CN2901577Y - Chip super conductive heat radiator - Google Patents
Chip super conductive heat radiator Download PDFInfo
- Publication number
- CN2901577Y CN2901577Y CN 200620013228 CN200620013228U CN2901577Y CN 2901577 Y CN2901577 Y CN 2901577Y CN 200620013228 CN200620013228 CN 200620013228 CN 200620013228 U CN200620013228 U CN 200620013228U CN 2901577 Y CN2901577 Y CN 2901577Y
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- radiator body
- radiator
- heat
- center
- utility
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Abstract
A chip superconducting heating radiator mainly solves the problem that the heat conductivity rate and heat emission transferring rate of similar heating radiators are not sufficient resulting in the increase of cubic measure of the radiator and the heating area. The technical project of this utility model is that, grooves paralleling to the axe are evenly provided on the inner wall of the center chamber of the radiator body, copings used for sealing the center chamber of the radiator body are provided on the two end-faces of the heating radiator, a circular liquid sucking core for sucking heat transfer medium helping the condensation of the transfer medium is provided in the center position between the two covers, and the heat transfer medium is provided in the center chamber of the radiator body. This utility model has the advantages of low cost, light weight, small radiator size, high dissipating capacity, and long service life, which is particularly applicable to be used in a environment with narrow space and high dissipating capacity. The heat transfer medium of this utility model can start working in 38 DEG C with a service life of more than 60,000 hours.
Description
Affiliated technical field
The utility model relates to a kind of use heat-conduction medium, structure, material and the manufacturing process of the superconducting radiator by radiator body heat radiation.
Background technology
Along with the rate request that the main chip of electric equipment products such as computer, sound equipment is moved is more and more faster, power is increasing, and volume is more and more littler, and integrated degree improves constantly, and the following heat that produces is also increasing.How the heat continually that semiconductor chip is produced is led fast and is scattered, make chip can be in good time temperature operate as normal, become that its performance of restriction embodies and the major reason of development.The similar radiator that prior art is used is can't satisfy the needs of use, and is not enough as the heat dissipation capacity of radiator, satisfy the volume that heat dissipation capacity need increase radiator, and the restriction that the volume of radiator is used.
Summary of the invention
For overcoming in the prior art, the heat conduction and heat radiation device of use, the excessive technical problem of volume of the not enough and radiator of the heat dissipation capacity of radiator, the utility model designs a kind of global formation chip superconducting radiator, reduce the radiator volume, improve radiating efficiency, to overcome deficiency of the prior art.
The technical scheme that its technical problem that solves the utility model adopts is: a kind of chip superconducting radiator, comprise: the radiator body, the heat-conduction medium that is provided with in radiating fin that equal portion is provided with on the radiator body and the radiator body, on the cavity inner wall of the heat-conduction medium that radiator body center is provided with, all portion's cloth is provided with the groove parallel with the radiator body axis, on the radiator body both ends of the surface, be provided with the capping that is used for shutoff radiator body center cavity, radiator body center cavity is a vacuum state, two cappings and between the center, be filled with heat-conduction medium, and be provided with and be used for the circular imbibition rod that the heat of adsorption transmitting medium is convenient to the heat-conduction medium condensing reflux.
The radiating fin that equal portion is provided with on radiator body and the radiator body is once to be pushed or the die casting global formation by the aluminum or aluminum alloy material.
The beneficial effects of the utility model are: low cost of manufacture, in light weight, the radiator volume is little, the heat dissipation capacity height, long service life, the utility model embodiment the experiment proved that, on the computer master chip, use radiator of the present utility model, more similar than using, with the prior art radiator of volume, the master chip temperature can reduce below 10 degree, master chip computing operating efficiency can improve 40%.It is narrow and small that the utility model is specially adapted to the space, and the environment of high heat dissipation capacity uses.Heat-conduction medium in the utility model radiator just can drive in the time of 38 degrees centigrade, reaches useful life more than 60,000 hours.
Description of drawings
Accompanying drawing 1 is the utility model structural representation.
Accompanying drawing 2 is the utility model radiator body embodiment 1 architecture schematic diagram.
Accompanying drawing 3 is the utility model radiator body embodiment 2 architecture schematic diagrames.
Accompanying drawing 4 is the utility model radiator body cross section embodiment 1 architecture schematic diagram.
Accompanying drawing 5 is the utility model radiator body cross section embodiment 2 architecture schematic diagrames.
Accompanying drawing 6 is the utility model radiator body cross section embodiment 3 architecture schematic diagrames.
Accompanying drawing 7 is the utility model radiator body cross section embodiment 4 architecture schematic diagrames.
In the accompanying drawing, 1, the radiator body, 2, radiating fin, 3, groove, 4, capping, 5, circular wick, 6, for the seam that capping is installed, 7, fan, 8, heat-conduction medium.
Embodiment
Referring to accompanying drawing 1, Integratively formed superconducting radiator, comprise: the heat-conduction medium 8 that is provided with in radiating fin 2 that equal portion is provided with on radiator body 1, the radiator body 1 and the radiator body 1, when the Integratively formed superconducting radiator of the utility model uses, radiator body 1 contacts with thermal source, thermal source becomes steam state with heat-conduction medium 8 heating evaporations that are provided with in the radiator body 1, and heat conduction is to the low-temperature end of thermal source rapidly, and heat in the radiator body 1 is in time distributed heat transfer process to 2.The heat-conduction medium 8 of steam state passes through low position 3,5 condensing refluxes of radiator body 1 temperature to thermal source and periodic duty.
The radiating fin 2 that equal portion is provided with on radiator body 1 and the radiator body 1 is once to be pushed or the die casting global formation by the aluminum or aluminum alloy material, the utility model adopts said structure and material and manufacturing process, has improved the accuracy of manufacture of radiator and the radiating effect of radiator body 1.Reduce production costs.
On the cavity inner wall of the heat-conduction medium 8 that radiator body 1 center is provided with, equal portion cloth is provided with the groove 3 with radiator body 1 parallel axes, groove 3 has increased heat-conduction medium 8 in radiator body 1 after the thermal evaporation, the condensation by contact area of steam state heat-conduction medium 8 and radiator body 1 inwall, help steam state heat-conduction medium 8 and give radiator body 1, heat is in time distributed by radiator body 1 in the condensation of radiator body 1 inwall and with the heat conduction of steam state heat-conduction medium 8.
On radiator body 1 both ends of the surface, be provided with the capping 4 and the capping 9 that are used for the shutoff center cavity, center between two cappings 4 and 9, be provided with and be used for the circular wick 5 that heat of adsorption transmitting medium 8 is convenient to heat conduction Jie condensation, capping 4 and 9 structures make radiator body 1 center cavity be the sealed vacuum state, circular wick 5, be that steam state heat-conduction medium 8 parts are given circular wick 5 in the 1 center cavity heat conduction of radiator body, condensation, after circular wick 5 heat absorptions, heat is evenly conducted fast to radiator body 1, improve the heat-conducting effect of radiator.
The utility model embodiment according to actual needs, equal radiating fin 2 of being provided with of portion on the radiator body 1 is fan-shaped setting or rectangular or four limits be arranged in parallel with the center of radiator body 1 around the radiating fin 2 of radiator body 1.
The utility model is radiating effect that guarantees radiator and the processing and manufacturing of being convenient to radiator body 1, the groove 3 of radiator body 1 parallel axes adopts trapezoidal, (referring to accompanying drawing 4 with referring to accompanying drawing 7) rectangle (referring to accompanying drawing 5) or triangle regular geometries such as (referring to accompanying drawings 6) in the shape of radiator body 1 axis cross section.
The utility model is for ease of the processing and manufacturing of radiator body 1, radiator body 1 center cavity, the easier radiator body 1 center cavity two ends of on technology, realizing of sealed vacuum, be provided with for the seam 6 that capping 4 and 9 are installed, capping 4 and 9 is through seam 6 and radiator body 1 sealing interference fit or seal welding, constitute radiator body 1 central seal cavity, fill heat-conduction medium 8 fast by capping 4 mesopores, and be squeezed in the radiator body 1 central seal cavity by capping 4 mesopores in following circular wick 5 of vacuum state, circular wick 5 contacts to capping 9 inwalls.
The utility model is for improving the radiating effect of radiator, and radiator body one end face is provided with fan 7, by the forced ventilation of fan 7, further improves the radiating effect of radiator.
The heat-conduction medium 8 that the utility model uses be with in the materials such as acetone, methyl alcohol, ethanol, ammoniacal liquor, sodium, cold enzyme agent R407C R410A one or more in proportion after, mixing potassium bichromate or sodium dichromate, at materials such as mixed aluminium oxides, zirconia, cobalt oxide, boron oxides.In heat-conduction medium 8, materials such as aluminium oxide, zirconia, cobalt oxide, boron oxide can be accelerated liquid, vapour and reflux, and stop bad air and produce, and prolong workpiece useful life.
Claims (6)
1. chip superconducting radiator comprises: the heat-conduction medium that all is provided with in the radiating fin that is provided with of portion and the radiator body on radiator body, the radiator body is characterized in that:
On the cavity inner wall of the heat-conduction medium (2) that A. described radiator body (1) center is provided with, equal portion cloth is provided with the groove (3) with radiator body (1) parallel axes;
B. on described radiator body (1) both ends of the surface, be provided with the capping (4) and (9) that are used for shutoff radiator body (1) center cavity, radiator body (1) center cavity is a vacuum state, center between two cappings (4) and (9), be filled with heat-conduction medium (8), and be provided with and be used for the circular imbibition rod (5) that heat of adsorption transmitting medium (8) is convenient to the heat-conduction medium condensing reflux.
2. a kind of chip superconducting radiator according to claim 1 is characterized in that: the radiating fin (2) that described radiator body (1) and radiator body (1) are gone up the setting of equal portion is once to be pushed or the die casting global formation by the aluminum or aluminum alloy material.
3. a kind of chip superconducting radiator according to claim 1, it is characterized in that: described radiator body (1) is gone up the radiating fin (2) that equal portion is provided with, center with radiator body (1) is fan-shaped setting, or rectangular or four limits be arranged in parallel with the center of radiator body (1).
4. a kind of chip superconducting radiator according to claim 1 and 2 is characterized in that: the groove (3) of described radiator body (1) parallel axes,, rectangle capable, trapezoidal at the positive ladder of being shaped as of radiator body (1) axis cross section or triangle.
5. a kind of chip superconducting radiator according to claim 1 and 2, it is characterized in that: described radiator body (1) center cavity two ends, be provided with for the seam (6) that capping (4) and (9) is installed, capping (4) and (9) constitute radiator body (1) center and are the sealed vacuum chamber through seam (6) and radiator body (1) sealing interference fit or seal welding.
6 a kind of chip superconducting radiators according to claim 1 and 2 is characterized in that: described radiator body (1) one end face is provided with fan (7).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200620013228 CN2901577Y (en) | 2006-03-23 | 2006-03-23 | Chip super conductive heat radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200620013228 CN2901577Y (en) | 2006-03-23 | 2006-03-23 | Chip super conductive heat radiator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2901577Y true CN2901577Y (en) | 2007-05-16 |
Family
ID=38085741
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200620013228 Expired - Fee Related CN2901577Y (en) | 2006-03-23 | 2006-03-23 | Chip super conductive heat radiator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2901577Y (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100413059C (en) * | 2006-03-23 | 2008-08-20 | 胡凯 | Integratively formed chip superconducting radiator |
| CN103153031A (en) * | 2013-03-15 | 2013-06-12 | 宗鸿电子科技（昆山）有限公司 | Heat radiating device for car audio |
| CN109723995A (en) * | 2017-10-31 | 2019-05-07 | 王龙 | A kind of headlight for medical use |
-
2006
- 2006-03-23 CN CN 200620013228 patent/CN2901577Y/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100413059C (en) * | 2006-03-23 | 2008-08-20 | 胡凯 | Integratively formed chip superconducting radiator |
| CN103153031A (en) * | 2013-03-15 | 2013-06-12 | 宗鸿电子科技（昆山）有限公司 | Heat radiating device for car audio |
| CN109723995A (en) * | 2017-10-31 | 2019-05-07 | 王龙 | A kind of headlight for medical use |
| CN109723995B (en) * | 2017-10-31 | 2020-11-06 | 张丙坤 | Medical head lamp |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C19 | Lapse of patent right due to non-payment of the annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |