CN2877939Y - Lead-free welding rework system - Google Patents
Lead-free welding rework system Download PDFInfo
- Publication number
- CN2877939Y CN2877939Y CN 200620003232 CN200620003232U CN2877939Y CN 2877939 Y CN2877939 Y CN 2877939Y CN 200620003232 CN200620003232 CN 200620003232 CN 200620003232 U CN200620003232 U CN 200620003232U CN 2877939 Y CN2877939 Y CN 2877939Y
- Authority
- CN
- China
- Prior art keywords
- printed circuit
- pcb
- circuit board
- free solder
- controller
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- Molten Solder (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
A lead-free welding rework system comprises a control device, a tinning pot which is electrically connected with the control device, a jet nozzle, at least one heating arrangement for heating a plated printed circuit which is electrically connected with the control device, a temperature sensor assembly connected with the plated printed circuit electrically for measuring the temperature of the plated printed circuit, and a monitor which is electrically connected with the control device.
Description
Technical field
The utility model is about a kind of pb-free solder rework system, particularly about a kind of scolding tin filling rate of Pb-free solder in the plating open-work and pb-free solder rework system of protection printed circuit board arrangement improved.
Background technology
In general, when electronic building brick combines with a printed circuit board (PCB), normally earlier the pin of electronic building brick is arranged in the open-work corresponding on the printed circuit board (PCB), then again the scolding tin (solder) of fusion is filled in the open-work, so that the pin of electronic building brick can combine with printed circuit board (PCB).
Yet, when electronic building brick has damaged and need to change or when doing over again (rework), normally will contain the printed circuit board (PCB) that damages electronic building brick and place on the molten tin bath (solder pot) that contains fusion scolding tin, and by high-temperature fusion scolding tin that molten tin bath sprayed with the melts soldering tin in the open-work.Then, the electronic building brick that damages is removed on printed circuit board (PCB), and another good electron assembly is inserted on the printed circuit board (PCB), that is, the pin of electronic building brick is inserted in the open-work of printed circuit board (PCB).At last, printed circuit board (PCB) is located away from molten tin bath, can finishes the manufacture craft of doing over again.
It should be noted that and in scolding tin, contain under the plumbous situation that its fusing point can lower (about 183 ℃), so after in the pin insertion open-work of another good electrical sub-component, can be filled in easily in the whole open-work by the fusion scolding tin that molten tin bath sprayed.
Yet in response to the environmental protection demand, present scolding tin does not contain plumbous composition usually.Under the lead-free situation, as Pb-free solder SAC (Sn/Ag/Cu) alloy, its fusing point is understood higher (about 217-219 ℃), thereby can cause some problems in the manufacture craft of doing over again in scolding tin.More detailed; because the fusing point of Pb-free solder is higher; so its regular meeting promptly solidifies before not filling up whole open-work fully, thereby can't meet the regulation (being that scolding tin need be filled open-work more than 75%) of open-work scolding tin filling rate in the IPC standard (through hole solder fill).Therefore, be the time that prolongs molten tin bath ejection fusion Pb-free solder at the tradition of the Pb-free solder way of doing over again, reduce and solidify so that the fusion Pb-free solder is difficult for Yin Wendu, and then the fusion Pb-free solder is filled in the whole open-work.
Yet the above-mentioned tradition way of doing over again can have some shortcomings.At first, plating open-work (plated through hole at printed circuit board (PCB), PTH) all can be coated with one deck copper film on the wall, as interconnected pipeline between each layer circuit in the printed circuit board (PCB), so as to circuit layers different in the conducting printed circuit board (PCB), but the time that prolongs molten tin bath ejection fusion Pb-free solder can cause the fusion Pb-free solder that the whole fusion of copper film is fallen, thereby the conducting structure that destroys printed circuit board (PCB) causes and open circuit, even also can damage the internal structure of printed circuit board (PCB).Moreover the time that prolongs molten tin bath ejection fusion Pb-free solder means the existence of continuous high temperature, and this causes the printed circuit board (PCB) distortion (warp) that is distorted through regular meeting.
The purpose of this utility model just provides a kind of pb-free solder rework system that can overcome above shortcoming.
The utility model content
For solving the above problems, the utility model provides a kind of pb-free solder rework system, and it comprises: a controller; One molten tin bath is electrically connected at this controller, and has a nozzle; At least one heater for example is a hot gas scolding tin remover, with respect to this nozzle and be electrically connected at this controller, is in order to heat a printed circuit board (PCB); One temperature sensing component is connected in this printed circuit board (PCB) to measure the temperature of this printed circuit board (PCB), and is electrically connected at this controller; And a monitor, be electrically connected at this controller.
The manufacture craft of doing over again of carrying out the printed circuit board (PCB) assembly with pb-free solder rework system disclosed in the utility model can have following advantage:
(1) since heater or hot gas scolding tin remover can heat printed circuit board (PCB) in advance, so can prevent fusion Pb-free solder i.e. coagulation problem before not filling up whole open-work fully.
(2) do over again the time (be nozzle running time) via setting, can prevent that the copper film on the wall of open-work of printed circuit board (PCB) from dissolving because of Long contact time fusion Pb-free solder, thereby can guarantee that the conducting structure of printed circuit intralamellar part is not damaged.
(3) do over again the time via setting, can avoid printed circuit board (PCB) Long contact time fusion Pb-free solder, thereby can prevent the printed circuit board (PCB) distortion that is distorted.
For above-mentioned purpose of the present utility model, feature and advantage can be become apparent, preferred embodiment cited below particularly and conjunction with figs. elaborate.
Description of drawings
Fig. 1 is the floor map that shows a kind of pb-free solder rework system of the present utility model;
Fig. 2 is the floor map that shows another kind of pb-free solder rework system of the present utility model.
The primary clustering symbol description
100,100 '～pb-free solder rework system;
110～controller;
120～molten tin bath;
121～nozzle;
130～heater;
130 '～hot gas scolding tin remover;
140～temperature sensing component;
150～monitor;
200～printed circuit board (PCB) assembly;
201～printed circuit board (PCB);
201a～open-work;
202～the first electronic building bricks;
202a～first pin;
The specific embodiment
Existing conjunction with figs. illustrates preferred embodiment of the present utility model.
Fig. 1 is the floor map that shows a kind of pb-free solder rework system 100 of the present utility model.As shown in Figure 1, pb-free solder rework system 100 mainly includes a controller 110, a molten tin bath 120, a plurality of heater 130, a temperature sensing component 140 and a monitor 150.
Molten tin bath 120 is to be electrically connected at controller 110, and has a nozzle 121.In addition, in molten tin bath 120, be loaded with fusion Pb-free solder (not shown).
Heater 130 also is to be electrically connected at controller 110, and heater 130 can be the form of radiant type or convection type.Specifically, the quantity of the heater 130 and position is set can not need specifies.In addition, temperature sensing component 140 and monitor 150 also are to be electrically connected at controller 110.
Fig. 2 is the floor map that shows another kind of pb-free solder rework system 100 ' of the present utility model.
Among pb-free solder rework system 100 ', the assembly structure identical with pb-free solder rework system 100 all indicated with identical symbol.Pb-free solder rework system 100 ' mainly includes a controller 110, a molten tin bath 120, a hot gas scolding tin remover 130 ', a temperature sensing component 140 and a monitor 150.
As shown in Figure 2, hot gas scolding tin remover 130 ' is with respect to nozzle 121.Hot gas scolding tin remover 130 ' purposes originally is to be used to provide thermal current, and unnecessary scolding tin will blow off on the printed circuit board (PCB) assembly after the welding finishing.But in the application of pb-free solder rework system 100 ', hot gas scolding tin remover 130 ' also can be used as heater and is used, and is driven by controller 110.
Below will illustrate how to use pb-free solder rework system 100 and pb-free solder rework system 100 ' in the lump.
At first, provide to have nozzle 121 and the inner molten tin bath 120 that then fills the fusion Pb-free solder, and the printed circuit board (PCB) assembly 200 that needs are done over again is positioned on the molten tin bath 120.Wherein printed circuit board (PCB) assembly 200 comprises printed circuit board (PCB) 201 and first electronic building brick 202 that need change, has open-work 201a on the printed circuit board (PCB) 201,202 of first electronic building bricks have the first pin 202a, and among the first pin 202a is welded in open-work 201a by Pb-free solder, and the open-work 201a on the printed circuit board (PCB) assembly 200 and the first pin 202a are positioned on the nozzle 121.
Controller 110 is to be used for setting institute's desire carries out do over again temperature and doing over again the time, and drive heaters (130 or 130 ') with controller 110 and come printed circuit board (PCB) 201 is heated, and its surface temperature monitored the temperature of doing over again that printed circuit board (PCB) 201 is reached set.
Controller 110 can output signals starts the nozzle 121 on the molten tin bath 120, and the fusion Pb-free solders in the molten tin bath 121 are incident upon the open-work 201a place of printed circuit board (PCB) 201, and the Pb-free solder that is arranged in open-work 201a is originally melted.First electronic building brick 202 that then will change is by removing on the printed circuit board (PCB) 201, and second electronic building brick that will replace usefulness is installed on the printed circuit board (PCB) 201.A plurality of second pins that also are about to second electronic building brick are inserted into respectively among a plurality of open-work 201a on the printed circuit board (PCB) 201.
This moment, the nozzle 121 of molten tin bath 120 still continued the fusion Pb-free solder is injected among the open-work 201a of printed circuit board (PCB) 201, continued running until nozzle 121 and reached doing over again the time of setting, and did over again the time running that controller 110 will shut-off nozzle 121 in case arrive.Printed circuit board (PCB) assembly after will doing over again at last can be finished the manufacture craft that pb-free solder is done over again by removing on the molten tin bath 120.
Though the utility model is disclosed in preferred embodiment; right its is not in order to limit the utility model; any insider; in not breaking away from spirit and scope of the present utility model; when doing a little change and retouching, therefore protection domain of the present utility model is as the criterion when looking claims person of defining.
Claims (3)
1. a pb-free solder rework system is characterized in that, comprising:
One controller is done over again the time in order to set the temperature and of doing over again;
One molten tin bath is electrically connected at this controller, and has a nozzle, and wherein, this molten tin bath is loaded with the fusion Pb-free solder;
At least one heater is electrically connected at this controller, reaches this temperature of doing over again in order to heat a printed circuit board (PCB); And
One temperature sensing component is connected in this printed circuit board (PCB), and is electrically connected at this controller,
Wherein, when this printed circuit board (PCB) reached this and does over again temperature, this controller made this nozzle continue running to reach this and do over again the time.
2. pb-free solder rework system according to claim 1, wherein, this heater is a hot gas scolding tin remover, and this hot gas scolding tin remover is with respect to this nozzle.
3. pb-free solder rework system according to claim 1 also comprises a monitor, is electrically connected at this controller.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200620003232 CN2877939Y (en) | 2006-03-01 | 2006-03-01 | Lead-free welding rework system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200620003232 CN2877939Y (en) | 2006-03-01 | 2006-03-01 | Lead-free welding rework system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2877939Y true CN2877939Y (en) | 2007-03-14 |
Family
ID=37860354
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200620003232 Expired - Lifetime CN2877939Y (en) | 2006-03-01 | 2006-03-01 | Lead-free welding rework system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2877939Y (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103386524A (en) * | 2012-05-08 | 2013-11-13 | 光宝电子(广州)有限公司 | Welding method |
| CN110939604A (en) * | 2018-09-21 | 2020-03-31 | 广达电脑股份有限公司 | Electronic device |
-
2006
- 2006-03-01 CN CN 200620003232 patent/CN2877939Y/en not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103386524A (en) * | 2012-05-08 | 2013-11-13 | 光宝电子(广州)有限公司 | Welding method |
| CN110939604A (en) * | 2018-09-21 | 2020-03-31 | 广达电脑股份有限公司 | Electronic device |
| CN110939604B (en) * | 2018-09-21 | 2022-01-14 | 广达电脑股份有限公司 | Electronic device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: GUANGDA COMPUTER CO LTD.; PATENTEE Free format text: FORMER OWNER: GUANGDA COMPUTER CO LTD. Effective date: 20070706 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20070706 Address after: China Taiwan Taoyuan County Co-patentee after: Reach rich (Shanghai) computer company limited Patentee after: Guangda Computer Co., Ltd. Co-patentee after: Reach merit (Shanghai) computer company limited Address before: China Taiwan Taoyuan County Patentee before: Guangda Computer Co., Ltd. |
|
| CX01 | Expiry of patent term |
Granted publication date: 20070314 |
|
| EXPY | Termination of patent right or utility model |