CN2888643Y - Manufacturing room for electronic device - Google Patents
Manufacturing room for electronic device Download PDFInfo
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- CN2888643Y CN2888643Y CN 200520011895 CN200520011895U CN2888643Y CN 2888643 Y CN2888643 Y CN 2888643Y CN 200520011895 CN200520011895 CN 200520011895 CN 200520011895 U CN200520011895 U CN 200520011895U CN 2888643 Y CN2888643 Y CN 2888643Y
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- manufacturing chamber
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- 238000004519 manufacturing process Methods 0.000 title claims description 216
- 239000000758 substrate Substances 0.000 claims description 46
- 230000007246 mechanism Effects 0.000 claims description 34
- 238000000034 method Methods 0.000 claims description 28
- 238000012546 transfer Methods 0.000 claims description 25
- 239000000463 material Substances 0.000 claims description 14
- 238000010276 construction Methods 0.000 claims description 6
- 230000002265 prevention Effects 0.000 claims description 5
- 229910001220 stainless steel Inorganic materials 0.000 claims description 5
- 239000010935 stainless steel Substances 0.000 claims description 5
- 230000002459 sustained effect Effects 0.000 claims description 4
- 230000006835 compression Effects 0.000 claims description 2
- 238000007906 compression Methods 0.000 claims description 2
- 230000015572 biosynthetic process Effects 0.000 claims 1
- 230000032258 transport Effects 0.000 description 18
- 238000009434 installation Methods 0.000 description 9
- 239000004411 aluminium Substances 0.000 description 7
- 229910052782 aluminium Inorganic materials 0.000 description 7
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 6
- 238000013461 design Methods 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 229910000831 Steel Inorganic materials 0.000 description 2
- 239000004809 Teflon Substances 0.000 description 2
- 229920006362 Teflon® Polymers 0.000 description 2
- 230000000712 assembly Effects 0.000 description 2
- 238000000429 assembly Methods 0.000 description 2
- 229920002313 fluoropolymer Polymers 0.000 description 2
- 239000004811 fluoropolymer Substances 0.000 description 2
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 2
- 239000004810 polytetrafluoroethylene Substances 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 230000003321 amplification Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000010339 dilation Effects 0.000 description 1
- 239000013013 elastic material Substances 0.000 description 1
- 239000013536 elastomeric material Substances 0.000 description 1
- 238000007667 floating Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 229920000307 polymer substrate Polymers 0.000 description 1
- -1 polytetrafluoroethylene Polymers 0.000 description 1
- 230000011218 segmentation Effects 0.000 description 1
- 238000005389 semiconductor device fabrication Methods 0.000 description 1
- 239000004636 vulcanized rubber Substances 0.000 description 1
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Abstract
In a first aspect, a first multi-piece chamber is provided. The first multi-piece chamber includes (1) a central piece having a first side and a second side; (2) a first side piece adapted to couple with the first side of the central piece; and (3) a second side piece adapted to couple with the second side of the central piece. The central piece, the first side piece and the second side piece form a substantially cylindrical inner chamber region when coupled together. Numerous other aspects are provided.
Description
The application requires the priority of U.S. Provisional Patent Application US 60/576902 and US 60/587109.US 60/576902 proposed on June 2nd, 2004, title is " semiconductor device fabrication tool and using method thereof " (summary No.8840/L), US 60/587109 proposed on July 12nd, 2004, and title is " electronic installation fabrication tool and using method thereof " (summary No.8840/L2).Here it all is incorporated herein by reference.
Technical field
The utility model relates to flat panel display and/or electronic installation manufacturing, relates in particular to electron device manufacturing chamber and forming method thereof.
The utility model background
Because the substrate size that uses in the flat-panel monitor increases, the size that is used to make the electron device manufacturing chamber (as handling and/or transfer chamber) of large-sized panel display device also must increase.But based on the overall dimension and/or the weight of this chamber, the difficulty of making and transporting this chamber also increases along with the size of this chamber.Therefore, need the improved electron device manufacturing chamber that is used to make large-sized panel display device, comprise the method for this chamber of improved transportation.
The utility model content
In certain embodiments, provide a kind of many plates chamber, having comprised: (1) median plate has first side and second side; (2) first side plates are fit to be connected with first side of median plate; (3) second side plates are fit to be connected with second side of median plate.When median plate, first side plate and second side plate link together, constitute cylindrical circular substantially inner chamber region.
In certain embodiments, provide a kind of median plate, had: (1) first open side; (2) second open side, relative with first open side; (3) first planes between first open side and second open side, are fit to be connected with the chamber, and have the opening that its size allows substrate to pass through; (4) second planes, relative with first plane, between first open side and second open side.This second plane is fit to be connected with the chamber, and has the opening of the vertical stacking that at least two its big or small permission substrates pass through.This many plates chamber also comprises: (1) first side plate, and be fit to be connected, and have at least the first plane with first open side of median plate, there is an opening on this first plane, and the size of this opening allows substrate to pass through; (2) second side plates are fit to be connected with second open side of median plate, and have at least the first plane, and there is an opening on this first plane, and the size of this opening allows substrate to pass through.When first side plate, second side plate and median plate linked together, first opening on the opening on the opening on first plane of first side plate, first plane of second side plate and second plane of median plate was positioned at sustained height substantially.
In certain embodiments, provide a kind of many plates chamber, having comprised: (1) first plate; (2) at least the second plates link to each other with first plate, to form many plates chamber.The overall dimension of the plate chamber more than at least one, the three of the size conforms land of each plate and air transportation regulation does not meet at least one of land and air transportation regulation.
In certain embodiments, provide a kind of many plates chamber, having comprised: (1) median plate, the bottom that has first side, second side and have hemisphere portion; (2) first side plates are fit to be connected with first side of median plate; (2) second side plates are fit to be connected with second side of median plate.
In certain embodiments, provide a kind of many plates chamber, having comprised: median plate, this median plate have first side and second side and have the bottom of hemisphere portion and flat.Flat has first thickness, and hemisphere portion has second thickness less than first thickness.Many plates chamber also comprises: (1) first side plate is fit to be connected with first side of median plate; (2) second side plates are fit to be connected with second side of median plate.
In certain embodiments, provide a kind of many plates chamber, comprised median plate, had: (1) first side; (2) second sides; (3) first planes comprise at least one opening, and its size allows substrate to pass through; (4) second planes comprise at least three openings, and the size of each all allows substrate to pass through.This many plates chamber also comprises: (1) first side plate is fit to be connected with first side of median plate; (2) second side plates are fit to be connected with second side of median plate.
In certain embodiments, provide a kind of many plates chamber, having comprised: (1) median plate has first side and second side; (2) first side plates are fit to be connected with first side of median plate; (3) second side plates are fit to be connected with second side of median plate.First side of median plate comprises at least the first recess, is fit to allow substrate to rotate in many plates chamber, and substrate is sent to the chamber that links to each other with first side plate of many plates chamber from many plates chamber.
In certain embodiments, provide a kind of many plates chamber, having comprised: (1) median plate has first side and second side; (2) first side plates are fit to be connected with first side of median plate, have at least one laminated structure, are fit to reduce sidewall mobile of first side plate; (3) second side plates are fit to be connected with second side of median plate.
In certain embodiments, provide a kind of many plates chamber, having comprised: (1) median plate has first side and second side; (2) first side plates are fit to be connected with first side of median plate.This first side plate comprises at least one supporting construction, is fit to reduce the moving of sidewall of first side plate.This many plates chamber also comprises second side plate, is fit to be connected with second side of median plate.This second side plate comprises at least one supporting construction, is fit to reduce the moving of sidewall of second side plate.In addition, when median plate, first side plate and second side plate link together, form cylindrical substantially inner chamber region.
In certain embodiments, provide a kind of many plates chamber, having comprised: (1) median plate has first side and second side; (2) first side plates are fit to be connected with first side of median plate; (3) second side plates are fit to be connected with second side of median plate; (4) lid, suitable covering is this median plate at least.This lid comprises flat and a plurality of support component, is fit to reduce flat moving in vertical direction.
In certain embodiments, provide a kind of many plates chamber, having comprised: (1) median plate has first side and second side; (2) first side plates are fit to be connected with first side of median plate; (3) second side plates are fit to be connected with second side of median plate; (4) lid, suitable covering is this median plate at least.This lid comprises at least one recess, is fit to be provided at the access of the interior zone of many plates chamber, and need remove this lid.
In certain embodiments, provide a kind of many plates electron device manufacturing chamber, comprised that (1) determine one or more overall dimensions of electron device manufacturing chamber; (2) determine how electron device manufacturing chamber to be divided into a plurality of plates, make in a plurality of plates each size conforms land and the air transportation regulation at least one; (3) make a plurality of plates.The overall dimension of this many plates chamber does not meet at least one of land and air transportation regulation.
In certain embodiments, provide a kind of method of transporting many plates chamber, comprised (1) first plate by land or a plurality of chambers of air transportation plate; (2) second plate by land or a plurality of chambers of air transportation plate; When (3) transporting first and second plates, meet at least one of necessary transportation regulation.The overall dimension of this many plates chamber has been violated at least one of land and air transportation regulation.
In certain embodiments, provide a kind of method of transporting many plates chamber, this many plates chamber has median plate, first side plate and second side plate.This method comprises that (1) is placed at least a portion of vacuum automatic control device in the median plate of this chamber; (2) by land or air transportation median plate; (3) first side plate is linked to each other with second side plate; (4) by land or aviation first and second side plates are transported together; When (5) transporting median plate, first side plate and second side plate, meet necessary transportation regulation.The overall dimension of many plates chamber has been violated at least one of land and air transportation regulation.
In certain embodiments, provide a kind of support electronics to make the method for chamber, comprising: (1) links to each other electron device manufacturing chamber with one or more slide mechanisms of electron device manufacturing chamber strutting piece; (2) use one or more slide mechanisms, with the expansion of admittance electron device manufacturing chamber, thereby the prevention electron device manufacturing chamber shifts out the position on the electron device manufacturing chamber strutting piece.
In certain embodiments, provide a kind of support electronics to make the equipment of chamber.This equipment comprises base, and this base comprises: (1) one or more support components; (2) one or more slide mechanisms, the suitable expansion that links to each other and admit electron device manufacturing chamber with electron device manufacturing chamber of these one or more slide mechanisms, thus the prevention electron device manufacturing chamber shifts out the position on the base.
In certain embodiments, provide a kind of equipment, comprised a kind of unit, this unit has: the median plate of (1) many plates chamber is fit to link to each other with second side plate with first side plate, to form many plates chamber; (2) the vacuum automatic control device is positioned at median plate; (3) base of median plate links to each other with this median plate.At least one of the size conforms land of this unit and air transportation regulation.
In certain embodiments, provide a kind of equipment, comprised a kind of unit, this unit has: first side plate of (1) many plates chamber; (2) second side plate of many plates chamber.This first and second side plate is fit to link to each other with median plate, to form many plates chamber.This unit also comprises: (1) first bedplate links to each other with first side plate; (2) second bedplates link to each other with second side plate.At least one of the size conforms land of this unit and air transportation regulation.Many others are also provided, with of the present utility model above-mentioned and other aspect is consistent.
Further feature of the present utility model and aspect can become apparent by following specific descriptions, subsidiary claim and accompanying drawing.
Description of drawings
Fig. 1 is according to some embodiment of the utility model, the vertical view of first typical many plates electron device manufacturing chamber.
Fig. 2 A is according to some embodiment of the present utility model, the exploded perspective view of first typical many plates electron device manufacturing chamber.
Fig. 2 B is the stereogram that first Room shown in Fig. 2 A assembles.
Fig. 2 C is the vertical view of first Room shown in Fig. 2 A.
Fig. 2 D is the end view of first Room shown in Fig. 2 A.
Fig. 2 E is the stereogram that first Room of lid design is replaced in the use shown in Fig. 2 A.
Fig. 3 is according to some embodiment of the present utility model, the stereogram of second typical many plates electron device manufacturing chamber.
Fig. 4 is according to some embodiment of the present utility model, the exploded perspective view of second typical many plates electron device manufacturing chamber.
Fig. 5 is according to some embodiment of the present utility model, and expression is arranged in the end view of first plate of second typical many plates electron device manufacturing chamber of container.
Fig. 6 represents according to some embodiment of the present utility model, and expression is arranged in the end view of second plate of second typical many plates electron device manufacturing chamber of container.
Fig. 7 represents according to some embodiment of the present utility model, the stereogram of electron device manufacturing chamber strutting piece.
Fig. 8 represents that according to some embodiment of the present utility model exemplary electronic device is made the stereogram of chamber strutting piece.
Fig. 9 represents that according to some embodiment of the present utility model exemplary electronic device shown in Figure 8 is made the stereogram of chamber strutting piece.
Figure 10 is that exemplary electronic device shown in Figure 9 is made the stereogram that the chamber strutting piece is used for support electronics manufacturing chamber.
Figure 11 is the stereogram of typical chassis/central compartment's board component of can be used as whole Transporting.
Figure 12 is the stereogram that can be used as the side plate/base assembly of whole Transporting.
Embodiment
About central transfer chamber, be decomposed into a plurality of assemblies by single aluminium block " scene " processing central transfer chamber and with central transfer chamber, inquire into as the possible method of further measuring transfer chamber.For example, referring to " LCD large-size substrate periodical; substrate increases: size restrictions wherein? " (LCD Large-Area Substrate Issues, SubstrateEnlargement:Where is the Size Limitation? "), flat-panel monitor (Flat Panel Display) 2003 (panel seminar (panel discussion)), wherein the I.D.Kang of Applied Komatsu Technologies (AKT) thinks:
If transfer chamber further increases, a kind of equipment scheme is that the processing of single aluminium block is finished in the Asia ... the another kind of selection is that central transfer chamber is decomposed into a plurality of assemblies.Although can guarantee vacuum condition by single aluminium block processing transfer chamber, also can form the large-scale transfer chamber that constitutes by assembly, and carry out site installation, this assembly is made by some aluminium blocks.
The first aspect of this method and equipment relates to a kind of improved method and apparatus, is used to seek large-scale electron device manufacturing chamber, as the measurability of transfer chamber.The second aspect of this method and equipment relates to a kind of electron device manufacturing chamber of dynamic support.
Electron device manufacturing chamber
Fig. 1 is according to some embodiment of the utility model, the vertical view of first typical many plates electron device manufacturing chamber.Referring to Fig. 1, many plates electron device manufacturing chamber 101 is a transfer chamber, is used for transmitting substrate during making electronic installation.This transfer chamber is connected with one or more process chambers and/or load lock (load locks) 103 during making electronic installation.This transfer chamber can comprise terminal operating device 105, is used for transmitting substrate 107 at process chamber and/or load lock 103 during making electronic installation.Substrate 107 can comprise as glass plate, polymer substrate, semiconductor chip or analog.
According to some embodiment of the present utility model, transfer chamber 101 can comprise interconnective a plurality of plate.Especially, transfer chamber 101 can comprise first plate 109 (as first side plate) and second plate 111 (as second side plate) that links to each other with the 3rd plate 113 (as median plate).First plate 109 can encircle (not shown) by O-with second plate 111 and link to each other with the 3rd plate 113.First plate 109 and second plate 111 can utilize positioner such as screw, pin or analog to be positioned the 3rd plate 113.Although many plates of Fig. 1 electron device manufacturing chamber 101 comprises three plates, this many plates electron device manufacturing chamber can comprise more or less plate (as 2,4,5,6 or the like).
The width of conventional transfer chamber (as the veneer transfer chamber) is limited in about 3m or littler substantially by land and/or air transportation regulation, transfer capability or architectural design.For example, in 747 airfreighters of the most common capacity, may be forbidden by the transportation regulation of this locality greater than the transfer chamber of about 3m, and may be excessive, can not be by the access road of standard electronic device manufacturing apparatus.On the contrary, in one or more embodiment of the present utility model, when this many plates transfer chamber assembled, its width (as overall width) W1 was 4.2 meters.Therefore, the veneer transfer chamber of electron device manufacturing chamber 101 comparable routines of the present utility model holds bigger substrate.The width of electron device manufacturing chamber 101 can be greater than or less than 4.2 meters.
When many plates of typical case electron device manufacturing chamber 101 assembled, its shape (as external shape) was a hexagon.But many plates electron device manufacturing chamber 101 can have other external shape and (for example, if there are eight chambers to be connected in transfer chamber 101, then be octangle, can be trapezoidal but not triangle at this situation first and second plates 109,111, as shown in the figure).
Fig. 2 A is according to some embodiment of the present utility model, the exploded perspective view of first typical many plates electron device manufacturing chamber 101.But each level of first to the 3rd plate 109-113 connects, to form many plates electron device manufacturing chamber 101.The length of first plate 109 represents that with LS1 width is represented with WS1.The length of second plate 111 represents that with LS2 width is represented with WS2.The length of the 3rd plate 113 represents that with LC1 width is represented with WC1.
In one or more embodiments, the width W C1 of the 3rd plate 113 is about 2.4m, and length L C1 is about 4.2m.Greater or lesser length and/or width can be used for the 3rd plate 113.In an illustrated embodiment, the length L C1 of the 3rd plate 113 forms the overall width W1 of chamber 101.As shown in the figure, the length L S2 of the length L S1 of first plate 109 and second plate 111 equates with the length L C1 of the 3rd plate 113.But the length L S2 of the length L S1 of first plate 109 and/or second plate 111 may be different.In one embodiment, the width W S2 of the width W S1 of first plate 109 and/or second plate 111 is about 1.2 meters.But the width W S2 of the width W S1 of first plate 109 and/or second plate 111 may difference (as greater or lesser).(in a special embodiment, although can utilize other relation between the width of first, second and the 3rd plate 109,111 and 113, the width that the width of the 3rd plate 113 can be approximately equal to or less than first plate 109 adds the width of second plate 111).Each plate 109-113 of many plates electron device manufacturing chamber 101 can be made by for example aluminium, stainless steel or any available relative inert material that is suitable for use as transfer chamber.
Although the overall dimension of many plates electron device manufacturing chamber 101 does not meet land and/or air transportation regulation, the size conforms land of each plate 109-113 of many plates electron device manufacturing chamber 101 and/or air transportation regulation.More particularly, in the above-described embodiments, the overall width W1 of many plates electron device manufacturing chamber 101 is 4.2m, does not meet land and/or air transportation regulation.But the width W S2 of the width W S1 of first plate 109 and second plate 111 is 1.2m, and the width W C1 of the 3rd plate 113 is 2.4m, and each all meets land and/or air transportation regulation.(in another embodiment, the width W C1 of the 3rd plate 113 is about 3m to 3.2m, and width W S1, the WS2 of first and second plates 109,111 are about 1.5m to 1.6m.)
In addition, each plate 109-113 of many plates electron device manufacturing chamber 101 can make in conventional machining center or shop.Therefore, family in the optional majority of the producer of many plates electron device manufacturing chamber 101 conventional machining center or the shop or family how make the plate 109-113 of many plates electron device manufacturing chamber 101.Competition between many tame conventional machining centers or the shop makes the producer of many plates electron device manufacturing chamber 101 obtain lower price.On the contrary, it is limited can making the machining center of veneer electron device manufacturing chamber or the quantity in shop, and the size of this veneer electron device manufacturing chamber can be held bigger substrate, is similar to many plates electron device manufacturing chamber 101.This limited machining center or shop quantity constitute competition and weaken.Because competition weakens, the producer will pay than making the plate of manying semiconductor and make chamber 101 more expenses for making this veneer chamber.In addition,, when the producer of this veneer chamber transports this device, need to obtain to permit especially that for example the guard escorts, " special requirement goods " mark or other because this veneer chamber does not meet land and/or air transportation regulation.And many plates electron device manufacturing chamber 101 does not need this permission.
Describe the further feature of the electron device manufacturing chamber of plate more than first 101 below with reference to Fig. 2 A and Fig. 2 B-2D, wherein Fig. 2 B is the stereogram that first Room 101 assembles; Fig. 2 C is the vertical view of first Room 101; Fig. 2 D is the end view (plane having represented first Room 101, this plane are suitable for being connected to the load lock chamber that following further described three substrates pile up) of first Room 101.
Referring to Fig. 2 A-2B, first Room 101 comprises a plurality of plane 201a-f (Fig. 2 C).In an illustrated embodiment, have six planes, but also can have more or less plane (as mentioned above).
Each plane 201a-f provides smooth sidewall, and process chamber, the salable connection of load lock or other chamber be (for example, by O shape circle or other seal) thereon, for example, and referring to chamber 103, as shown in Figure 1.Although have plane 201a-f, the general structure of first Room 101 is cylindrical basically.For example, shown in Fig. 2 A-2C, first (side) plate 109 comprises cylindrical wall 203, and plane 201b, 201c form therein, and second (side) plate 111 comprises cylindrical wall 205, and plane 201e, 201f form therein.The 3rd (central authorities) plate 113 has the opposing sidewalls 207,209 of substantially flat, and (Fig. 2 A) forms plane 201a, 201d respectively as shown in the figure.
Interior zone based on the cylindrical wall Room 101 203,205, the first of first and second plates 109,111 is cylindrical shape (for example referring to Fig. 2 A and Fig. 2 C) substantially.The columnar structured internal capacity that reduces first Room 101, and the vacuum automatic control device (Fig. 7) that allows to be arranged in first Room 101 rotates freely.This rotation can occur in the rotation of automatic control equipment for example in case to various chambers that first Room 101 (Fig. 1) is connected between during the transmission substrate.
In order to adapt to the rotation of vacuum automatic control device by the 3rd (central authorities) plate 113 of chamber 101, the 3rd plate 113 comprises jagged regional 211a-d (see Fig. 2 A, wherein only show recess 211a-c).When transmitting, recess 211a-d also provides modification space to substrate by the opening (as slotted opening) that forms in each plane of first and second side plates 109,111.That is to say, substrate by respectively with plane 201f, 201e, 201c, when 201b corresponding opening 213,215,217,219 transmits, recess 211a-d can provide modification space (shown in Fig. 2 A and Fig. 2 B).
And shown in plane 201b, 201c, 201e, 201f an opening is only arranged, each plane can comprise additional opening (as 2,3,4 or more openings).Equally, the plane 201a of shown the 3rd (central authorities) plate 113 has single opening 221 (Fig. 2 A), but can comprise additional opening (as 2,3,4 etc.).The plane 201d of the 3rd plate 113 comprises the opening 223a-c (Fig. 2 A and Fig. 2 C) of three vertical stackings, but can comprise the opening (as 1,2,4,5 etc.) of other quantity.In at least one embodiment of the present utility model, opening 217 vertical arrangements (shown in Fig. 2 D) of the opening 215 of the plane 201e of the bottom opening 223c of the plane 201d of the 3rd plate 113 and second side plate 111 and the plane 201c of first side plate 109.The size of noting each opening 213-223c should allow substrate to pass through.Also can use other structure.
Referring to Fig. 2 A-2C, first and second side plates 109,111 comprise a plurality of laminated structures 225 again, and each is suitable for providing to first Room 101 globality of structure.For example, because at the interior zone of first Room 101 and coupled arbitrary process chamber, and/or the pressure differential between the external environment condition of first Room 101, laminated structure 225 can reduce the deflection of the cylindrical shape side/roof of first and second side plates 109,111.In addition, use laminated structure 225 that the wall thickness of first and second plates 109,111 is reduced, and reduced the gross weight of first Room 101.In one embodiment, laminated structure 225 has about 0.55 inch thickness on the outer side/roof next door of first and second side plates 109,111, sealing surfaces next door at first and second side plates 109,111 that contact with median plate 113 (stainless steel material) has about 1.3 inches thickness, but also can use other material and/or thickness.
Shown in Fig. 2 A was further, the bottom 227 of the 3rd (central authorities) plate 113 of first Room 101 comprised flat 229 and hemisphere portion 231 (seeing Fig. 2 D in addition).Because hemisphere portion 231 has hemispheric shape, it provides improved intensity to bottom 227, and has reduced the material thickness demand of bottom 227.In an exemplary embodiments, when using stainless steel material, hemisphere portion 231 can have about 3/8 " or littler thickness, and flat 227 can have about 3/4 "-1 " or littler thickness.Can use the thickness difference between other material and/or one-tenth-value thickness 1/10 and/or flat 229 and the hemisphere portion 231.In order further to increase the intensity of hemisphere portion 231, laminated structure or similar supporting construction 233 can form below hemisphere portion 231, shown in Fig. 2 D.Use laminated structure 233 can reduce for example vertical deflection of hemisphere portion 231.
Fig. 2 B-2C and Fig. 8 represent can be used for the top cover 235 of first Room 101.For example, lid 235 is suitable for sealing the 3rd (central authorities) plate 113 (by use O-ring or similar potted component between lid the 235 and the 3rd plate 113) of first Room.
Referring to Fig. 2 B-2C and Fig. 8, top cover 235 comprises by a plurality of supporting constructions, for example the bar 239 shown in and the smooth hermetic unit 237 that strengthens.Hermetic unit 237 can have and the similar thickness of the flat 229 (Fig. 2 A) of the bottom 227 of chamber 101, and bar 239 provides additional structural supports (make cover 235 thickness and weight reduce).Lid 235 can comprise and be used for respect to 101 liftings of first Room and/or reduce covering 235 linkage unit 241 (for example by crane or analog).
Based on the weight of lid 235, wishing provides one or more access ports or other opening in lid 235, so that whole lid 235 does not need to remove just and can carry out access (for example safeguarding or other maintenance work) to 101 inside, first Room from first Room 101.Fig. 2 E is to use the stereogram of first Room 101 of replacing lid design 235 ', and lid 235 ' comprises two access port 243a-b.Each access port 243a-b can open, and carries out access with the interior zone to first Room 101, does not need whole lid 235 ' to remove from first Room 101.Also can adopt the access port (as 1,3,4 etc.) of other quantity.
Fig. 3 is according to some embodiment of the present utility model, the stereogram of second typical many plates electron device manufacturing chamber 301.Second typical many plates electron device manufacturing chamber 301 comprises first to the 5th plate 303-311 that links together.But second typical many plates electron device manufacturing chamber 301 can comprise more or less plate.Compare with first typical many plates electron device manufacturing chamber 101, each plate of second typical many plates electron device manufacturing chamber 301 can vertically connect, to form second typical many plates electron device manufacturing chamber 301.
Fig. 4 is according to some embodiment of the present utility model, the exploded perspective view of second typical many plates electron device manufacturing chamber 301.First plate 303 of second typical many plates electron device manufacturing chamber 301 is an egg end.The diameter D1 of egg end 303 is about for example 4.2 meters.Egg end 303 can be made by stainless steel or other material, and can utilize rotary press modelling technology or other technology manufacturing.
In second typical many plates electron device manufacturing chamber 301, egg end 303 links to each other with second plate 305, and second plate 305 links to each other with the 3rd plate 307, and the 3rd plate 307 links to each other with the 4th plate 309.Second to the 4th plate 305-309 of second typical many plates electron device manufacturing chamber 301 has constituted the main body of second typical many plates electron device manufacturing chamber 301.The width W 2 of each among second to the 4th plate 305-309 is about for example 4.2 meters.The width of second plate 305, the 3rd plate 307 and/or the 4th plate 309 can be different, although each second to the 4th plate 305-309 is hexagon, also can use other shape.In one aspect, the material of each second to the 4th plate 305-309 is an aluminium, but also can use other material.In addition, can use single plate as main body.
The 5th plate 311 is for being used for the hemisphere bottom of second typical many plates electron device manufacturing chamber 301.The 5th plate 311 links to each other with the bottom of the 4th plate 309.Similar this egg end, this hemisphere bottom diameter D2 is about for example 4.2 meters.Also can use other size.
In order to make many plates electron device manufacturing chamber 101,301, user for example producer can use following creationary method.According to this creationary method, determine one or more overall dimensions of this many plates electron device manufacturing chamber.Especially, the producer need make the substrate of required size.Based on required size, the producer can determine that (as design) can make one or more overall dimensions of many plates electron device manufacturing chamber of this substrate.If the size of required substrate is enough big, then the overall dimension of this chamber does not meet at least one of land and air transportation regulation.
Then, the producer for example will determine how should be decomposed into a plurality of plates by many plates electron device manufacturing chamber so that the size conforms land of each in a plurality of plate and air transportation regulation at least one, simultaneously, when this chamber assembled, the globality of its structure was enough carried out manufacture process.For example, the level of electron device manufacturing chamber 301 shown in the vertical segmentation that the producer can be by electron device manufacturing chamber shown in Fig. 1-2 101 or Fig. 3-4 is cut apart this many plates electron device manufacturing chamber that will design and is decomposed into plate.The producer also can determine by cutting apart of other direction or combinations of directions this electron device manufacturing chamber being decomposed into a plurality of plates.
Make a plurality of plates then.For example, the producer can make a plurality of plates by machining center or shop.In this way, make many plates electron device manufacturing chamber 101,301.
In case made many plates electron device manufacturing chamber 101,301, many plates electron device manufacturing chamber 101,301 can be transported to for example user site.In order to transport many plates electron device manufacturing chamber 101,301, the producer can utilize the method according to this chamber of transportation of the one or more embodiment of the utility model.For example, first plate of a plurality of electron device manufacturing chamber plates can transport by land or air transportation.First plate can be placed in the container that meets transportation regulation, and side (as the bottom surface) shape that makes first plate and this container at an angle.Like this, the permissible value that the actual height of first plate or width dimensions will be when not being placed on this container with this angle, but still can put into the container that meets the transportation regulation.The ability of the big plate of water transport makes this creationary many plates chamber be formed by less plate.Therefore, though do not need, preferably this plate is placed in the water transport container with an angle.In certain embodiments, preferably make many plates chamber, make mainboard or median plate big as much as possible, and still can put into standard-sized water transport container, and the residue plate is as much as possible little, so that assembling is easier.
Fig. 5 represents according to some embodiment of the present utility model, first plate of second typical many plates electron device manufacturing chamber shown in the container 501.With reference to Fig. 5, the width W 3 of container 501 can be for example 3 meters, meets land and/or air transportation regulation.Also can use the container of less width.First plate 303 (as egg end) can be placed in the container 501, makes first plate 303 and the side 503 (as the bottom surface) of container 501 become the angle A of 50 degree approximately.First plate 303 also can form greater or lesser angle with the side 503 of container 501.In one embodiment, the side 503 of first plate 303 and container 501 forms more than or equal to 50 ° and smaller or equal to 90 ° angle A.Therefore, although the width of first plate 303 is 4.2 meters, it is fit to put into the container of littler width.Then, container 501 transports through land or air transportation.Meet necessary transportation regulation when in this manner, transporting this first plate.
Similarly, second plate 305 of electron device manufacturing chamber 301 transports through land or air transportation.Second plate 305 is placed in the container that meets transportation regulation, and the bottom surface shape that makes second plate 305 and this container at an angle.For example, Fig. 6 represents according at least one embodiment of the present utility model, the end view of second plate 305 of second typical many plates electron device manufacturing chamber 301 in the container 501.With reference to Fig. 6, second plate 305 is placed in the container 501 in the mode of similar first plate 303.
The overall dimension of the many plates electron device manufacturing chamber 301 that assembles is violated at least one of land and air transportation regulation.For example, the overall width of electron device manufacturing chamber 301 is not less than 3 meters, therefore, does not meet land and/or air transportation regulation.Therefore, first and/or second plate is for example transported respectively in container 501.
In this way, but many plates electron device manufacturing chamber 101,301 work in-process hearts or shop make, overcome the shortcoming (as cost) of the veneer electron device manufacturing chamber of making similar size.Further, many plates electron device manufacturing chamber 101,301 can be transported to user site, has overcome the shortcoming (as cost, time etc.) of the veneer electron device manufacturing chamber that transports similar size.
Support electronics is made the chamber
Fig. 7 represents according to the utility model, the stereogram of electron device manufacturing chamber strutting piece 701.With reference to Fig. 7, electron device manufacturing chamber strutting piece 701 comprises base 703.One or more parts of base 703 can be installed in (for example fixing by ground board binding 704) on the floor.
Notice in routine and make in the strutting piece of chamber that one or more parts of base are installed (as fixing) in the electron device manufacturing chamber bottom.According to some embodiment of the present utility model, opposite with routine manufacturing chamber strutting piece, electron device manufacturing chamber strutting piece 701 additionally or alternatively can comprise one or more slide mechanisms 705, provides the dynamic support part at 707 places, bottom of electron device manufacturing chamber 709.One or more slide mechanisms 705 comprise slidably bearing, for example apply the bearing of polytetrafluoroethylene (PTFE), also comprise the elastic support (mount) with load-bearing rubber or analog.The material that also can on one or more slide mechanisms 705, use other to be fit to.
Alternatively, one or more slide mechanisms 705 can comprise the roller that replaces or be additional to sliding bearing.In certain embodiments, electron device manufacturing chamber 709 can hang by the flexible line of vertical, oblique and/or level, this flexible line with swelliong power is permitted any expansion of this chamber, and this swelliong power surpasses the swell increment of electron device manufacturing chamber 709 maximum possible.
One or more slide mechanisms 705 are suitable for admitting heat or other expansion of electron device manufacturing chamber 709.For example, during making electronic installation, can cause that from the heat of adjacent process chamber the temperature of electron device manufacturing chamber 101,301 surpasses 200 degrees centigrade or 300 degrees centigrade, cause that electron device manufacturing chamber 709 expands.Slide mechanism 705 prevention electron device manufacturing chambers 709 shift out the position (for example on base 703) on the electron device manufacturing chamber strutting piece 701.Slide mechanism 705 can effectively be admitted any possible swell increment of electron device manufacturing chamber, thereby stops electron device manufacturing chamber 709 to shift out electron device manufacturing chamber strutting piece 701, even stops it only to shift out its position.
Fig. 8 represents that according to some embodiment of the present utility model exemplary electronic device is made the stereogram of chamber strutting piece 801.With reference to Fig. 8, it can be many plate supports that exemplary electronic device is made chamber strutting piece 801.Especially, exemplary electronic device manufacturing chamber strutting piece 801 can comprise many plates base 803.For example, base 803 can comprise first plate, 805, the second plates 807 and the 3rd plate 809.Base 803 also can comprise more or less plate.Exemplary electronic device is made the plate of chamber strutting piece 801 corresponding to the plate (as 109-113) of being made many plates electron device manufacturing chamber 101 of chamber strutting piece 801 supports by exemplary electronic device.
In example shown in Figure 8, the 3rd plate 809 (as median plate) of base 803 comprises eight slide mechanisms 705.The 3rd plate 809 can comprise more or less slide mechanism 705.As shown in Figure 7, one or more slide mechanisms 705 can be arranged in (as direct top) with ground board binding 704.But slide mechanism 705 also can be positioned at diverse location.Similarly, first and second plates 805,807 of base 803 can comprise a plurality of slide mechanisms 705.Although many plates electron device manufacturing chamber strutting piece 801 described above, it can be the veneer strutting piece that exemplary electronic device is made chamber strutting piece 801.
Notice if thermal expansion causes one or more slide mechanisms 705 to arrive the edge of its individual scopes that in certain embodiments, other slide mechanism 705 can begin to admit any further towards the thermal expansion of original slide mechanism 705.That is to say that in case the external force that makes slide mechanism 705 move to the limit of its individual scope is run into stop mouth (stop frame) (as described below), expansive force will be redirected to rightabout, be admitted by other slide mechanism 705.
Fig. 9 represents that according to some embodiment of the present utility model exemplary electronic device is made the amplification stereogram of the detail section of chamber strutting piece 801.With reference to Fig. 9, exemplary electronic device is made chamber strutting piece 801 and is comprised one or more slide mechanisms 705 with sliding bearing 905 and elastic support 907.
Sliding bearing 905 can comprise axle or the screw rod 903 that is installed on pin or slider disc 901.Slider disc 901 is arranged in recess 904, and the fluoropolymer resin that recess 904 is coated with low-frictional force is the Teflon that produces of E.I.Du Pont Company for example.This recess or " stop mouth " (" stop frame ") 904 can be square circular or any suitable shape, with the expected range of the horizontal movement that adapts to slider disc 901.Equally, slider disc 901 can be square circular or any suitable shape, to adapt to the expected range of the horizontal movement in the recess 904.Sliding bearing 905 can be made by steel or any suitable material.In certain embodiments, the fluoropolymer resin that the lower surface of slider disc 901 or side surface also can be coated with low-frictional force is Teflon for example, and sliding bearing 905 is moved freely in recess 904.Further, slider disc 901 can comprise replacement or be additional to tectal roller of low-frictional force or ball bearing.In certain embodiments, any suitable mobile bearing can be used to replace sliding bearing 905.
Be installed on the axle of slider disc 901 or the bottom 707 (Fig. 7) that screw rod 903 also can be installed on electron device manufacturing chamber 709.Screw rod 903 can be screwed in the threaded recess of bottom 707 of electron device manufacturing chamber 709, or utilizes any suitable fastening to fix as nail or other securing member.
In operation, sliding bearing 905 can carry the weight of electron device manufacturing chamber 709, when electron device manufacturing chamber 709 is expanded, moves within the acceptable range.Simultaneously, elastic support 907 can make the ideal position on the electron device manufacturing chamber 709 deflection electron device manufacturing chamber strutting pieces 801 effectively.As mentioned above, the moving range accepted of electron device manufacturing chamber 709 can be determined by the size of the slider disc 901 that is arranged in recess 904.The position of this recess and geometry also can influence this moving range.In certain embodiments, the moving range that elastic support 907 can be additionally or alternatively limiting electronic device is made chamber 709.
For further setting forth the utility model, provide example size.Yet notice that following size only is the elaboration to specific embodiments, the example that only is used for summarizing suitable relatively size.In certain embodiments, the diameter D3 of slider disc 901 is about 100mm, and recess 904 laterally is about 125mm, and the height h1 of slider disc 901 is about 25mm, and the diameter D4 of axle or screw rod 903 is about 25mm, and the height h2 of screw rod 903 is about 137mm.In certain embodiments, the screw of M25 (ISO965-1, Sect.5, metric system securing member dimension name) can be used as screw rod 903.Slide mechanism 705 can have with figure in different shape and/or sizes.In certain embodiments, but elastic support 907 deflections or be stretched to about 15mm.Elastic support 907 can have with figure in different shape and/or sizes.
Figure 10 is the stereogram that exemplary electronic device shown in Figure 9 is made chamber strutting piece 801, represents that it is supporting electron device manufacturing chamber 101.With reference to Figure 10, the elastic support 907 of each strutting piece 801 links to each other with the bottom of sliding bearing 905 with electron device manufacturing chamber 101.
When making electronic installation, electron device manufacturing chamber 101 can extend based on thermal expansion or other power.Especially, the part of the electron device manufacturing chamber 101 of strutting piece 801 tops can vertically and flatly expand.The elongation of electron device manufacturing chamber 101 or expansion make elastic support 907 compressions or elongate, and sliding bearing 705 is moved.In this way, the increase or the deflection of arbitrary dilation of each slide mechanism 705 admittance electron device manufacturing chamber 101.Remaining slide mechanism 705 uses in a similar manner, admitting the expansion of this electron device manufacturing chamber, thereby stops electron device manufacturing chamber 101 to shift out position on the electron device manufacturing chamber strutting piece 801.When making electronic installation, in this way, electron device manufacturing chamber 101 kept in balance and level.On the contrary, cause that by the thermal expansion meeting of the manufacturing chamber of the conventional supports support that only is fixedly connected on this electron device manufacturing chamber this electron device manufacturing chamber shifts out, drops and/or destroys this strutting piece.
Make the chamber for support electronics, can use method according to this electron device manufacturing chamber of support of some embodiment of the present utility model.Especially, this support electronics is made one or more slide mechanisms 705 that the chamber is connected in electron device manufacturing chamber strutting piece 801.One or more slide mechanisms 705 are used to admit the expansion of electron device manufacturing chamber, thereby stop this electron device manufacturing chamber to shift out or the electron device manufacturing chamber strutting piece 801 that drops.For example, the elastic support 907 of slide mechanism 705 can elongate or compress, to admit the expansion of electron device manufacturing chamber.
Foregoing has only disclosed exemplary embodiments of the present utility model.The modification to above-mentioned disclosed equipment and method that falls into the utility model scope is conspicuous to those skilled in the art.For example, although above-mentioned some embodiment relates to transfer chamber, this method and equipment also can be used for the electron device manufacturing chamber of other type, as PVD, CVD or analog process chamber.Further, in one or more embodiments, before the plate with many plates electron device manufacturing chamber 101,301 was transported to user site, automatic control equipment can insert in (as being assembled into) this plate.For example, the bottom of vacuum automatic control device can be installed among the 3rd (central authorities) plate 809 (Fig. 8) of base 803, and in the base ring 811 as base 803, the top of vacuum automatic control device can be installed in the 3rd (central authorities) plate 113 of chamber 101.The 3rd plate 113 of chamber 101 can be connected in the 3rd plate 809 of base 803 then, and the board component of base/central compartment can be used as an integral body and transports.Figure 11 is the stereogram of board component 1101 of preparing the typical chassis/central compartment that comprises vacuum automatic control device (not shown) of transportation.In at least one embodiment, before the water transport, capping unit 1103a-b is installed on more than the open side of the 3rd (central authorities) plate 113 of chamber 101, and capping unit 1105 is installed on more than arbitrary the opening of the 3rd plate 113.Capping unit 1103a-b, 1105 can be made by aluminium or any other suitable material, can protect chamber 101 inner and/or be installed in wherein any assembly when water transport.
In one or more embodiment of the present utility model, at least one of the size conforms land of assembly 1101 and air transportation regulation.For example, assembly 1101 can have about 3m or littler height.
In another embodiment of the present utility model, the first and second side room plates 109,111 and first and second bedplates 807,805 can fit together and/or transportation together as a whole.For example, Figure 12 is the stereogram that can be used as the side plate/base assembly 1201 of whole Transporting.For example can be connected in bedplate 807, be connected in bedplate 805,, form assembly 1201, as shown in the figure by this side plate/base assembly is fitted together by second side plate 111 with chamber 101 by first side plate 109 with chamber 101.Then assembly 1201 is transported as a whole.The capping unit 1203 that is similar to capping unit 1105 shown in Figure 11 is used in water transport and covers any plane opening (for example protecting this chamber intralamellar part) before.
In one or more embodiment of the present utility model, the size of assembly 1201 meets at least one land and air transportation regulation.For example, assembly 1201 can have about 3m or littler height.
The plate of chamber 101,103 and/or base 803 can utilize any suitable method to transport.In at least one embodiment, the side plate 109,111 of chamber 101 can utilize first Transportation Model (as land, ship, aviation etc.) to transport, and the median plate 113 of chamber 101 can utilize second Transportation Model (as land, ship, aviation etc.) to transport.In another embodiment, first and/or second side plate 109,111 can transport by first truck, and median plate 113 can transport by second truck.
In at least one embodiment of the present utility model, the vacuum automatic control device can utilize the floating seal plate that this automatic control equipment is separated with the mobile phase of this bottom, chamber, (for example by utilizing bellows seal that this automatic control equipment is installed on the base of this chamber) as shown in Figure 7, the U.S. Patent application US 10/601185 that its mode and on June 20th, 2003 propose is similar, at this it all is incorporated herein by reference.
Shown in Fig. 2 A-2E, the side plate 109,111 of first Room 101 all is the single plate that does not need independent lid or bottom.Independent lid and/or bottom can be used for one of them of side plate 109,111 or all, but need the additional seal interface that may degrade and/or leak.
Though the utility model is primarily aimed at flat-panel monitor and is described, but be appreciated that this creationary many plates chamber can be used for transmitting, handling and/or make the substrate of any kind, and can be used for transmitting, handling and/or make the device (for example flat-panel monitor, solar panels and/or battery etc.) of any kind.
Be appreciated that transportation is defined in possibility different (as the U.S., Japan, Korea S, TaiWan, China, China etc.) between the country /region.For example, size restrictions or other relevant transportation parameter may be different between country /region.But the utility model can be made amendment to adapt to the special transportation regulation (still dropping in purport of the present utility model and the scope) of any country /region.
Therefore, though disclose the utility model with reference to exemplary embodiments, should be appreciated that other embodiment also may fall in the purport of the present utility model and scope that limits as following claim.
Claims (67)
1, a kind of electron device manufacturing chamber is characterized in that, comprising:
Median plate has first side and second side;
First side plate is fit to be connected with first side of median plate; And
Second side plate is fit to be connected with second side of median plate;
Wherein, when median plate, first side plate and second side plate linked together, formation was inner chamber region cylindraceous substantially.
2, electron device manufacturing chamber as claimed in claim 1 is characterized in that, forms transfer chamber when median plate, first side plate and second side plate link together.
3, electron device manufacturing chamber as claimed in claim 1 is characterized in that wherein median plate is rectangular substantially.
4, electron device manufacturing chamber as claimed in claim 1 is characterized in that wherein, and median plate has 3 meters or longer length.
5, electron device manufacturing chamber as claimed in claim 4 is characterized in that, median plate has 2.4 meters or wideer width.
6, electron device manufacturing chamber as claimed in claim 1 is characterized in that, median plate comprises the bottom with hemisphere portion.
7, electron device manufacturing chamber as claimed in claim 6 is characterized in that, hemisphere portion is suitable for holding the vacuum automatic control device.
8, electron device manufacturing chamber as claimed in claim 6 is characterized in that, hemisphere portion comprises at least one sheet strutting piece, is suitable for reducing hemisphere portion moving in vertical direction.
9, electron device manufacturing chamber as claimed in claim 8 is characterized in that, hemisphere portion comprises a plurality of sheet strutting pieces, and each sheet strutting piece is suitable for reducing hemisphere portion moving in vertical direction.
10, electron device manufacturing chamber as claimed in claim 6 is characterized in that, the bottom of median plate comprises flat.
11, electron device manufacturing chamber as claimed in claim 10 is characterized in that, flat has first thickness, and hemisphere portion has second thickness less than first thickness.
12, electron device manufacturing chamber as claimed in claim 11 is characterized in that, first thickness is 0.75 to 1.0 inch or littler, and second thickness is 0.375 inch or littler.
13, electron device manufacturing chamber as claimed in claim 11 is characterized in that, flat and hemisphere portion are formed by stainless steel material.
14, electron device manufacturing chamber as claimed in claim 1 is characterized in that, median plate has first plane and second plane, wherein,
First plane comprises at least one opening, and its size allows substrate to pass through;
Second plane comprises at least two openings, and the size of each all allows substrate to pass through.
15, electron device manufacturing chamber as claimed in claim 14 is characterized in that, second plane comprises at least three openings, and the size of each all allows substrate to pass through.
16, electron device manufacturing chamber as claimed in claim 14 is characterized in that, first plane is suitable for being sealedly attached to process chamber.
17, electron device manufacturing chamber as claimed in claim 16 is characterized in that, second plane is suitable for being sealedly attached to the load lock chamber.
18, electron device manufacturing chamber as claimed in claim 17 is characterized in that, second plane is suitable for being sealedly attached to the load lock chamber, the substrate of at least three vertical stackings of this chamber storage, and wherein, second plane has:
First opening, its size allows substrate passing through between median plate and load lock chamber on first height;
Second opening, its size allows substrate passing through between median plate and load lock chamber on second height; And
The 3rd opening, its size allows substrate passing through between median plate and load lock chamber on the 3rd height.
19, electron device manufacturing chamber as claimed in claim 18 is characterized in that,
First side plate comprises at least the first plane, and this plane has opening, and its size allows substrate to pass through;
Second side plate comprises at least the first plane, and this plane has opening, and its size allows substrate to pass through; And
When first side plate, second side plate and median plate linked together, first opening on the opening on the opening on first plane of first side plate, first plane of second side plate and second plane of median plate was positioned at sustained height substantially.
20, electron device manufacturing chamber as claimed in claim 1 is characterized in that, first side of median plate comprises at least the first recess, is suitable for allowing substrate to rotate in many plates chamber, and is sent to the chamber that links to each other with first side plate of many plates chamber from many plates chamber.
21, electron device manufacturing chamber as claimed in claim 20 is characterized in that, second side of median plate comprises at least the first recess, is suitable for allowing substrate to rotate in many plates chamber, and is sent to the chamber that links to each other with second side plate of many plates chamber from many plates chamber.
22, electron device manufacturing chamber as claimed in claim 1 is characterized in that, first side plate and second side plate have first width, and median plate has second width, the twice that this second width is first width or bigger.
23, electron device manufacturing chamber as claimed in claim 1 is characterized in that, first side plate comprises cylindrical circular substantially sidewall, and has a plurality of flat surfaces that form on sidewall.
24, electron device manufacturing chamber as claimed in claim 23 is characterized in that, first side plate comprises two planes, and each all has opening, and its size allows substrate to pass through.
25, electron device manufacturing chamber as claimed in claim 23 is characterized in that, first side plate comprises at least one laminated structure, is suitable for reducing the moving of sidewall of first side plate.
26, electron device manufacturing chamber as claimed in claim 25 is characterized in that, first side plate comprises a plurality of laminated structures, is suitable for reducing the moving of sidewall of first side plate.
27, electron device manufacturing chamber as claimed in claim 1 is characterized in that, second side plate comprises cylindrical circular substantially sidewall, and has a plurality of flat surfaces that form on sidewall.
28, electron device manufacturing chamber as claimed in claim 1 is characterized in that, further comprises lid, and this lid is suitable for covering median plate at least.
29, electron device manufacturing chamber as claimed in claim 28 is characterized in that, this lid comprises a flat and a plurality of bar, is suitable for reducing flat moving in vertical direction.
30, electron device manufacturing chamber as claimed in claim 29 is characterized in that, flat has 0.75 inch to 1.0 inches or littler thickness.
31, electron device manufacturing chamber as claimed in claim 29 is characterized in that, this lid comprises at least one opening, and this opening is suitable for carrying out access at the interior zone of many plates chamber, and need not remove this lid.
32, electron device manufacturing chamber as claimed in claim 31 is characterized in that, this lid comprises at least two openings, and each all is suitable for carrying out access at the interior zone of many plates chamber, and need not remove this lid.
33, a kind of electron device manufacturing chamber is characterized in that, comprises median plate, and this many plates chamber has:
First open side;
Second open side, relative with first open side;
First plane between first open side and second open side, is fit to be connected with the chamber, and has the opening that allows substrate to pass through; And
Second plane, relative with first plane, between first open side and second open side, this second plane is fit to be connected with the chamber, and has the opening of the vertical stacking that at least two permission substrates pass through,
First side plate is fit to be connected with first open side of median plate, and has at least the first plane, and the size of its opening allows substrate to pass through; And
Second side plate is fit to be connected with second open side of median plate, and has at least the first plane, and the size of its opening allows substrate to pass through;
Wherein, when first side plate, second side plate and median plate linked together, first opening on the opening on the opening on first plane of first side plate, first plane of second side plate and second plane of median plate was positioned at sustained height substantially.
34, electron device manufacturing chamber as claimed in claim 33 is characterized in that, the opening on the opening on first plane of median plate and second plane of median plate is positioned at sustained height substantially.
35, electron device manufacturing chamber as claimed in claim 33 is characterized in that, when median plate, first side plate and second side plate link together, constitutes cylindrical circular substantially inner chamber region.
36, electron device manufacturing chamber as claimed in claim 33 is characterized in that, median plate comprises the bottom with hemisphere portion.
37, electron device manufacturing chamber as claimed in claim 36 is characterized in that, hemisphere portion is fit to be connected with the vacuum automatic control device.
38, electron device manufacturing chamber as claimed in claim 36 is characterized in that, hemisphere portion comprises at least one sheet strutting piece, and this sheet strutting piece is suitable for reducing hemisphere portion moving in vertical direction.
39, electron device manufacturing chamber as claimed in claim 36 is characterized in that, the bottom of median plate comprises flat.
40, electron device manufacturing chamber as claimed in claim 39 is characterized in that, flat has first thickness, and hemisphere portion has second thickness less than first thickness.
41, electron device manufacturing chamber as claimed in claim 1 is characterized in that, comprising:
The electron device manufacturing chamber strutting piece has one or more slide mechanisms; And
Electron device manufacturing chamber links to each other with one or more slide mechanisms;
Wherein, one or more slide mechanisms are admitted the expansion of electron device manufacturing chamber, and the prevention electron device manufacturing chamber shifts out the position on the electron device manufacturing chamber strutting piece.
42, electron device manufacturing chamber as claimed in claim 1 is characterized in that, one or more slide mechanisms are admitted the expansion of electron device manufacturing chamber by compression.
43, electron device manufacturing chamber as claimed in claim 1 is characterized in that, comprising:
First plate; And
At least second plate that links to each other with first plate, thus constitute many plates electron device manufacturing chamber;
Wherein, at least one of the size conforms land of each plate and air transportation regulation; And
The overall dimension of many plates electron device manufacturing chamber does not meet at least one of land and air transportation regulation.
44, electron device manufacturing chamber as claimed in claim 1 is characterized in that, further comprises:
The O-ring is between first plate and second plate;
The device that first plate is linked to each other with at least the second plate.
45, electron device manufacturing chamber as claimed in claim 1 is characterized in that, second plate is connected with first plate level.
46, electron device manufacturing chamber as claimed in claim 1 is characterized in that, second plate is connected with first plate is vertical.
47, electron device manufacturing chamber as claimed in claim 1 is characterized in that, comprises base, and this base comprises:
One or more support components; And
One or more slide mechanisms are suitable for:
The expansion that links to each other and admit electron device manufacturing chamber with electron device manufacturing chamber,
Thereby the prevention electron device manufacturing chamber shifts out the position on the base.
48, electron device manufacturing chamber as claimed in claim 1 is characterized in that, one or more slide mechanisms also are further adapted for the expansion of response electron device manufacturing chamber and compress.
49, a kind of electron device manufacturing chamber is characterized in that, comprising:
Median plate, the bottom that has first side, second side and have hemisphere portion;
First side plate is fit to be connected with first side of median plate; And
Second side plate is fit to be connected with second side of median plate.
50, electron device manufacturing chamber as claimed in claim 49 is characterized in that, hemisphere portion is suitable for holding the vacuum automatic control device.
51, electron device manufacturing chamber as claimed in claim 49 is characterized in that, hemisphere portion comprises at least one sheet strutting piece, and this sheet strutting piece is suitable for reducing hemisphere portion moving in vertical direction.
52, electron device manufacturing chamber as claimed in claim 51 is characterized in that, hemisphere portion comprises a plurality of sheet strutting pieces, and each sheet strutting piece all is suitable for reducing hemisphere portion moving in vertical direction.
53, electron device manufacturing chamber as claimed in claim 49 is characterized in that, the bottom of median plate comprises flat.
54, electron device manufacturing chamber as claimed in claim 53 is characterized in that, flat has first thickness, and hemisphere portion has second thickness less than first thickness.
55, electron device manufacturing chamber as claimed in claim 54 is characterized in that, first thickness is 0.75 inch to 1.0 inches or littler, and second thickness is 0.375 inch or littler.
56, a kind of electron device manufacturing chamber is characterized in that, comprising:
Median plate has the bottom that first side, second side and have hemisphere portion and flat, and wherein, flat has first thickness, and hemisphere portion has second thickness less than first thickness;
First side plate is fit to be connected with first side of median plate; And
Second side plate is fit to be connected with second side of median plate.
57, electron device manufacturing chamber as claimed in claim 56 is characterized in that, first thickness is 0.75 inch to 1.0 inches or littler, and second thickness is 0.375 inch or littler.
58, a kind of electron device manufacturing chamber is characterized in that, comprising:
Median plate has:
First side;
Second side;
First plane comprises at least one opening, and its size allows substrate to pass through; And
Second plane comprises at least three openings, and the size of each opening all allows substrate to pass through;
First side plate is fit to be connected with first side of median plate; And
Second side plate is fit to be connected with second side of median plate.
59, a kind of electron device manufacturing chamber is characterized in that, comprising:
Median plate has first side and second side;
First side plate is fit to be connected with first side of median plate; And
Second side plate is fit to be connected with second side of median plate;
Wherein, first side of median plate comprises at least one first recess, and this recess is suitable for allowing substrate to rotate in many plates chamber, and is sent to the chamber that links to each other with first side plate of many plates chamber from many plates chamber.
60, electron device manufacturing chamber as claimed in claim 59, it is characterized in that, second side of median plate comprises at least one first recess, and this recess is suitable for allowing substrate to rotate in many plates chamber, and is sent to the chamber that links to each other with second side plate of many plates chamber from many plates chamber.
61, a kind of electron device manufacturing chamber is characterized in that, comprising:
Median plate has first side and second side;
First side plate is fit to be connected with first side of median plate, and wherein, first side plate comprises at least one laminated structure, and this laminated structure is suitable for reducing sidewall mobile of first side plate; And
Second side plate is fit to be connected with second side of median plate.
62, electron device manufacturing chamber as claimed in claim 61 is characterized in that, second side plate comprises at least one laminated structure, is suitable for reducing the moving of sidewall of second side plate.
63, a kind of electron device manufacturing chamber is characterized in that, comprising:
Median plate has first side and second side;
First side plate is fit to be connected with first side of median plate, and wherein, first side plate comprises at least one supporting construction, is suitable for reducing sidewall mobile of first side plate; And
Second side plate is fit to be connected with second side of median plate, and wherein, second side plate comprises at least one supporting construction, is suitable for reducing sidewall mobile of second side plate;
Wherein, when median plate, first side plate and second side plate link together, form cylindrical circular substantially inner chamber region.
64, a kind of electron device manufacturing chamber is characterized in that, comprising:
Median plate has first side and second side;
First side plate is fit to be connected with first side of median plate;
Second side plate is fit to be connected with second side of median plate; And
Suitable covering is the lid of median plate at least, and wherein, this lid comprises a flat and a plurality of support component, is suitable for reducing flat moving in vertical direction.
As the described electron device manufacturing chamber of claim 64, it is characterized in that 65, this lid comprises at least one opening, be suitable for carrying out access, and need do not remove this lid at the interior zone of many plates chamber.
66, a kind of electron device manufacturing chamber is characterized in that, comprising:
Median plate has first side and second side;
First side plate is fit to be connected with first side of median plate;
Second side plate is fit to be connected with second side of median plate; And
Suitable covering is the lid of median plate at least, and wherein, this lid comprises at least one opening, is suitable for carrying out access at the interior zone of many plates chamber, and need remove this lid.
67, a kind of electron device manufacturing chamber is characterized in that, comprising:
The unit, this unit has:
First side plate of many plates chamber;
Second side plate of many plates chamber, wherein, first and second side plates are fit to be connected with median plate, to form many plates chamber;
First bedplate links to each other with first side plate; And
Second bedplate links to each other with second side plate;
Wherein, at least one of the size conforms land of this unit and air transportation regulation.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US57690204P | 2004-06-02 | 2004-06-02 | |
| US60/576,902 | 2004-06-02 | ||
| US60/587,109 | 2004-07-12 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2888643Y true CN2888643Y (en) | 2007-04-11 |
Family
ID=36742904
Family Applications (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200520011895 Expired - Lifetime CN2888643Y (en) | 2004-06-02 | 2005-06-01 | Manufacturing room for electronic device |
| CN2007101063474A Active CN101071762B (en) | 2004-06-02 | 2005-06-01 | Electronic device manufacturing device and device for supporting the electronic device manufacturing chamber |
| CN200510103895.2A Active CN1767147B (en) | 2004-06-02 | 2005-06-01 | Electron device manufacturing chamber and forming method thereof |
Family Applications After (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2007101063474A Active CN101071762B (en) | 2004-06-02 | 2005-06-01 | Electronic device manufacturing device and device for supporting the electronic device manufacturing chamber |
| CN200510103895.2A Active CN1767147B (en) | 2004-06-02 | 2005-06-01 | Electron device manufacturing chamber and forming method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (3) | CN2888643Y (en) |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6216328B1 (en) * | 1996-07-09 | 2001-04-17 | Lam Research Corporation | Transport chamber and method for making same |
| US6045620A (en) * | 1997-07-11 | 2000-04-04 | Applied Materials, Inc. | Two-piece slit valve insert for vacuum processing system |
| JP4253107B2 (en) * | 2000-08-24 | 2009-04-08 | キヤノンアネルバ株式会社 | Substrate processing apparatus and expansion method thereof |
-
2005
- 2005-06-01 CN CN 200520011895 patent/CN2888643Y/en not_active Expired - Lifetime
- 2005-06-01 CN CN2007101063474A patent/CN101071762B/en active Active
- 2005-06-01 CN CN200510103895.2A patent/CN1767147B/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN1767147A (en) | 2006-05-03 |
| CN101071762A (en) | 2007-11-14 |
| CN1767147B (en) | 2015-08-19 |
| CN101071762B (en) | 2010-06-02 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee | ||
| CP01 | Change in the name or title of a patent holder |
Address after: American California Patentee after: Applied Materials Inc. Address before: American California Patentee before: Applied Materials Inc. |
|
| C17 | Cessation of patent right | ||
| CX01 | Expiry of patent term |
Expiration termination date: 20150601 Granted publication date: 20070411 |