CN101060092A - Passive component adhesion process method - Google Patents
Passive component adhesion process method Download PDFInfo
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- CN101060092A CN101060092A CN 200710104962 CN200710104962A CN101060092A CN 101060092 A CN101060092 A CN 101060092A CN 200710104962 CN200710104962 CN 200710104962 CN 200710104962 A CN200710104962 A CN 200710104962A CN 101060092 A CN101060092 A CN 101060092A
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Abstract
The provided bonding process method for passive assembly comprises: with a passive assembly with surface clad by adhesive material, before the adhesive layer thaws, thawing and curing the material at different temperature to form a fixed structure between the assembly and base. This invention improves product quality.
Description
Technical field
The invention relates to a kind of passive component adhesion process method, particularly can solve the passive component adhesion process method that melts the upright problem of semiconductor upright stone tablet that the Xi Lali imbalance caused because of the passive component two ends relevant for a kind of.
Background technology
In present encapsulation procedure or electronic assemblies processing procedure, passive component need according to design to need usually, be arranged on substrate or the circuit board individually or with other assembly, and the mode of the most generally using at present is surface mount technology (surface mount technology, SMT), processing procedure speed is fast, precision is high and repeated advantages of higher because this technology has.
With reference to Figure 1A to Fig. 1 C, it shows the flow process of at present general surface mount processing procedure.With reference to Figure 1A, at first, the substrate 10 (or circuit board) with several connection pads 12 is set on a surface, with the steel plate mode of printing tin cream 14 is printed on each connection pad 12.Then, with reference to Figure 1B,, contact and be positioned on the tin cream 14 on connection pad 12 surfaces with tin cream 14 with its two ends with a passive component 16.At last, with reference to Fig. 1 C, via a back welding process, solidify again after tin cream 14 is melted and passive component 16 is fixed on the substrate 10, and electrically connect connection pad 12 on the substrate 10, and finish this surface mount processing procedure.
Yet, existing surface mount process technique, usually because the error of some processing procedures, bit errors of specification error, printed steel plate and the substrate between each opening of printed steel plate etc. for example, cause the tin cream amount that is printed on each connection pad to have a little difference, and cause when reflow the tin that melts at passive component two ends to pull the strength imbalance, or, also can cause when reflow the tin that melts at passive component two ends to pull the strength imbalance because of passive component is offset the connection pad of being partial to wherein on one side to some extent when placing.These passive component two ends are melted tin and are pullled the unbalanced problem of strength, usually make passive component when surface mount, and passive component can depart from position originally slightly, still, and these departing from and can't too much influence be arranged slightly to the quality and the yield of product.
Yet, along with the requirement light, thin, short, little to electronic product, make every assembly also do littler and littler, passive component is no exception equally, but along with the passive component volume is more and more littler, to pull the strength imbalance increasing to the influence of surperficial adhesion process for the tin that melts at passive component two ends, especially to the passive component below 0402 grade.With reference to Fig. 2, the tin that melts at the passive component two ends that 0402 grade is following is pullled strength when uneven, can cause passive component to pull because of the tin that melts of an end that strength is excessive to be straightened or upright stone tablet upright (tombstone), therefore, cause the failure of surface mount processing procedure and the loss of product and yield.Therefore, need a kind of passive component adhesion process method badly, go for the following passive component of 0402 grade, and solution is pullled the uneven problem that causes passive component upright stone tablet upright (tombstone) of strength because of the tin that melts at passive component two ends.
Summary of the invention
In view of the above-mentioned problems, a purpose of the present invention is applicable to the passive component of each grade for a passive component adhesion process method is provided, especially the following passive component of 0402 grade.
Another object of the present invention is for providing a passive component adhesion process method, can solve because of the tin that melts at passive component two ends and pull upright (tombstone) problem of passive component upright stone tablet that the strength imbalance is caused, and then improve yield and reduce product loss.
A further object of the present invention is for providing a kind of passive component adhesion process method, can be when fixedly passive component make it in reflow, and can be because of not rocking or tin cream flows and causes its skew.
According to above-mentioned purpose, the invention provides a kind of passive component adhesion process method, at first, one substrate is provided, a wherein surface of substrate is provided with a paired connection pad, then, on each connection pad, form an adhesion layer, then, place a surface and coat the passive component of adhesion material on the adhesion layer of paired connection pad, again through a heat treatment processing procedure, adhesion material was melted earlier before adhesion layer melts flows to substrate, and solidify to form a fixed structure connect substrate and passive component with fixing passive component on substrate.
Therefore, utilize the passive component adhesion process method of the invention described above, before melting at adhesion layer, form a fixed structure fixedly passive component on substrate, can effectively can solve because of the tin that melts at passive component two ends and pull the upright problem of passive component upright stone tablet that the strength imbalance caused, make it when the reflow with preventing passive component, because of rocking or the tin cream problems such as causing its skew that flows, and then improve yield and minimizing product loss.
Description of drawings
Figure 1A to Fig. 1 C is the flow chart of traditional passive component adhesion process method.
Fig. 2 is an end view, and it shows the upright situation of the passive component upright stone tablet that uses traditional passive component adhesion process method and take place.
Fig. 3 A to Fig. 3 F is the flow chart of the passive device adhesion process method of one embodiment of the invention.
Embodiment
Some embodiments of the present invention are described in detail as follows.Yet except this was described in detail, the present invention can also be widely implements at other embodiment.That is to say that scope of the present invention is not subjected to the restriction of the embodiment that proposed, and the claim scope that proposes with the present invention is as the criterion.Secondly, when each assembly in the embodiments of the invention icon or structure during with single component or structrual description explanation, should be with this as the cognition that qualification is arranged, promptly following explanation not during the restriction on the lay special stress on number spirit of the present invention and range of application can spread on a plurality of assemblies or structure and structure of depositing and the method.Moreover in this manual, the different piece of each assembly is not drawn according to size fully, and some yardstick is compared with other scale dependent or had and exaggerated or simplify, to provide clearer description to promote the understanding of the present invention.And the prior art that the present invention continued to use is only done quoting of emphasis formula at this, to help elaboration of the present invention.
Fig. 3 A to Fig. 3 F shows the flow chart of the passive component adhesion process method of a preferred embodiment of the present invention.With reference to Fig. 3 A, at first, one substrate 100 is provided, one surface of substrate is provided with a paired connection pad 102, certainly be not limited to only have a paired connection pad 102 on the substrate 100, but can be according to the number of product design and demand and the passive component that will stick together, decide on the substrate number of connection pad 102 in pairs.Then, with reference to Fig. 3 B, with mode of printing adhesion layer 104 on each connection pad 102 surface printing, adhesion layer 104 is tin cream or other conducting adhesion material.
Come again,, place passive component 106 that a surface coated by an adhesion material 108 on the adhesion layer 104 on connection pad 102 surfaces, promptly be positioned on the tin cream with reference to Fig. 3 C.Material 108 coats but exposes the two ends 107 of passive component 106 though the surface of passive component 106 gets adhered, and contact with adhesion layer 104 and passive component 106 is arranged on the adhesion layer 104 with its two ends 107, in addition, the two ends 107 of passive component 106 can be used as the design of doing electric connection with connection pad 102 for power supply/ground contact or other.
Then, substrate 100, adhesion layer 104 and passive component 106 are heat-treated.At first, with reference to Fig. 3 D, be heated to first temperature adhesion material 108 of the passive component 106 of coating is melted, and flow downward on substrate 100 surfaces of passive component 106 belows, and connect passive component 106 and substrate 100 because of action of gravity makes the adhesion material 108 of thawing.Then, with reference to Fig. 3 E, be heated to second temperature, the adhesion material 108 of thawing is solidified to form a fixed structure 108a and connects moving assembly 106 and substrate 100, and fixedly passive component 106 on substrate 100.
At last, with reference to Fig. 3 F, be heated to the 3rd temperature, make adhesion layer 104, promptly tin cream melts and moving assembly 106 of joint and substrate 100 connection pad 102 on the two ends 107 of the moving assembly 106 of electric connection and the substrate 100.Before tin cream 104 melts, having formed a fixed structure 108a at substrate 100 and passive component 106 is fixed on passive component 106 on the substrate 100 firmly, therefore, even because aforesaid fabrication errors, or because of the passive component offset, cause passive component to pull the strength imbalance, the situation that passive component is holded up or upright stone tablet is upright can not take place yet because of the tin that melts at two ends.
First temperature is the melt temperature of adhesion material 108, and second temperature is the curing temperature of adhesion material 108, then is the melt temperature of adhesion layer 104 as for the 3rd temperature, and first temperature is less than second temperature, and second temperature is less than the 3rd temperature.Adhesion material 108 is an insulating material, can use capsulation material (molding compound), or other curing temperature heat cured insulation material higher than melt temperature, but its curing temperature is lower than the melt temperature of adhesion layer 104.When using capsulation material when coating the adhesion material 108 of passive component 106, first temperature is about about 100 ℃, and second temperature is about about 170 ℃, and if when using tin cream as adhesion layer 104, the melt temperature of adhesion layer 104, i.e. the 3rd temperature, about about 183 ℃, but, can look employed tin cream kind difference and change to some extent not as limit, even be higher than or a little less than 183 ℃, but the 3rd temperature need be higher than second temperature.
In addition, according to process requirement, be heated to steps such as first temperature, second temperature and the 3rd temperature, can once finish by a back welding process, or implement to be heated to steps such as first temperature and second temperature, implement to be heated to the 3rd temperature step by a back welding process again.Moreover, though the present invention is target with the passive component adhesion process method, also be embodiment with the passive component, the present invention also can be applied to the adhesion process of other assembly.
The invention provides a passive component adhesion process method, before adhesion layer melts, melt, flow and solidify by the adhesion material that coats the passive component surface, forming a fixed structure is fixed in passive component on the substrate, can effectively solve because of the tin that melts at passive component two ends and pull the upright problem of passive component upright stone tablet that the strength imbalance caused, make it when the reflow with preventing passive component, because of rocking or the tin cream problems such as causing its skew that flows, and then improve yield and minimizing product loss.
Claims (15)
1. passive component adhesion process method, it comprises following steps:
One substrate is provided, is provided with a paired connection pad on a surface of this substrate;
On each this connection pad, form an adhesion layer;
Place a passive component on the adhesion layer of this paired connection pad, this passive component surface is coated by an adhesion material; And
Heat-treat,, and solidify to form a fixed structure to fix this passive component on this substrate so that adhesion material melts after this substrate flows.
2. passive component adhesion process method as claimed in claim 1 is characterized in that: this adhesion layer is a conductive material.
3. passive component adhesion process method as claimed in claim 2 is characterized in that: this conductive material is a tin cream.
4. passive component adhesion process method as claimed in claim 1 is characterized in that: the step of this substrate of this heat treatment, this passive component and this adhesion layer comprises:
Heat this adhesion material to one first temperature, flow and connect this passive component and this substrate to this substrate so that adhesion material melts; And
Heat this adhesion material to one second temperature, this passive component is fixed on this substrate to solidify this adhesion material.
5. passive component adhesion process method as claimed in claim 4 is characterized in that: this second temperature is higher than this first temperature.
6. passive component adhesion process method as claimed in claim 4 is characterized in that: it more comprises heating this adhesion layer to one the 3rd temperature so that this passive component engages and form the step that electrically connects with this substrate by adhesion layer.
7. passive component adhesion process method as claimed in claim 6 is characterized in that: the 3rd temperature is higher than this second temperature.
8. passive component adhesion process method as claimed in claim 1 is characterized in that: this adhesion material is the insulation material.
9. passive component adhesion process method as claimed in claim 8 is characterized in that: this insulation material is a capsulation material (molding compound).
10. passive component adhesion process method as claimed in claim 1 is characterized in that: it more comprises a back welding process so that this passive component engages and form the step that electrically connects with this substrate by adhesion layer.
11. a passive component is characterized in that: it comprises a passive component and the adhesion material with at least one power supply/ground contact and coats this passive component surface, but exposes this power supply/ground contact.
12. passive component as claimed in claim 11 is characterized in that: this adhesion material is the insulation material.
13. passive component as claimed in claim 12 is characterized in that: this adhesion material is a capsulation material (molding compound).
14. passive component as claimed in claim 12 is characterized in that: this adhesion material has a melt temperature and a curing temperature.
15. passive component as claimed in claim 14 is characterized in that: this curing temperature is higher than this melt temperature.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2007101049621A CN100543954C (en) | 2007-05-08 | 2007-05-08 | Passive component adhesion process method and passive component |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2007101049621A CN100543954C (en) | 2007-05-08 | 2007-05-08 | Passive component adhesion process method and passive component |
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| Publication Number | Publication Date |
|---|---|
| CN101060092A true CN101060092A (en) | 2007-10-24 |
| CN100543954C CN100543954C (en) | 2009-09-23 |
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| Application Number | Title | Priority Date | Filing Date |
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| CNB2007101049621A Expired - Fee Related CN100543954C (en) | 2007-05-08 | 2007-05-08 | Passive component adhesion process method and passive component |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108289390A (en) * | 2018-03-21 | 2018-07-17 | 上海飞骧电子科技有限公司 | Solve support plate design, packaging method and support plate that small-sized Resistor-Capacitor Unit is set up a monument |
| CN112996274A (en) * | 2021-02-24 | 2021-06-18 | 广州立景创新科技有限公司 | Surface mounting method and semiconductor device |
-
2007
- 2007-05-08 CN CNB2007101049621A patent/CN100543954C/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108289390A (en) * | 2018-03-21 | 2018-07-17 | 上海飞骧电子科技有限公司 | Solve support plate design, packaging method and support plate that small-sized Resistor-Capacitor Unit is set up a monument |
| WO2019179061A1 (en) * | 2018-03-21 | 2019-09-26 | 深圳飞骧科技有限公司 | Carrier board design and packaging method capable of solving tombstoning of small-sized resistor-capacitor unit, and carrier board |
| CN108289390B (en) * | 2018-03-21 | 2024-08-06 | 上海飞骧电子科技有限公司 | Carrier plate design and packaging method for solving tombstoning problem of small-sized resistor-capacitor element and carrier plate |
| CN112996274A (en) * | 2021-02-24 | 2021-06-18 | 广州立景创新科技有限公司 | Surface mounting method and semiconductor device |
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| Publication number | Publication date |
|---|---|
| CN100543954C (en) | 2009-09-23 |
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Granted publication date: 20090923 Termination date: 20210508 |