CN2930938Y - Wave soldering equipment - Google Patents
Wave soldering equipment Download PDFInfo
- Publication number
- CN2930938Y CN2930938Y CN 200620003230 CN200620003230U CN2930938Y CN 2930938 Y CN2930938 Y CN 2930938Y CN 200620003230 CN200620003230 CN 200620003230 CN 200620003230 U CN200620003230 U CN 200620003230U CN 2930938 Y CN2930938 Y CN 2930938Y
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- circuit board
- heater
- nozzle
- conveyer belt
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Abstract
A wave welding device comprises a conveyer belt, a tin groove, a first heater, a second heater and a third heater. The conveyer belt is used to bear and convey a circuit board. The tin groove is arranged under the conveyer belt and provided with a disturbed flow nozzle and an advection nozzle, and the disturbed flow nozzle and the advection nozzle are separately provided with a specific distance between. The first heater is arranged under the conveyer belt and adjoins the tin groove, which is used to heat the lower surface of the circuit board. The second heater is arranged on the conveyer belt and relative to the first heater, which is used to heat the upper surface of the circuit board. The third heater is arranged on the conveyer belt and relative to the disturbed flow nozzle and the advection nozzle of the tin groove, which is used to heat the upper surface of the circuit board.
Description
Technical field
The utility model is about a kind of wave welding device, particularly about a kind of wave welding device that is applicable to unleaded wave soldering manufacture craft.
Background technology
Present wave soldering manufacture craft (wave solder process) mainly is that the scolding tin (solder) with fusion is filled in the open-work on the printed circuit board (PCB) (PCB), can combine with printed circuit board (PCB) so that be arranged in the pin of the electronic building brick in the open-work.
In general, the wave soldering manufacture craft mainly is to utilize a flow-disturbing ripple (turbulent wave) that the scolding tin (solder) of fusion in the tin stove is injected the open-work of the printed circuit board (PCB) that contains the electronic building brick pin from the lower surface of printed circuit board (PCB) earlier, so that scolding tin can completely be filled in the whole open-work and coat the electronic building brick pin, then utilize an advection ripple (laminar wave) scolding tin of fusion to be incident upon the lower surface of printed circuit board (PCB) again, with the scolding tin eccysis that printed circuit board (PCB) lower surface place is unnecessary, so can avoid causing the short circuit between the electronic building brick pin.
Yet, leaded scolding tin and Pb-free solder in comparison, leaded scolding tin has the characteristic than low melting point and high surfaces tension force, so in the open-work of scolding tin being injected printed circuit board (PCB) with the flow-disturbing ripple time, scolding tin can be filled in the whole open-work easily.In addition, fusing point (about 217～220 ℃) compared to Pb-free solder SAC (Sn/Ag/Cu) alloy, fusing point of leaded scolding tin lower (about 183 ℃) and surface tension are higher, so leaded scolding tin relatively is difficult for condensing at the lower surface of printed circuit board (PCB), therefore leaded scolding tin also relatively is difficult for forming Xi Qiao passing between the electronic building brick pin of open-work, and causes the phenomenon of short circuit.In other words, being incident upon the fusion scolding tin of printed circuit board (PCB) lower surface with the advection ripple can be easily with unnecessary scolding tin eccysis.
Yet in response to the environmental protection demand, present scolding tin does not contain plumbous composition usually.Under the lead-free situation, its fusing point is understood higher (about 217-219 ℃), thereby can cause some problems in the wave soldering manufacture craft in scolding tin.
See also Fig. 1, a traditional wave welding device 1 is made of a conveyer belt 11, a molten tin bath 12, a primary heater 13 and a secondary heater 14.Conveyer belt 11 is to be used for transmitting a printed circuit board (PCB) P.Molten tin bath 12 is the belows that are arranged at conveyer belt 11, and molten tin bath 12 contains the Pb-free solder of fusion.In addition, molten tin bath 12 includes a flow-disturbing nozzle (turbulent nozzle) 12a and an advection nozzle (laminar nozzle) 12b.Primary heater 13 and secondary heater 14 are the sides that are arranged at molten tin bath 12, and are top and the belows that is arranged at conveyer belt 11 respectively.
When printed circuit board (PCB) P transmitted according to the direction shown in the arrow A via conveyer belt 11, printed circuit board (PCB) P can be subjected to the heating of primary heater 13 and secondary heater 14 earlier and surface and lower surface place have a specified temp respectively thereon in advance.When printed circuit board (PCB) P is transferred into the top of molten tin bath 12, flow-disturbing nozzle 12a can with the fusion Pb-free solder in the molten tin bath 12 upwards (direction as shown by arrow B) inject in the open-work (shown in the P1 of Fig. 2) that contains the electronic building brick pin.Then, advection nozzle 12b can be incident upon the lower surface of printed circuit board (PCB) P according to the direction shown in the arrow C with the fusion Pb-free solder in the molten tin bath 12, with Pb-free solder eccysis unnecessary on the lower surface with printed circuit board (PCB) P.
Yet; as shown in Figure 2; because the fusing point (freezing point) of Pb-free solder S is higher; so after flow-disturbing nozzle 12a upwards injects fusion Pb-free solder S among the open-work P1 of printed circuit board (PCB) P; fusion Pb-free solder S regular meeting promptly solidifies before fully upwards not filling up whole open-work P1; thereby do not meet the regulation (being that scolding tin need be filled open-work more than 75%) of open-work scolding tin filling rate in the IPC standard (throug hole solder fill); simultaneously, unnecessary Pb-free solder S can condense in the below of electronic building brick pin E in a large number.Then; when open-work P1 is transferred into advection nozzle 12b top; because the underlaying surface temperature of printed circuit board (PCB) P is not enough or reduced; add factors such as the higher and surface tension of the fusing point (freezing point) of Pb-free solder S is less; so not only can't be with unnecessary Pb-free solder eccysis by the emitted fusion Pb-free solder of advection nozzle 12b; and it is and regular meeting is set in the lower surface of printed circuit board (PCB) P, thereby cause the short circuit phenomenon between electronic building brick pin E.
The utility model content
The purpose of this utility model is that a kind of wave welding device that is applicable to unleaded wave soldering manufacture craft will be provided, and it not only can make Pb-free solder fully be filled in the open-work of printed circuit board (PCB), and can avoid the short circuit phenomenon on the printed circuit board (PCB) to take place effectively.
The utility model adopts as detailed below feature to think basically and solves the above problems.That is to say that the utility model comprises a conveyer belt, is in order to carry and to transmit a circuit board; One molten tin bath is arranged under this conveyer belt, and has a flow-disturbing nozzle and an advection nozzle, and wherein, this flow-disturbing nozzle is to be interval in this advection nozzle with a specific range; One primary heater is arranged under this conveyer belt, and is adjacent to this molten tin bath, in order to heat the lower surface of this circuit board; One secondary heater is arranged on this conveyer belt, and with respect to this primary heater, in order to heat the upper surface of this circuit board; And one the 3rd heater, be arranged on this conveyer belt, and with respect to this flow-disturbing nozzle and this advection nozzle of this molten tin bath, in order to heat the upper surface of this circuit board.
Simultaneously, according to wave welding device of the present utility model, it also comprises one the 4th heater, is arranged under this conveyer belt, and is between this flow-disturbing nozzle and this advection nozzle, in order to heat the lower surface of this circuit board.
In the utility model, the 3rd heater has one first temperature sensing Control Component again, with respect to the upper surface of this circuit board, in order to sensing and control the temperature of the upper surface of this circuit board.
In the utility model, the 4th heater has one second temperature sensing Control Component again, with respect to the lower surface of this circuit board, in order to sensing and control the temperature of the lower surface of this circuit board.
For above-mentioned purpose of the present utility model, feature and advantage can be become apparent, preferred embodiment cited below particularly and conjunction with figs. elaborate.
Description of drawings
Fig. 1 is the schematic side view that shows a traditional wave welding device;
Fig. 2 shows according to the printed circuit board (PCB) that wave welding device produced of Fig. 1 and the welded condition schematic diagram between the electronic building brick pin;
Fig. 3 is the schematic side view that shows wave welding device of the present utility model; And
Fig. 4 shows according to circuit board that wave welding device of the present utility model produced and the welded condition schematic diagram between the electronic building brick pin.
The primary clustering symbol description
1,100～wave welding device;
11,110～conveyer belt;
12,120～molten tin bath;
12a, 121～flow-disturbing nozzle;
12b, 122～advection nozzle;
13,130～primary heater;
14,140～secondary heater;
150～the 3rd heaters;
151～the first temperature sensing Control Components;
160～the 4th heaters;
161～the second temperature sensing Control Components;
E～electronic building brick pin;
P～printed circuit board (PCB);
P1～open-work;
S～Pb-free solder;
A, B, C～arrow.
The specific embodiment
Existing conjunction with figs. illustrates preferred embodiment of the present utility model.
See also Fig. 3, the wave welding device 100 of present embodiment mainly includes a conveyer belt 110, a molten tin bath 120, a primary heater 130, a secondary heater 140, one the 3rd heater 150 and one the 4th heater 160.
Still as shown in Figure 3, molten tin bath 120 is to be arranged under the conveyer belt 110, and is loaded with the fusion Pb-free solder in molten tin bath 120.In addition, molten tin bath 120 has a flow-disturbing nozzle 121 and an advection nozzle 122, and flow-disturbing nozzle 121 is to be interval in advection nozzle 122 with a specific range.
The 3rd heater 150 also is to be arranged on the conveyer belt 110.Specifically, the 3rd heater 150 is that it also can be used to the upper surface of heater circuit plate P with respect to the flow-disturbing nozzle 121 of molten tin bath 120 and advection nozzle 122.In addition, to have one first temperature sensing Control Component, 151, the first temperature sensing Control Components 151 are upper surfaces with respect to circuit board P to the 3rd heater 150.
The 4th heater 160 also is to be arranged under the conveyer belt 110.Specifically, the 4th heater 160 is that it also can be used to the lower surface of heater circuit plate P between flow-disturbing nozzle 121 and advection nozzle 122.In addition, to have one second temperature sensing Control Component, 161, the second temperature sensing Control Components 161 are lower surfaces with respect to circuit board P to the 4th heater 160.
When printed circuit board (PCB) P transmitted according to the direction shown in the arrow A via conveyer belt 110, printed circuit board (PCB) P can be subjected to the preheating of primary heater 130 and secondary heater 140 earlier and have a specified temp respectively earlier at its lower surface and upper surface place.When printed circuit board (PCB) P is transferred into the top of molten tin bath 120; the 3rd heater 150 can heat the upper surface of circuit board P; simultaneously; the upper surface temperature of coming sensing circuit plate P by its first temperature sensing Control Component 151; and control the 3rd heater 150; the upper surface temperature maintenance that makes circuit board P is in a specific range of temperatures; for example; between 120 ℃ and 197 ℃; at this; owing to also can be provided with other electronic building brick usually on the upper surface of circuit board P, and can damage other electronic building brick, so temperature is controlled at below 197 ℃ for fear of too high temperature.On the other hand, the 4th heater 160 also can heat the lower surface of circuit board P, simultaneously, come the underlaying surface temperature of sensing circuit plate P by its second temperature sensing Control Component 161, and control the 4th heater 160, the underlaying surface temperature of circuit board P is maintained more than the specified temp, for example, more than 180 ℃.
As mentioned above, at flow-disturbing nozzle 121 when upwards (direction shown in the arrow B of Fig. 3) injected among the open-work P1 (as shown in Figure 4) that contains electronic building brick pin E (as shown in Figure 4) with the fusion Pb-free solder in the molten tin bath 120, owing to the underlaying surface temperature of circuit board P be by the 4th heater 160 be controlled in more than 180 ℃ with and the upper surface temperature be to be maintained between 120 ℃ and 197 ℃ by the 3rd heater 150, so the fusion Pb-free solder promptly can not solidify because of the low temperature of lower surface on the circuit board P, thereby can upwards be filled in smoothly among the whole open-work P1, shown in the Pb-free solder S of Fig. 4.On the other hand, when advection nozzle 122 then is incident upon the lower surface of printed circuit board (PCB) P with the fusion Pb-free solder in the molten tin bath 120 according to the direction shown in the arrow C of Fig. 3, owing to being still by the 4th heater 160, the underlaying surface temperature of circuit board P is controlled in more than 180 ℃, so being incident upon the fusion Pb-free solder of the lower surface of printed circuit board (PCB) P promptly can not solidify, thereby unnecessary Pb-free solder eccysis on the lower surface with printed circuit board (PCB) P successfully, take place not have short circuit phenomenon between the pin E that guarantees electronic building brick.
In addition, it should be noted that, though the wave welding device of present embodiment is to reach above-mentioned unleaded wave soldering effect with the 3rd heater 150 and the 4th heater 160 simultaneously, wave welding device of the present utility model is not limited to have simultaneously the 3rd heater and the 4th heater.In other words, wave welding device of the present utility model can also optionally only adopt one the 3rd heater or one the 4th heater to reach above-mentioned unleaded wave soldering effect.
Though the utility model is disclosed in preferred embodiment; right its is not in order to limit the utility model; any insider; in not breaking away from spirit and scope of the present utility model; when doing a little change and retouching, therefore protection domain of the present utility model is as the criterion when looking claims person of defining.
Claims (8)
1. a wave welding device is characterized in that, comprising:
One conveyer belt is in order to carrying and transmit a circuit board;
One molten tin bath is arranged under this conveyer belt, and has a flow-disturbing nozzle and an advection nozzle, and wherein, this flow-disturbing nozzle is to be interval in this advection nozzle with a specific range;
One primary heater is arranged under this conveyer belt, and is adjacent to this molten tin bath, in order to heat the lower surface of this circuit board;
One secondary heater is arranged on this conveyer belt, and with respect to this primary heater, in order to heat the upper surface of this circuit board; And
One the 3rd heater is arranged on this conveyer belt, and with respect to this flow-disturbing nozzle and this advection nozzle of this molten tin bath, in order to heat the upper surface of this circuit board.
2. wave welding device according to claim 1 is characterized in that, also comprises one the 4th heater, be arranged under this conveyer belt, and between this flow-disturbing nozzle and this advection nozzle, in order to heat the lower surface of this circuit board.
3. wave welding device according to claim 1 is characterized in that, the 3rd heater has one first temperature sensing Control Component, with respect to the upper surface of this circuit board, in order to sensing and control the temperature of the upper surface of this circuit board.
4. wave welding device according to claim 2 is characterized in that, the 4th heater has one second temperature sensing Control Component, with respect to the lower surface of this circuit board, in order to sensing and control the temperature of the lower surface of this circuit board.
5. a wave welding device is characterized in that, comprising:
One conveyer belt is in order to carrying and transmit a circuit board;
One molten tin bath is arranged under this conveyer belt, and has a flow-disturbing nozzle and an advection nozzle, and wherein, this flow-disturbing nozzle is to be interval in this advection nozzle with a specific range;
One primary heater is arranged under this conveyer belt, and is adjacent to this molten tin bath, in order to heat the lower surface of this circuit board;
One secondary heater is arranged on this conveyer belt, and with respect to this primary heater, in order to heat the upper surface of this circuit board; And
One the 3rd heater is arranged under this conveyer belt, and is between this flow-disturbing nozzle and this advection nozzle, in order to heat the lower surface of this circuit board.
6. wave welding device according to claim 5 is characterized in that, also comprises one the 4th heater, be arranged on this conveyer belt, and with respect to this flow-disturbing nozzle and this advection nozzle of this molten tin bath, in order to heat the upper surface of this circuit board.
7. wave welding device according to claim 5 is characterized in that, the 3rd heater has one first temperature sensing Control Component, with respect to the lower surface of this circuit board, in order to sensing and control the temperature of the lower surface of this circuit board.
8. wave welding device according to claim 6 is characterized in that, the 4th heater has one second temperature sensing Control Component, with respect to the upper surface of this circuit board, in order to sensing and control the temperature of the upper surface of this circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200620003230 CN2930938Y (en) | 2006-03-01 | 2006-03-01 | Wave soldering equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200620003230 CN2930938Y (en) | 2006-03-01 | 2006-03-01 | Wave soldering equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2930938Y true CN2930938Y (en) | 2007-08-08 |
Family
ID=38347438
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200620003230 Expired - Lifetime CN2930938Y (en) | 2006-03-01 | 2006-03-01 | Wave soldering equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2930938Y (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2473600B (en) * | 2009-08-25 | 2013-09-25 | Pillarhouse Int Ltd | Quick-loading soldering apparatus |
-
2006
- 2006-03-01 CN CN 200620003230 patent/CN2930938Y/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2473600B (en) * | 2009-08-25 | 2013-09-25 | Pillarhouse Int Ltd | Quick-loading soldering apparatus |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20070808 |
|
| EXPY | Termination of patent right or utility model |