CN2893862Y - Internal storage module improvement - Google Patents
Internal storage module improvement Download PDFInfo
- Publication number
- CN2893862Y CN2893862Y CN 200620002134 CN200620002134U CN2893862Y CN 2893862 Y CN2893862 Y CN 2893862Y CN 200620002134 CN200620002134 CN 200620002134 CN 200620002134 U CN200620002134 U CN 200620002134U CN 2893862 Y CN2893862 Y CN 2893862Y
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- Prior art keywords
- internal memory
- bga
- power spring
- memory
- frame
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- 230000006872 improvement Effects 0.000 title abstract description 4
- 230000015654 memory Effects 0.000 claims abstract description 106
- 229920001971 elastomer Polymers 0.000 claims abstract description 28
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 23
- 229920002379 silicone rubber Polymers 0.000 claims abstract description 12
- 239000000758 substrate Substances 0.000 claims description 19
- 239000004945 silicone rubber Substances 0.000 claims description 11
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- 230000000750 progressive effect Effects 0.000 description 1
Images
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- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
The utility model relates to the improvement of a EMS memory module which comprises a base plate which is provided with a plurality of printed circuits and one or a plurality of IC placement frames provided with a conductive spring rubber which is electrically connected to the corresponding printed circuit to accommodate the BGA (Ball grid array) IC memory in a removable way. The conductive spring rubber which is arranged in the IC placement frame is provided with a insulated soft silicon rubber layer which is provided with a plurality of conductive springs consisting of conductive spring groups arranged by means of vertical and horizontal matrix and is electrically connected to the corresponding printed circuit via the conductive spring, thereby realizing an electric connection between the IC memory arranged in the IC placement frame and the printed circuit without the need of tin paste and flux for assembling and replacement of IC memory. The utility model is characterized in that assembly is simple, maintenance is easy and environmental protection is perfect.
Description
Technical field
The utility model relates to a kind of improvement of memory modules, and particularly a kind of IC internal memory that uses power spring rubber and can be provided with ball grid array packages is with the memory modules of removably assembling.
Background technology
Common memory module structure, memory modules 10 as shown in Figure 1 is made of on the single or double of printed circuit board (PCB) (PCB) 11 70 solid weldings of several IC (integrated circuit) internal memory usually.
The memory modules 10 that is provided with IC internal memory 70 with single face is an example, the plate face of its printed circuit board (PCB) 11 is provided with plural groups P.e.c. 12, and each group P.e.c. 12 is provided with plural circuit and is connected point 13, can supply IC internal memory 70 solid weldings on printed circuit board (PCB) 11, and constitute electric connection with pairing P.e.c. 12.Therefore, with several IC internal memories 70 integrate be arranged on the printed circuit board (PCB) 11 after, promptly constitute a kind of memory modules 10.
Wherein, IC internal memory 70 is primary clusterings of memory modules 10, and the packaged type of IC internal memory 70, by miniaturization encapsulation (TSOP, Thin Small Outline Package) progressive to the ball grid array packages that forms main flow gradually (BGA, Ball Grid Array).
Be succinct character narrate, the BGA internal memory in the following literary composition promptly refers to be provided with the IC internal memory that tin ball (pads) or circuit are connected point with ball grid array packages (BGA) and bottom surface.
As shown in Figure 1, when memory modules 10 uses BGA internal memory 70, must utilize surface mount technology (SMT), the circuit of the tin ball (pads) that BGA internal memory 70 bottom surfaces are set and each of printed circuit board (PCB) 11 group P.e.c. 12 is connected a little that 13 solid weldings are integral, and is fixed on the printed circuit board (PCB) 11.
But, use the tin ball that the shortcoming of BGA internal memory 70 solid weldings on printed circuit board (PCB) 11 is, can cause BGA internal memory 70 not easy-maintaining and difficult the replacing.Keep in repair when taking off BGA internal memory 70,, in the process of maintain and replace BGA internal memory 70, also need to plant again tin ball and location, plant tin ball and location again and have certain difficulty except carrying out the high temperature tip-off with original tin ball destruction.
Especially, in the maintenance process that carries out high temperature rejecting tin ball, the BGA internal memory 70 that does not originally have to damage causes damage through regular meeting because being subjected to high temperature.And, the tin ball that in maintenance process, is weeded out, and, in the process of planting the tin ball again,, all can cause environmental pollution for the use of tin cream and scaling powder, do not conform with environmental protection requirement.
The utility model content
For the defective of changing the BGA internal memory with inconvenience is keeped in repair in the inconvenience that overcomes existing memory modules existence, fundamental purpose of the present utility model is to disclose a kind of memory modules of improvement, can make the BGA internal memory be assembled into described memory modules with removably, and need not use tin cream and scaling powder, have that assembling is simple, convenient for maintaining or change the characteristics of BGA internal memory, have more the effect of environmental protection.
For addressing the above problem, the utility model discloses a kind of memory modules, comprise substrate, its plate face is provided with the plural groups P.e.c., it is characterized in that,
The single or double of described substrate is provided with one or more IC and inserts frame, and the laid inside that each IC inserts frame has power spring rubber and pairing P.e.c. to constitute electric connection, this is laid on the power spring rubber that IC inserts frame inside, has an insulation soft silicone rubber layer, and this insulation soft silicone rubber layer is provided with the power spring array that is made of with arranged in length and breadth power spring group, and constitutes electric connection by set power spring and pairing P.e.c..
Set IC inserts frame and also is provided with a BGA internal memory or a flat IC internal memory on the described substrate, and this BGA internal memory or flat IC internal memory are connected point by set tin ball in bottom surface or circuit and constitute electric connection with the corresponding complex conduction spring that described IC inserts the set power spring rubber of frame.
Set IC inserts frame and also is provided with a movable loam cake on the described substrate, opens or closes the inside that described IC inserts frame by this activity loam cake.
Memory modules of the present utility model, the plate face that comprises a substrate, this substrate is provided with the identical plural groups P.e.c. of function, and be provided with one or more IC and insert frame, wherein, the inside that each IC inserts frame constitutes by wherein one group of P.e.c. of laying a power spring rubber and described substrate and electrically connects, and can be embedded into the inside taking-up that IC inserts the inside of frame or inserts frame from IC with removably for the BGA internal memory that the bottom surface is provided with the tin ball.And be laid on the power spring rubber that each IC inserts frame inside, it is the object of a kind of tool elasticity and conductive characteristic, has an insulation soft silicone rubber layer, this insulation soft silicone rubber layer is provided with the power spring array that is made of with arranged in length and breadth power spring group, described power spring rubber is connected point by set power spring array with the plural circuit of wherein one group of P.e.c. of described substrate can reach effective the contact, and constitutes reliable and stable electric connection.
So, after IC that the BGA internal memory is embedded into the utility model memory modules inserts frame inside, need not use tin cream and scaling powder, just can make the BGA internal memory be connected point and be laid on described IC and insert the set power spring array of the power spring rubber of frame inside and constitute electrical the contact immediately by set tin ball in bottom surface or circuit, relend the electrical conduction of the power spring array of assistant director of a film or play's electrical spring rubber, further the P.e.c. with the utility model memory modules constitutes electric connection.
This assembling mode, can reach and make the BGA internal memory be assembled into the utility model memory modules with removably, in the time of need repairing or replacing the BGA internal memory, do not need to carry out the high temperature tip-off, as long as take off bad BGA internal memory, just can change the BGA internal memory again, perhaps, in the time of need escalating into the BGA internal memory of larger capacity, the user can do it yourself to change the BGA internal memory of larger capacity easily.Therefore, the utility model memory modules has following advantage:
1. maintenance or replacing BGA internal memory are very convenient.
2. save the cost and the puzzlement of planting the tin ball again.
At any time maintain and replace BGA internal memory and do not have the location on problem
4. can avoid the BGA internal memory to be subjected to high temperature destroys.
5. the user can do it yourself to change or the BGA internal memory of the larger capacity of upgrading easily.
6. tin cream capable of reducing using and scaling powder have environment protecting.
Description of drawings
Fig. 1 is the structural representation of common memory modules.
Fig. 2 is the structural representation of the utility model memory modules.
Fig. 3 is the partial structurtes enlarged drawing of power spring rubber shown in Figure 2.
Fig. 4 is the cross-section structure part enlarged drawing of Fig. 2 along the 4--4 profile line.
Fig. 5 is that the utility model memory modules also can be for the structural representation of flat IC internal memory with the removably assembling.
Reference numeral
10 common memory modules 11 printed circuit board (PCB)s
12 P.e.c., 13 circuit are connected point
20 memory modules, 21 substrates
22 P.e.c., 23 circuit are connected point
41 insulation soft silicone rubber layers, 45 power spring arrays
50 movable loam cake 70BGA internal memories
75 tin balls, 80 flat IC internal memories
85 electrically are connected point
Embodiment
As shown in Figure 2, the utility model memory modules 20, be a kind of for the memory modules of BGA internal memory 70 with the removably assembling, its structure comprises a substrate 21, and on the single or double of this substrate 21, be provided with one or more IC and insert frame 30, the inside that each IC inserts frame 30 all is equipped with a power spring rubber 40 and uses as connector, tin cream and scaling powder need be do not used, just BGA internal memory 70 inside that each IC inserts frame 30 can be assembled into so that removably is simple and easy, take off embedded BGA internal memory 70 with the internal freedom of inserting frame 30 from IC.
The single or double of described substrate 21 is provided with the identical P.e.c. of plural groups function 22, each group P.e.c. 22 is provided with plural circuit and is connected point 23, and described plural circuit is connected point 23 is set as IC in described substrate 21 assemblings and then drops on the inside that this IC inserts frame 30 after inserting frame 30, can go into outside the power spring rubber 40 for laying with the inside of facilitating IC to insert frame 30, and make layings into power spring rubber 40 can be connected point 23 and corresponding P.e.c. 22 formation electric connections via plural circuit, and play the effect of connector.
As shown in Figures 2 and 3, the power spring rubber 40 in the utility model memory modules has an insulation soft silicone rubber layer 41, and this insulation soft silicone rubber layer 41 is provided with the power spring array 45 that is made of with arranged in length and breadth power spring group.When insulation soft silicone rubber layer 41 was subjected to the external force compacting, the power spring array 45 of described power spring rubber 40 had buffer action, can wait by the time after the external force disappearance, just return to the position that originally is not subjected to external force immediately.And; described power spring rubber 40 is by the power spring of power spring array 45 and have conductive characteristic; and every power spring of power spring array 45 all be subjected to the insulating coating and the protection of soft silicone rubber layer 41; can not be subjected to external force and take place crooked or bending, therefore long-term repeated use still can keep original function.
Therefore, this power spring rubber 40 is a kind of elastomer connectors with elasticity and conductive characteristic, be blocked or isolated obstructed circuit is reached the purpose that makes circuit connect and make current flowing by using the power spring of set power spring array 45, can making.
Therefore, as Fig. 2 and shown in Figure 4, the IC that is embedded into the utility model memory modules 20 when BGA internal memory 70 inserts frame 30 when inner, BGA internal memory 70 can constitute electric connection with the corresponding complex conduction spring of the power spring array 45 of power spring rubber 40 by bottom surface set tin ball 75 or circuit linking point, the plural circuit that relends the complex conduction spring that helps the power spring rubber 40 that is touched and pairing P.e.c. 22 is connected point 23 and is bridge, makes embedded BGA internal memory 70 and corresponding P.e.c. 22 constitute reliable and stable electric connection.
As Fig. 2 and shown in Figure 4, described IC inserts frame 30 and also is provided with a movable loam cake 50, and the folding by this activity loam cake 50, can reach the inside that makes IC insert frame 30 and be and open or closed state.
When the inside that IC inserts frame 30 is opened, BGA internal memory 70 can be assembled into IC with removably and inserts the inside of frame 30 and take off embedded BGA internal memory 70 from the internal freedom that IC inserts frame 30.
When movable loam cake 50 covers IC when inserting above the frame 30, can be by the fixing BGA internal memory 70 of movable loam cake 50, make BGA internal memory 70 can not spin off from the inside that IC inserts frame 30.
Therefore, the utility model memory modules 20 needn't use surface mount technology (SMT) when assembling BGA internal memory 70, also do not need to use tin cream and scaling powder, except effect with environmental protection, at any time maintain and replace BGA internal memory 70 and do not have the location on problem.
When the utility model memory modules 20 has bad BGA internal memory 70 to need repairing or changes, as long as insert frame 30 bad BGA internal memory 70 is taken off from embedded IC, just can replace with new BGA internal memory 70 at once again, so, maintenance or replacing BGA internal memory 70 are not only quite convenient, more do not need to carry out the high temperature tip-off, can avoid BGA internal memory 70 to be subjected to high temperature and destroy.
When the utility model memory modules 20 needs upgrading and uses the BGA internal memory 70 of larger capacity, substrate 21 in the utility model memory modules has can reusable characteristics, take off as long as will be embedded into the BGA internal memory 70 that the IC of substrate 21 inserts frame 30, the BGA internal memory 70 that replaces with larger capacity more just can be reached purpose of upgrading.Especially, the user can do it yourself to change easily, fully without any obstruction.
The utility model memory modules 20 also has other application, comprise: the utility model memory modules 20 can use the conductive rubber of other different structure to lay the inside of inserting frame 30 into each IC, for example, each IC inserts frame 30 and can lay into a conductive rubber with the fine glodclad wire array of spacing and use as connector.Perhaps, as shown in Figure 5, the utility model memory modules 20 also can be for being not with ball grid array packages but the bottom surface is provided with the flat IC internal memory 80 of electrical linking point 85 inserts frame 30 inside with the IC that removably is assembled into this memory modules 20, or take off embedded flat IC internal memory 80 from the internal freedom that IC inserts frame 30.
Foregoing, it is the preferred specific embodiment of the utility model memory modules, exploitation purpose every and of the present utility model and the effect that can reach, be regarded as constituting so-called equivalence or equalization, and belonging to the operator who knows this field can unlabored simple and easy modification, modification, improvement or variation, should not break away from the claim scope that the utility model is contained opinion.
Claims (3)
1, a kind of memory modules comprises substrate, and its plate face is provided with the plural groups P.e.c., it is characterized in that,
The single or double of described substrate is provided with one or more IC and inserts frame, and the laid inside that each IC inserts frame has power spring rubber and pairing P.e.c. to constitute electric connection, this is laid on the power spring rubber that IC inserts frame inside, has an insulation soft silicone rubber layer, this insulation soft silicone rubber layer is provided with the power spring array that is made of with arranged in length and breadth power spring group, constitutes by set power spring and pairing P.e.c. to electrically connect.
2, memory modules as claimed in claim 1 is characterized in that,
Set IC inserts frame and also is provided with a BGA internal memory or a flat IC internal memory on the described substrate, and this BGA internal memory or flat IC internal memory constitute electric connection by bottom surface set tin ball or circuit linking point with the corresponding complex conduction spring that described IC inserts the set power spring rubber of frame.
3, as each described memory modules in claim 1 or 2, it is characterized in that,
Set IC inserts frame and also is provided with a movable loam cake on the described substrate, opens or closes the inside that described IC inserts frame by this activity loam cake.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200620002134 CN2893862Y (en) | 2006-01-26 | 2006-01-26 | Internal storage module improvement |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200620002134 CN2893862Y (en) | 2006-01-26 | 2006-01-26 | Internal storage module improvement |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2893862Y true CN2893862Y (en) | 2007-04-25 |
Family
ID=38062017
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200620002134 Expired - Fee Related CN2893862Y (en) | 2006-01-26 | 2006-01-26 | Internal storage module improvement |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2893862Y (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2011022954A1 (en) * | 2009-08-26 | 2011-03-03 | Liao Yingwen | Memory fastening device, computer main board and computer |
-
2006
- 2006-01-26 CN CN 200620002134 patent/CN2893862Y/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2011022954A1 (en) * | 2009-08-26 | 2011-03-03 | Liao Yingwen | Memory fastening device, computer main board and computer |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20070425 |