voltage on the two metal pins 50, and electrostatic defending chip 80 is in order to avoid luminescence chip 70 destruction by electrostatic field.The mode that luminescence chip 70 can insulate is fixed in wherein on the metal pin 50, and electrostatic defending chip 80 can insulate or the mode of solid welding is fixed on another metal pin 50.
Via above-mentioned, the utility model particularly suitable is the rubber base 50 of rectangle shape, when the functional areas of the utility model rubber base 40 41 upper and lower two side faces, or wall thickness D when reduction of four sides, can be by the screening resistance layer 60 at rubber base 40 outer rim places, to block luminescence chip 70 radiance, avoid radiance to penetrate by the functional areas 41 of rubber base 40, and the whole light extraction efficiency of loss, produce dark partially or uneven situation, can further meet electronics, information products and pursue frivolous, short and small ideal state, and can avoid the situation of the backlight non-uniform light etc. of electronics, information products.
Certainly; the utility model also can have other various embodiments; under the situation that does not deviate from the utility model spirit and essence thereof; those of ordinary skill in the art work as can make various corresponding changes and distortion according to the utility model, but these corresponding changes and distortion all should belong to the protection range of the appended claim of the utility model.
Claims (13)
1, the surface adhesive light-emitting diode supporting structure of the anti-light leak of a kind of tool is characterized in that, comprising:
One rubber base, it has the functional areas of a hollow form;
Metal pin more than two, it is arranged at respectively in this rubber base, and by extending out to this rubber base outside in the functional areas of this rubber base respectively, is formed with block at interval between these metal pins, to separate the polarity of these metal pins; And
One hides resistance layer, and it is formed at this rubber base outer rim place.
2, the surface adhesive light-emitting diode supporting structure of the anti-light leak of tool according to claim 1 is characterized in that this rubber base is a macromolecule non-conducting material spare.
3, the surface adhesive light-emitting diode supporting structure of the anti-light leak of tool according to claim 1 is characterized in that these metal pins are the conducting metal spare of same material.
4, the surface adhesive light-emitting diode supporting structure of the anti-light leak of tool according to claim 1 is characterized in that having a metallic reflector respectively on these metal pins.
5, the surface adhesive light-emitting diode supporting structure of the anti-light leak of tool according to claim 1 is characterized in that, these metal pins are by extending out to the outside the same side of this rubber base in the functional areas of this rubber base respectively.
6, the surface adhesive light-emitting diode supporting structure of the anti-light leak of tool according to claim 1 is characterized in that, these metal pins are by extending out to outside two sides of this rubber base in the functional areas of this rubber base respectively.
7, the surface adhesive light-emitting diode supporting structure of the anti-light leak of tool according to claim 1, it is characterized in that, wherein this metal pin is connected with luminescence chip, is connected with lead on this luminescence chip and these metal pins, and is coated with the adhesive layer of light transmission.
8, the surface adhesive light-emitting diode supporting structure of the anti-light leak of tool according to claim 7 is characterized in that this luminescence chip is fixed on this metal pin with insulation mode.
9, the surface adhesive light-emitting diode supporting structure of the anti-light leak of tool according to claim 1, it is characterized in that, these metal pins are connected with luminescence chip and electrostatic defending chip respectively, this luminescence chip, this electrostatic defending chip and these metal pins are connected with lead, and are coated with the adhesive layer of light transmission.
10, the surface adhesive light-emitting diode supporting structure of the anti-light leak of tool according to claim 9, it is characterized in that, this luminescence chip is fixed in wherein on this metal pin with insulation mode, and this electrostatic defending chip is fixed on another this metal pin in the mode of insulation or solid welding.
11, the surface adhesive light-emitting diode supporting structure of the anti-light leak of tool according to claim 1 is characterized in that, this screening resistance layer is the dope layer of a dark pigment layer or a low light transmittance.
12, the surface adhesive light-emitting diode supporting structure of the anti-light leak of tool according to claim 1 is characterized in that this screening resistance layer is formed on the two side faces of this rubber base outer rim.
13, the surface adhesive light-emitting diode supporting structure of the anti-light leak of tool according to claim 1 is characterized in that this screening resistance layer is formed on four sides of this rubber base outer rim.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2006201156569U CN2914335Y (en) | 2006-05-25 | 2006-05-25 | Light leakage preventing type surface-tack lighting diode supporting frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2006201156569U CN2914335Y (en) | 2006-05-25 | 2006-05-25 | Light leakage preventing type surface-tack lighting diode supporting frame |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2914335Y true CN2914335Y (en) | 2007-06-20 |
Family
ID=38168931
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2006201156569U Expired - Fee Related CN2914335Y (en) | 2006-05-25 | 2006-05-25 | Light leakage preventing type surface-tack lighting diode supporting frame |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2914335Y (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107101176A (en) * | 2017-04-19 | 2017-08-29 | 厦门天马微电子有限公司 | Liquid crystal display device, sidelight type backlight module and its light source |
-
2006
- 2006-05-25 CN CNU2006201156569U patent/CN2914335Y/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107101176A (en) * | 2017-04-19 | 2017-08-29 | 厦门天马微电子有限公司 | Liquid crystal display device, sidelight type backlight module and its light source |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C19 | Lapse of patent right due to non-payment of the annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |