CN2930195Y - Flexible and rigid interconnected plate - Google Patents
Flexible and rigid interconnected plate Download PDFInfo
- Publication number
- CN2930195Y CN2930195Y CN 200620122469 CN200620122469U CN2930195Y CN 2930195 Y CN2930195 Y CN 2930195Y CN 200620122469 CN200620122469 CN 200620122469 CN 200620122469 U CN200620122469 U CN 200620122469U CN 2930195 Y CN2930195 Y CN 2930195Y
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- interconnection
- plate
- flexible board
- rigid plate
- function pads
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Abstract
The utility model discloses a flexible and rigid interconnection plate which realizes the interconnection of the functional welding discs of the flexible plate and the rigid plate through the ACF (anisotropy of conductivity film). A non-functional welding disc is arranged at the outer side of the functional welding disc and is not connected with any electrical signal wire. The contraposition marks on the flexible plate and the rigid plate adopts the intersected perpendicular lines and horizontal lines. The perpendicular lines are parallel with the functional welding disc and the non-functional welding discs are parallel with each other with almost identical size and intervals. The flexible and rigid interconnection plate achieves the small interconnection resistance, stable interconnection resistance and reliable interconnection, and is particularly applicable for the interconnected flexible plate and rigid plate adopting the ACF technique or the interconnection of other circuits.
Description
Technical field
The utility model relates to a kind of interconnection technique of circuit board, relates in particular to a kind of employing anisotropic conductive film and realizes flexible board and rigid plate Interworking Technology.
Background technology
ACF (anisotropic conductive film) material is a kind of film that adopts minute metallic conducting particles and epoxide-resin glue evenly to be mixed and made into, as depicted in figs. 1 and 2, when being placed on, ACF film 4 is arranged at various boards 1 respectively, between two electrodes 3 on 2 and when applying the temperature and pressure of a period of time, conducting particles 5 is embedded between the upper/lower electrode 3, between two electrodes 3, form electric path, realize electric interconnection, meanwhile, epoxy resin at high temperature solidifies, bonding with upper/lower electrode 3, and with upper and lower circuit plate 1,2 is bonding, thereby realize mechanically interconnected.
The ACF material can be applicable to FOB (interconnection of flexible board and rigid plate), and it is little to have a design space of taking, and technology is simple, can realize the advantage of high density interconnect, is a mobile phone and portable product direction towards the microminiaturization development.Present attainable minimum interconnect pitch can reach 150um.Adopt ACF to carry out the FOB interconnection, interlinking reliability how, and wherein one of most important index is an interconnection resistance, and interconnection resistance is more little, stable more, and signal attenuation is few more, and electrical property is good more, and reliability is good more.How special interconnection below the 0.3mm spacing because interconnection resistance is higher, therefore reduces interconnection resistance, improves the stability of interconnection resistance, is the key that improves the ACF interlinking reliability.
When adopting ACF material interconnection flexible board and rigid plate at present, as shown in Figure 3, pad (corresponding to above-mentioned electrode 3) in the design of the hot pressing district of flexible board 2 and rigid plate 1 all is with internal wiring the function pads 3 that is electrically connected to be arranged, and the contraposition sign 6 that contraposition is used is " ten " font.
This structure Design, because when adopting thermal head hot pressing flexible board and rigid plate in the actual assembled process, middle and the uneven problem of next door heat distribution existence of thermal head itself, the boundary condition of edge circuit and middle circuit there are differences, and cause the interconnection resistance of edge circuit more a lot of greatly than middle interconnection resistance.
As shown in Figure 6, the resistance of 3 of the function pads on the interconnection plate is tested the result of test such as following table 1:
Table 1:
| Interconnection resistance value (0hm) | ||||||||
| R1~2 | R3~4 | Middle circuit resistance value | Middle circuit resistance value | R’3~4 | R’1~2 | R ' 1 ~ 2 and middle circuit interconnection resistance value difference volume (%) | R ' 3 ~ 4 and middle circuit interconnection resistance value difference volume (%) | |
| The rigidity and the flexible interconnect plate of the employing ACF interconnection after the assembling | 0.4913 | 0.4162 | 0.3686 | 0.3626 | 0.4232 | 0.4723 | 34.37 | 29.18 |
| 0.4401 | 0.3766 | 0.3332 | 0.3384 | 0.3932 | 0.4730 | 40.85 | 31.05 | |
Excessive interconnection resistance is unfavorable to the transmission of the signal of telecommunication, can cause dysfunction when interconnection resistance is excessive.If initial interconnection resistance is excessive, in follow-up use, interconnection resistance has increase, to a certain degree, can cause inefficacy, so the interlinking reliability of existing design is lower.
Summary of the invention
The purpose of this utility model provides that a kind of interconnection resistance is little, interconnection resistance is stable, interconnection is flexible reliably and the rigidity interconnection plate.
The purpose of this utility model is achieved through the following technical solutions:
Flexibility of the present utility model and rigidity interconnection plate, comprise flexible board and rigid plate, corresponding function pads links together by anisotropic conductive film on described flexible board and the rigid plate, in order to realize the interconnection between each function pads on flexible board and the rigid plate, it is characterized in that the outside of function pads is provided with corresponding non-functional pad on described flexible board and the rigid plate.
Described non-functional pad has one group at least.
Be parallel to each other between described function pads and/or non-functional pad.
The length of described non-functional pad is 0.5-2 times of function pads length.
Also comprise corresponding contraposition sign on described flexible board and the rigid plate, described contraposition sign comprises vertical edge and the horizontal edge that intersects, and described vertical edge is parallel with function pads and/or non-functional pad
The length of the vertical edge of described contraposition sign is function pads and/or non-functional pad length 0.5-2 times.
The horizontal edge of described contraposition sign is located at the middle part of vertical edge.
The technical scheme that is provided by above-mentioned the utility model as can be seen, flexibility described in the utility model and rigidity interconnection plate, because the outside of the corresponding function pads of flexible board and rigid plate is provided with corresponding at least one group of non-functional pad, non-functional pad does not connect the signal of telecommunication, and function pads nand function pad is parallel and size is close.Like this, when flexible board and rigid plate are laminated by the ACF material, corresponding function pads, non-functional pad and contraposition sign just realize interconnection on flexible board and the rigid plate in the pressing district, non-functional pad and contraposition sign all are positioned at the edge in pressing district, interconnection resistance is big, but owing to be non-functional pad, the signal of telecommunication and reliability there is not influence, the interconnection resistance of intermediate function pad is less, and resistance difference is also less between circuit, can effectively reduce actual signal by the time interconnection resistance, improve the reliability of interconnection.
Because the contraposition sign is designed to " " type, comprise vertical edge and horizontal edge again, the vertical edge of contraposition sign is parallel with adjacent pad and size is close, plays the effect of contraposition on the one hand, can play the effect that reduces interconnection resistance simultaneously.
Flexibility of the present utility model and rigidity interconnection plate interconnection resistance are little, interconnection resistance stable, interconnection is reliable, are particularly useful for adopting the flexible board and the rigid plate of anisotropic conductive film technology interconnection, also are applicable to the interconnection of other circuit board.
Description of drawings
Fig. 1 is the state reference map before the interconnection of upper and lower circuit plate in the background technology;
Fig. 2 is the structural representation after the interconnection of upper and lower circuit plate in the background technology;
Fig. 3 needs the flexible board of interconnection and the structural representation of rigid plate in the prior art;
Fig. 4 needs the flexible board of interconnection and the structural representation of rigid plate in specific embodiment of the utility model;
Fig. 5 is the structural representation after the interconnection of flexible board and rigid plate in another specific embodiment of the utility model;
The state reference map of Fig. 6 for the resistance between the function pads on the interconnection plate is tested.
Embodiment
The preferable embodiment of the utility model is, comprise flexible board and rigid plate, corresponding function pads links together by ACF (anisotropic conductive film) material on described flexible board and the rigid plate, in order to realize the interconnection between each function pads on flexible board and the rigid plate, when adopting ACF material interconnection flexible board and rigid plate, the right and left of function pads on rigid plate and the flexible board designs at least one group of corresponding empty pad, preferably 2-3 organizes, this pad is communicated with the internal wiring no signal of rigid plate or flexible board, also can ground connection, be non-functional pad, size design is identical with the design of function pads or close, and the length of non-functional pad can be 0.5-2 times of function pads length.The non-functional pad spacing is identical with the function pads spacing or close.Contraposition sign is designed to " " type, comprises vertical edge and horizontal edge, the length of contraposition sign vertical edge be function pads or non-functional pad length 0.5-2 doubly, between non-functional pad and the function pads and and the vertical edge of contraposition sign between be parallel to each other.
Like this, when flexible board and rigid plate are laminated by the ACF material, corresponding function pads, non-functional pad and contraposition sign just realize interconnection on flexible board and the rigid plate in the pressing district, non-functional pad and contraposition sign all are positioned at the edge in pressing district, interconnection resistance is big, but owing to be non-functional pad, the signal of telecommunication and reliability there is not influence, the interconnection resistance of intermediate function pad is less, and resistance difference is also less between circuit, can effectively reduce actual signal by the time interconnection resistance, improve the reliability of interconnection.The effect of contraposition is played in the so design of contraposition sign on the one hand, can play the effect that reduces interconnection resistance simultaneously.
As shown in Figure 4, it is a specific embodiment of the present utility model, comprise flexible board 2 and rigid plate 1, the outside of the corresponding function pads 3 of described flexible board 2 and rigid plate 1 is respectively equipped with corresponding two groups of non-functional pad 7, non-functional pad 7 does not connect the signal of telecommunication, function pads 3 nand function pads 7 measure-alike, function pads 3 nand function pads 7 are parallel, and spacing is identical.Also comprise contraposition sign 6 on flexible board 2 and the rigid plate 1, contraposition sign 6 comprises vertical edge and the horizontal edge that intersects, the size of described vertical edge and function pads 3 and non-functional pad 7 measure-alike, and be parallel to each other, and spacing is identical.The horizontal edge of described contraposition sign 6 is located at the middle part of vertical edge.
As required, between the vertical edge nand function pad of contraposition sign 6 and the spacing between non-functional pad 7 and the function pads 3 also can be inequality.
As shown in Figure 5, it is another specific embodiment of the present utility model, the corresponding function pads 3 of flexible board 2 and rigid plate 1 realizes interconnection by anisotropic conductive film 4, when anisotropic conductive film 4 being placed on corresponding function pads 3 on flexible board 2 and the rigid plate 1, between non-functional pad 7 and the contraposition sign 6, and when applying the temperature and pressure of a period of time, conducting particles 5 is embedded into up and down between the pad, between two pads, form electric path, realize electric interconnection, meanwhile, epoxy resin at high temperature solidifies, with pad is bonding up and down, and with upper and lower circuit plate 1,2 is bonding, thereby realize mechanically interconnected.As can be seen, function pads 3 is positioned at the middle part in pressing district among the figure, and its both sides are followed successively by the vertical edge of two groups of non-functional pad 7 and contraposition sign 6 respectively.When in the actual assembled process, adopting thermal head hot pressing flexible board and rigid plate like this, function pads 3 is positioned at the thermal head middle part, heat distribution is even, make interconnection resistance between the corresponding function pad 3 little and be evenly distributed, the vertical edge of non-functional pad 7 and contraposition sign 6 is positioned at the thermal head edge, compare with the centre, temperature is lower, the interconnection resistance that causes corresponding non-functional pad 7 and contraposition to identify between 6 vertical edges is more a lot of greatly than middle interconnection resistance, but, the signal of telecommunication and reliability there is not influence owing to be non-functional pad.
Adopt the way identical, the resistance of 3 of the function pads of the utility model behind the vertical edge of 2 non-functional pad 7 of the both sides of function pads 3 design and a contraposition sign 6 tested the result of test such as following table 2 as Fig. 6:
Table 2:
| Interconnection resistance (0hm) | ||||||
| R1~2 | Middle circuit resistance value | R’1~2 | R1 ~ 2 and middle circuit interconnection resistance value difference volume (%) | |||
| The flexibility of A producer and rigidity interconnection plate | 0.3 mm spacing chemical nickel and gold plate | 0.2385 | 0.2156 | 0.2229 | 0.2353 | 7.33 |
| 0.15mm spacing chemical nickel and gold plate | 0.4162 | 0.3686 | 0.3626 | 0.4232 | 13.84 | |
| 0.3766 | 0.3332 | 0.3384 | 0.3932 | 12.15 | ||
This moment, the interconnection resistance difference of 3 of function pads can be controlled to below 20%, had improved the stability and the reliability of interconnection resistance.And compare with table 1, interconnection resistance value R1～2 and R ' 1～2 that the both sides function pads is 3 reduce greatly.
Flexible board of the present utility model and rigidity interconnection plate interconnection resistance are little, interconnection resistance stable, interconnection is reliable, are particularly useful for adopting the flexible board and the rigid plate of anisotropic conductive film technology interconnection, also are applicable to the interconnection of other circuit board.
The above; it only is the preferable embodiment of the utility model; but protection range of the present utility model is not limited thereto; anyly be familiar with those skilled in the art in the technical scope that the utility model discloses; the variation that can expect easily or replacement all should be encompassed within the protection range of the present utility model.
Claims (7)
1, a kind of flexibility and rigidity interconnection plate, comprise flexible board and rigid plate, corresponding function pads links together by anisotropic conductive film on described flexible board and the rigid plate, in order to realize the interconnection between each function pads on flexible board and the rigid plate, it is characterized in that the outside of function pads is provided with corresponding non-functional pad on described flexible board and the rigid plate.
2, flexibility according to claim 1 and rigidity interconnection plate is characterized in that, described non-functional pad has one group at least.
3, flexibility according to claim 1 and rigidity interconnection plate is characterized in that, are parallel to each other between described function pads and/or non-functional pad.
4, flexibility according to claim 1 and rigidity interconnection plate is characterized in that, the length of described non-functional pad is 0.5-2 times of function pads length.
5, flexibility according to claim 1 and rigidity interconnection plate, it is characterized in that, also comprise corresponding contraposition sign on described flexible board and the rigid plate, described contraposition sign comprises vertical edge and the horizontal edge that intersects, and described vertical edge is parallel with function pads and/or non-functional pad.
6, flexibility according to claim 5 and rigidity interconnection plate is characterized in that, the length of the vertical edge of described contraposition sign is function pads and/or non-functional pad length 0.5-2 times.
According to claim 5 or 6 described flexibilities and rigidity interconnection plate, it is characterized in that 7, the horizontal edge of described contraposition sign is located at the middle part of vertical edge.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200620122469 CN2930195Y (en) | 2006-07-28 | 2006-07-28 | Flexible and rigid interconnected plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200620122469 CN2930195Y (en) | 2006-07-28 | 2006-07-28 | Flexible and rigid interconnected plate |
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|---|---|
| CN2930195Y true CN2930195Y (en) | 2007-08-01 |
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| CN 200620122469 Expired - Lifetime CN2930195Y (en) | 2006-07-28 | 2006-07-28 | Flexible and rigid interconnected plate |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104254213A (en) * | 2013-06-27 | 2014-12-31 | 宏启胜精密电子(秦皇岛)有限公司 | Multi-layer circuit board and manufacturing method thereof |
| CN104470243A (en) * | 2014-12-24 | 2015-03-25 | 南京华睿川电子科技有限公司 | Hot-pressed PIN structure applied to touch screen |
| CN104780721A (en) * | 2015-04-13 | 2015-07-15 | 惠州Tcl移动通信有限公司 | Flexible connection method for PCBs (printed circuit boards) as well as PCB assembly |
| WO2016070493A1 (en) * | 2014-11-05 | 2016-05-12 | 深圳市华星光电技术有限公司 | Lead structure and method for preventing acf adhesive from overflowing to display area |
| CN106764382A (en) * | 2016-12-30 | 2017-05-31 | 常州世竟液态金属有限公司 | A kind of amorphous flexible board |
| CN106799538A (en) * | 2016-12-09 | 2017-06-06 | 上海交通大学 | A kind of hot pressing connects method of flexible soft arranging wire and Parylene flexible electrode |
| CN108430152A (en) * | 2018-03-01 | 2018-08-21 | 业成科技（成都）有限公司 | Touch control display apparatus and its flexible PCB |
-
2006
- 2006-07-28 CN CN 200620122469 patent/CN2930195Y/en not_active Expired - Lifetime
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104254213A (en) * | 2013-06-27 | 2014-12-31 | 宏启胜精密电子(秦皇岛)有限公司 | Multi-layer circuit board and manufacturing method thereof |
| WO2016070493A1 (en) * | 2014-11-05 | 2016-05-12 | 深圳市华星光电技术有限公司 | Lead structure and method for preventing acf adhesive from overflowing to display area |
| CN104470243A (en) * | 2014-12-24 | 2015-03-25 | 南京华睿川电子科技有限公司 | Hot-pressed PIN structure applied to touch screen |
| CN104470243B (en) * | 2014-12-24 | 2018-01-05 | 南京华睿川电子科技有限公司 | A kind of hot pressing PIN structure applied on touch-screen |
| CN104780721A (en) * | 2015-04-13 | 2015-07-15 | 惠州Tcl移动通信有限公司 | Flexible connection method for PCBs (printed circuit boards) as well as PCB assembly |
| CN106799538A (en) * | 2016-12-09 | 2017-06-06 | 上海交通大学 | A kind of hot pressing connects method of flexible soft arranging wire and Parylene flexible electrode |
| CN106799538B (en) * | 2016-12-09 | 2019-11-01 | 上海交通大学 | A kind of hot pressing connects method of flexibility soft arranging wire and Parylene flexible electrode |
| CN106764382A (en) * | 2016-12-30 | 2017-05-31 | 常州世竟液态金属有限公司 | A kind of amorphous flexible board |
| CN108430152A (en) * | 2018-03-01 | 2018-08-21 | 业成科技（成都）有限公司 | Touch control display apparatus and its flexible PCB |
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| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20070801 |
|
| EXPY | Termination of patent right or utility model |