CN2891583Y - 电路板的改良结构 - Google Patents

电路板的改良结构 Download PDF

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Publication number
CN2891583Y
CN2891583Y CNU2006200582037U CN200620058203U CN2891583Y CN 2891583 Y CN2891583 Y CN 2891583Y CN U2006200582037 U CNU2006200582037 U CN U2006200582037U CN 200620058203 U CN200620058203 U CN 200620058203U CN 2891583 Y CN2891583 Y CN 2891583Y
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circuit board
improved
terminal
barrier
scolder
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朱德祥
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Lotes Guangzhou Co Ltd
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Lotes Guangzhou Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
    • H01R12/57—Fixed connections for rigid printed circuits or like structures characterised by the terminals surface mounting terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2442—Contacts for co-operating by abutting resilient; resiliently-mounted with a single cantilevered beam
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/7005—Guiding, mounting, polarizing or locking means; Extractors
    • H01R12/7011—Locking or fixing a connector to a PCB
    • H01R12/707—Soldering or welding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
    • H05K1/113—Via provided in pad; Pad over filled via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10189—Non-printed connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10992—Using different connection materials, e.g. different solders, for the same connection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/041—Solder preforms in the shape of solder balls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/0455—PTH for surface mount device [SMD], e.g. wherein solder flows through the PTH during mounting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1377—Protective layers
    • H05K2203/1394—Covering open PTHs, e.g. by dry film resist or by metal disc
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3463—Solder compositions in relation to features of the printed circuit board or the mounting process
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Abstract

本实用新型电路板的改良结构，在该电路板上设有若干焊垫，在该焊垫上设有导电通道，且在电路板上设有阻隔物将所述通道阻塞，以防止焊料进入通道内。与现有技术相比较，本实用新型电路板的改良结构，由于在焊料内设有阻隔物，该阻隔物可先将通道阻塞，可有效的防止焊料阻塞电路板上的通孔，且在导电通道上设有焊垫，可以使端子直接焊接在电路板的导电通道内，有效缩短了端子与电路板的导通路径，有利于端子与电路板的电性连接。

Description

电路板的改良结构
【技术领域】
本实用新型涉及一种电路板的改良结构。
【背景技术】
印刷电路板(Printed Circuit Board；PCB)是指利用塑料等不导电的物质所制成的板子，在上面利用印刷的技术将电路印刷将电路印刷上，且在电路板上开设有若干与电路相连的通孔，再将集成电路、电阻等电子零件放上，这种电路板是目前计算机主板、接口卡等电子组件所采用的技术。
在连接器行业，一般都是将端子通过焊料焊接在电路板上，并且每个端子对应一个通孔，但现有技术一般不是直接将端子焊接在电路板的通孔内，而是端子焊接的接入点的位置离通孔有一定的距离，且在端子焊接的接入点与电路板的通孔之间布设有导电线路，以将端子与电路板之间电性导通，但是这种焊接方式，端子离通孔的距离比较远，并且端子不是直接与通孔接触，这样不仅影响端子与电路板的电性导通，而且实际操作也很不方便。
因此，有必要设计一种新型的电路板，以克服上述缺陷。
【实用新型内容】
本实用新型的目的在于提供一种设有阻隔物的电路板的改良结构。
为了实现上述目的，本实用新型电路板的改良结构，在该电路板上设有若干焊垫，在该焊垫上设有导电通道，且在电路板上设有阻隔物将所述通道阻塞，以防止焊料进入通道内。
与现有技术相比较，本实用新型电路板的改良结构，由于在焊料内设有阻隔物，该阻隔物可先将通道阻塞，可有效的防止焊料阻塞电路板上的通孔，且在导电通道上设有焊垫，可以使端子直接焊接在电路板的导电通道内，有效缩短了端子与电路板的导通路径，有利于端子与电路板的电性连接。
【附图说明】
图1为本实用新型电路板的改良结构的示意图；
图2为图1所示的电路板的改良结构的局部剖视图；
图3为端子插接在绝缘本体内的局部剖视图；
图4为端子单独示意图；
图5为端子插接在电路板上的局部剖视图；
图6为本实用新型第二实施例的端子插接在电路板上的局部剖视图。
【具体实施方式】
下面结合附图对本实用新型电路板的改良结构作进一步说明。
请参阅图1至图5所示，本实用新型电路板的改良结构，包括电路板10，在该电路板10设有若干导电通道11，在每一导电通道11内都设有导电物质111。在所述导电通道11的上端设有焊垫12，在所述焊垫12上设有焊料13，且在该焊料13内设有阻隔物14，该阻隔物14设于焊垫12的表面，阻隔物14可将所述导电通道11阻塞，以防止焊料13进入导电通道11内，通常该阻隔物14为防焊漆，该阻隔物14的宽度不小于所述导电通道11的宽度，且该阻隔物14至少部分位于所述导电通道11内。
导电端子20容置于绝缘本体30中，绝缘本体30开设有有若干端子收容孔31，导电端子20收容其中。所述导电端子20包括弹性臂21及连接臂22，且弹性臂21抵靠在端子收容孔31的内壁上，而连接臂22一体延伸设有焊接端23。导电端子20可插接在所述焊料13内，该导电端子20与所述导电通道11相对，且导电端子20的焊接端23插接固定在所述焊料13内，而所述阻隔物14设于所述导电端子20的焊接端23的附近。
当将导电端子20焊接在电路板10上时，首先将导电端子20的一端固定在绝缘本体30内，再将导电端子20的焊接端23插接在焊料13内，再将焊料13融化使焊接端23焊接固定在焊料13内，由于在焊料13内设有阻隔物14，可以有效的防止焊料13流进导电通道11内。
图6为本实用新型电路板的改良结构的第二实施例，在该实施例中，电路板40上的阻隔物44为锡球，且该锡球45的熔点比所述焊料43的熔点高，且锡球容置于所述导电通道41内。当将导电端子50的焊接端53焊接固定在电路板20上时，由于锡球44的熔点比所述焊料43的熔点高，且锡球50容置在导电通道41内，这样锡球44可以有效的防止焊料43在焊接固定端子50的过程中因融化而流入电路板40的导电通道41内。
本实用新型电路板的改良结构，由于在焊料内设有阻隔物，该阻隔物可先将通道阻塞，可有效的防止焊料阻塞电路板上的通孔，且在导电通道上设有焊垫，可以使端子直接焊接在电路板的导电通道内，有效缩短了端子与电路板的导通路径，有利于端子与电路板的电性连接。

Claims (10)

1.一种电路板的改良结构，其特征在于：在该电路板上设有若干焊垫，在该焊垫上设有导电通道，且在电路板上设有阻隔物将所述通道阻塞，以防止焊料进入通道内。
2.如权利要求1所述的电路板的改良结构，其特征在于：所述阻隔物设于所述焊垫的表面。
3.如权利要求1所述的电路板的改良结构，其特征在于：所述阻隔物至少部分位于所述导电通道内。
4.如权利要求1所述的电路板的改良结构，其特征在于：所述阻隔物的宽度不小于所述导电通道的宽度。
5.如权利要求1所述的电路板的改良结构，其特征在于：所述阻隔物为防焊漆。
6.如权利要求1所述的电路板的改良结构，其特征在于：所述阻隔物为锡球。
7.如权利要求6所述的电路板的改良结构，其特征在于：所述锡球容置于所述导电通道内。
8.如权利要求6所述的电路板的改良结构，其特征在于：所述锡球的熔点比所述焊料的熔点高。
9.如权利要求1所述的电路板的改良结构，其特征在于：所述焊料内插接有导电端子，该导电端子与所述导电通道相对。
10.如权利要求9所述的电路板的改良结构，其特征在于：所述导电端子设有可插接在所述焊料内的焊接端，且所述阻隔物设于焊接端的附近。
CNU2006200582037U 2006-04-25 2006-04-25 电路板的改良结构 Expired - Lifetime CN2891583Y (zh)

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US11/542,260 US7351074B2 (en) 2006-04-25 2006-10-04 Structure of circuit board

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106785740A (zh) * 2016-11-30 2017-05-31 中航光电科技股份有限公司 印制板与射频接触件连接结构及连接器、接触件、印制板

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CN101414519B (zh) * 2007-10-15 2011-07-27 深圳富泰宏精密工业有限公司 按键及应用该按键的电子装置
US8361896B2 (en) * 2010-06-25 2013-01-29 Fci Signal transmission for high speed interconnections
JP5704878B2 (ja) * 2010-09-30 2015-04-22 オリンパス株式会社 光電気変換コネクタ、光伝送モジュール、撮像装置および内視鏡
CN207265325U (zh) * 2017-07-13 2018-04-20 泰科电子(上海)有限公司 连接器

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US5875102A (en) * 1995-12-20 1999-02-23 Intel Corporation Eclipse via in pad structure

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CN106785740A (zh) * 2016-11-30 2017-05-31 中航光电科技股份有限公司 印制板与射频接触件连接结构及连接器、接触件、印制板
CN106785740B (zh) * 2016-11-30 2019-07-26 中航光电科技股份有限公司 印制板与射频接触件连接结构及连接器、接触件、印制板

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