CN2886591Y - Bottom extracting type wafer delivering device in auto wafer tester - Google Patents
Bottom extracting type wafer delivering device in auto wafer tester Download PDFInfo
- Publication number
- CN2886591Y CN2886591Y CN 200620102016 CN200620102016U CN2886591Y CN 2886591 Y CN2886591 Y CN 2886591Y CN 200620102016 CN200620102016 CN 200620102016 CN 200620102016 U CN200620102016 U CN 200620102016U CN 2886591 Y CN2886591 Y CN 2886591Y
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- CN
- China
- Prior art keywords
- wafer cassette
- wafer
- guide rail
- chip
- advance mechanism
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- Expired - Lifetime
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Abstract
The utility model relates to a bottom extracted chip-feeding device in an automatic chip-testing machine, a fixed guide rail is mounted on a seat body, a chip case seat connected with driving device engages with the guide rail to compose a linear reciprocal movement structure, a gap that is slightly wider than the thickness of the chip is remained on the right bottom end of the chip case, a chip sucking hole is provided on the right sliding end of the chip case on the guide rail, which is communicated with a vacuum loop. The utility model resolves the sorting and delivering difficulty of the thin and bigger area chip in the traditional vibration feeder, and prevents the quartz chip from scratching the inner wall of the vibrating disk, and also prevents the surface of the chip being contaminated in the vibration feeding process.
Description
Technical field:
The utility model relates to the wafer tester in the electronics industry, particularly a kind of bottom pumping type film advance mechanism that can push wafer to be measured automatically.
Background technology:
Quartz wafer application quantity in electronic industry is very big, needs wafer to fetch and deliver one by one in process of production and carries out multiple parameter testing and grade separation.Because the wafer of test is very thin, quantity is many, manually fetches and delivers wafer and is not allowed.In the prior art, disclosed as Chinese patent application 03129298.8, by feed appliance wafer is arranged in order and to be delivered to piece mouth, by robot device one by one with wafer holder and test.Feed appliance commonly used at present is circle or straight-line oscillation loader, and the bigger wafer of area is 0.06mm as thickness for approaching, and profile is greater than the wafer of 20 * 20mm, and vibrator feeder is just carried very difficulty, causes the wafer breakage easily; The hardness height of quartz wafer in addition easily in the process of vibration feeding, scratches the inwall of vibrating disk and causes the pollution of wafer surface, and this can cause the distortion of some test parameters in the measuring process of wafer.
Summary of the invention:
The purpose of this utility model provides the bottom pumping type film advance mechanism in the wafer automatic test machine of a kind of safe, fast automatic propelling movement wafer to be measured
Bottom pumping type film advance mechanism in the utility model wafer automatic test machine, comprise pedestal, wafer cassette, pedestal is equipped with fixing guide rail, the wafer cassette base that is connected with drive unit cooperates formation linear reciprocation operating structure with above-mentioned guide rail, the slit that width is slightly larger than wafer thickness is left in the bottom, right side of wafer cassette; Right lateral dead-centre position in the wafer cassette of above-mentioned guide rail has the suction film perforation, inhales film perforation and is communicated with vacuum loop.
The cross-sectional area of above-mentioned wafer cassette is an adjustable structure.Such as, wafer cassette is made up of four side plate amalgamations all around, wherein forward and backward, three blocks of side plates in a left side are cooperated with slotted hole by screw that to constitute level adjustable, right plate by screw cooperate with slotted hole constitute vertical adjustable.
Above-mentioned drive unit is made of cylinder, and the shifting block that is connected with cylinder piston rod is fixedlyed connected with the wafer cassette base.This shifting block is loaded on the top board that is fixed on the cylinder piston rod top, and two sides respectively are provided with stroke regulating screw about top board.
Above-mentioned guide rail cross section is " protruding " shape, and the wafer cassette base end face is slidingly matched with the step surface of " protruding " shape guide rail, and the wafer cassette bottom is slidingly matched with the end face of " protruding " shape guide rail.Perhaps, guide rail is made up of closed slide up and down, wafer cassette base end face and lower guideway are slidingly matched, wafer cassette bottom upper rail is slidingly matched, upper rail is fixed on the crossbeam, have combination at the right lateral journey dead-centre position of the wafer cassette of upper rail and inhale film perforation, combination is inhaled film perforation and is communicated with vacuum loop by the through hole that runs through crossbeam up and down.
The utility model is loaded on stack of wafers to be measured in the adjustable wafer cassette of cross-sectional area, when the wafer cassette right-to-left moves, a wafer of the bottom is drawn out of from the slit of the bottom, right side of casket by suction in the wafer cassette, and pipette by slice getting device by programming controller control, work efficiency obviously improves; Solve traditional vibrator feeder simultaneously to the wafer ordering thin, that area is bigger, a difficult problem of carrying, also avoided quartz wafer in the process of vibration feeding, to scratch the contaminated problem of wafer surface that the vibrating disk inwall is brought.
Description of drawings:
Fig. 1 is the utility model embodiment front view.
Fig. 2 is Fig. 1 amplification plan view.
Embodiment:
With reference to accompanying drawing.Crossbeam 12 is installed on the pedestal 24, and lower guideway 14 and upper rail 11 are fixed in crossbeam 12 respectively up and down, and wafer cassette base 15 bottom surfaces and lower guideway 14 are slidingly matched, and wafer cassette bottom and upper rail 11 are slidingly matched.Upper rail 11 has vertical groove 11.1, has combination at the right lateral journey dead-centre position of the wafer cassette of upper rail 11 and inhales film perforation 23, and combination is inhaled film perforation 23 and is communicated with the tracheae vacuum adapter 13 of vacuum loop by the through hole that runs through crossbeam 12 up and down.
The wafer cassette cross-sectional sizes can be adjusted, so that adapt to the wafer sort of different specification size.Wafer cassette is made up of four side plate 1,4,2,5 amalgamations all around, wherein forward and backward, three blocks of side plates 1,4,2 in a left side are cooperated with slotted hole on the riser 6 that is fixed in base 15 by screw 7,3 and constitute that level is adjustable fixes, left plate 2 bottoms are made and are omited the shaft-like of length and be inserted in the groove 11.1 of upper rail 11 slide-and-guide of formation upper rail 11 and wafer cassette; Right plate 5 by screw 8 cooperate with the slotted hole that is fixed in base 15 risers constitute vertical adjustable fixing, width with the slice slit 9 of adjusting right plate 5 bottoms, constitute at interval between the upper surface of this slit by edge, 5 ends of right plate and upper rail 11, stitch wide should be greater than the individual layer wafer thickness less than double-deck wafer thickness, the 1.3-1.5 that is generally single-sheet thickness doubly makes only to allow a wafer 10 to be drawn out of at every turn.
On base 15 anterior right sides cylinder 16 is installed, top board 18 is equipped with on cylinder piston rod 17 tops, shifting block 22 is fixed on top board 18 left sides, and is stuck in the jaw 19 that base 15 stretches out, and makes cylinder piston rod 17 drive bases 15 and wafer cassette is made reciprocal linear slide along lower guideway 14 and upper rail 11.Two sides respectively are provided with left and right sides stroke stop point set screw 20,21 about top board 18, to limit the sliding scale of wafer cassette.
The course of work: move right when putting in place when cylinder 16 drives bases 15, inhale film perforation 23 by the vacuum combination of vacuum tube joint 13 on upper rail 11 vacuum is provided, vacuum will remain to cylinder piston rod 17 wafer cassette will be pushed away toward left side stop, vacuum is eliminated then, and vacuum and cylinder can be controlled by CPU control electromagnetic valve, vacuum loop.Because wafer surface is smooth, has adhesion between each stacked wafer, so wafer cassette wafer in the operational process of the left side can not break away from voluntarily, this process will make bottommost one wafer 10 in the wafer cassette stay vacuum combination on the upper rail 11 to inhale the top of film perforation 23 and held, other its wafers are then taken back left by wafer cassette, after treating that this wafer is taken away by the suction nozzle of the slice getting device in the wafer automatic test machine, can control this device by CPU and repeat this process, go round and begin again, realize sending automatically continuously the purpose of a wafer.
Claims (8)
1, the bottom pumping type film advance mechanism in a kind of wafer automatic test machine, it is characterized in that pedestal (24) is equipped with fixing guide rail, the wafer cassette base (15) that is connected with drive unit cooperates formation linear reciprocation operating structure with above-mentioned guide rail, the slit (9) that width is slightly larger than wafer thickness is left in the bottom, right side of wafer cassette; Have at the right lateral dead-centre position of the wafer cassette of above-mentioned guide rail and to inhale film perforation (23), inhale film perforation (23) and be communicated with vacuum loop.
2, bottom pumping type film advance mechanism according to claim 1, the cross-sectional area that it is characterized in that wafer cassette is an adjustable structure.
3, bottom pumping type film advance mechanism according to claim 2, it is characterized in that wafer cassette is made up of four side plate amalgamations all around, wherein forward and backward a, left side (1,4,2) three blocks of side plates are cooperated with slotted hole by screw that to constitute level adjustable, right plate (5) by screw cooperate with slotted hole constitute vertical adjustable.
4, bottom pumping type film advance mechanism according to claim 1 is characterized in that drive unit is made of cylinder, and the shifting block (22) that is connected with cylinder piston rod (17) is fixedlyed connected with wafer cassette base (15).
5, according to the described arbitrary bottom pumping type film advance mechanism of claim 1-4, it is characterized in that described guide rail cross section is " protruding " shape, the wafer cassette base end face is slidingly matched with the step surface of " protruding " shape guide rail, and the wafer cassette bottom is slidingly matched with the end face of " protruding " shape guide rail.
6, according to the described arbitrary bottom pumping type film advance mechanism of claim 1-4, it is characterized in that described guide rail is made up of closed slide up and down, wafer cassette base (15) bottom surface and lower guideway (14) are slidingly matched, and wafer cassette bottom and upper rail (11) are slidingly matched.
7, bottom pumping type film advance mechanism according to claim 6, it is characterized in that upper rail (11) is fixed on the crossbeam (12), have combination at the right lateral journey dead-centre position of the wafer cassette of upper rail (11) and inhale film perforation (23), combination is inhaled film perforation and is communicated with vacuum loop by the through hole that runs through crossbeam (12) up and down.
8, bottom pumping type film advance mechanism according to claim 4 is characterized in that shifting block (22) is loaded on the top board (18) that is fixed on cylinder piston rod (17) top, and two sides respectively are provided with stroke regulating screw (20,21) about top board (18).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200620102016 CN2886591Y (en) | 2006-03-27 | 2006-03-27 | Bottom extracting type wafer delivering device in auto wafer tester |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200620102016 CN2886591Y (en) | 2006-03-27 | 2006-03-27 | Bottom extracting type wafer delivering device in auto wafer tester |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2886591Y true CN2886591Y (en) | 2007-04-04 |
Family
ID=37961680
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200620102016 Expired - Lifetime CN2886591Y (en) | 2006-03-27 | 2006-03-27 | Bottom extracting type wafer delivering device in auto wafer tester |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2886591Y (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104267256A (en) * | 2014-09-19 | 2015-01-07 | 南京中电熊猫晶体科技有限公司 | Device and method for testing high-fundamental-frequency MESA wafer |
| CN105083965A (en) * | 2015-08-01 | 2015-11-25 | 安徽省蚌埠华益导电膜玻璃有限公司 | Vacuum coating and translating device for ultra-thin glass |
-
2006
- 2006-03-27 CN CN 200620102016 patent/CN2886591Y/en not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104267256A (en) * | 2014-09-19 | 2015-01-07 | 南京中电熊猫晶体科技有限公司 | Device and method for testing high-fundamental-frequency MESA wafer |
| CN104267256B (en) * | 2014-09-19 | 2016-11-16 | 南京中电熊猫晶体科技有限公司 | It is applicable to device and the method for testing of high fundamental frequency MESA wafer sort |
| CN105083965A (en) * | 2015-08-01 | 2015-11-25 | 安徽省蚌埠华益导电膜玻璃有限公司 | Vacuum coating and translating device for ultra-thin glass |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| EE01 | Entry into force of recordation of patent licensing contract |
Assignee: Zhejiang Taizhou Bo Xin Electronics Co., Ltd. Assignor: Zhou Wei Contract record no.: 2010330001903 Denomination of utility model: Bottom extracting type wafer delivering device in auto wafer tester Granted publication date: 20070404 License type: Exclusive License Record date: 20100920 |
|
| EM01 | Change of recordation of patent licensing contract |
Change date: 20100929 Contract record no.: 2010330001903 Assignee after: Taizhou boxn Electronics Co. Ltd. Assignee before: Zhejiang Taizhou Bo Xin Electronics Co., Ltd. |
|
| CX01 | Expiry of patent term |
Granted publication date: 20070404 |
|
| EXPY | Termination of patent right or utility model |