CN2873931Y - Ground heating composite floor - Google Patents

Ground heating composite floor Download PDF

Info

Publication number
CN2873931Y
CN2873931Y CN 200520140148 CN200520140148U CN2873931Y CN 2873931 Y CN2873931 Y CN 2873931Y CN 200520140148 CN200520140148 CN 200520140148 CN 200520140148 U CN200520140148 U CN 200520140148U CN 2873931 Y CN2873931 Y CN 2873931Y
Authority
CN
China
Prior art keywords
solid wood
layer
composite floor
floor
substrate layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN 200520140148
Other languages
Chinese (zh)
Inventor
陈士民
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to CN 200520140148 priority Critical patent/CN2873931Y/en
Application granted granted Critical
Publication of CN2873931Y publication Critical patent/CN2873931Y/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Abstract

The utility model discloses a floor-heating compound floor board, which comprises a surface course and a substrate course. The substrate course is provided with some partition slots arranged in transversal direction in relative to the direction of the floor board. The partition slots go deeply into the substrate course through the lower bottom of the substrate course. The surface course is a solid timber with good decorative grains. The substrate course is made up by a plurality of courses of solid-timber compound boards. The utility model is of simple structure, easy to process, of low cost, rapid heat transferring, even heat radiation and good resistance to deformation.

Description

Terrestrial heat composite floor
Technical field
The utility model relates to a kind of new decorative material for building, especially a kind of terrestrial heat composite floor.
Background technology
Along with the raising of people's living standard, heating floor heating is more and more universal.With traditional heating system ratio, adopt heating floor low-temp radiation heating device, surface temperature height during use, head temperature is low, can give the people comfort of " the warm head of pin is cool ".And,, be easier to the layout in room and attractive in appearance because cancelled caliduct and the radiator in the room.
This heating system is that heating plant all is embedded in the surface layer, and surface layer is evenly generated heat, and passes to the surface by the back side, floor through the floor, makes indoor warming by surface radiating then.Thereby, adopt this heating system very high to the requirement on floor, its floor should have fast, the heat-resisting and on-deformable characteristics of heat transfer.Like this, the wood flooring of traditional structure just is not suitable as heating floor and has used.
The utility model content
The purpose of this utility model is: a kind of terrestrial heat composite floor is provided, and it is simple in structure, easy to process, cost is low, heat transfer is fast, heat radiation is even, anti-deformation is good.
The technical solution of the utility model is: a kind of terrestrial heat composite floor, comprise surface material layer, substrate layer, and described substrate layer is provided with interval trough, and described interval trough gos deep into substrate layer inside by the substrate layer bottom surface.
Below technique scheme is further explained:
1. described interval trough is with respect to floor direction horizontally set.
2. described surface material layer is the solid wood chip with good ornamental wood grain, and described substrate layer is a multi-layer solid wood composite board.
3. the first floor solid wood chip grain direction of described surface material layer solid wood chip and multi-layer solid wood composite board is orthogonal.
4. each of described multi-layer solid wood composite board layer solid wood chip grain direction is orthogonal.
5. described surface material layer solid wood chip thickness is 2mm to 4mm.
6. can cut whole substrate layer open when the groove depth of interval trough is the darkest.At this moment, substrate layer is cut into solid wood composite board piece one by one, is connected to whole floor by the surface material layer solid wood chip.
7. the groove width of interval trough is about 1mm to 2mm.The interval trough transversal slotting connects the floor, and the 4cm to 6cm of being separated by is provided with an interval trough.
The utility model has the advantages that:
1. terrestrial heat composite floor of the present utility model, simple in structure, easy to process, cost per unit is low.
2. terrestrial heat composite floor of the present utility model conducts heat soon, heat radiation is even, anti-deformation is good.
3. the interval trough of terrestrial heat composite floor of the present utility model design after the floor is heated, can be satisfied the needs of sheet material expanded by heating, effectively solves the floor board yielding problem of being heated; While is water conservancy diversion hot gas effectively, has conduct heat fast and advantage of uniform.In addition, can also effectively resist the distortion that produces because of making moist.
4. terrestrial heat composite floor of the present utility model adopts the multi-layer solid wood composite board structure, because surface material layer, each solid wood chip texture of substrate layer are orthogonal, form longitudinal and transverse cross-laminated, the internal stress of each layer generation is not in same directive effect after the floor is heated, stress conditions each other, thereby deformation resistance, good stability.
Description of drawings
The utility model will be further described below in conjunction with drawings and Examples:
Fig. 1 is structural representation of the present utility model (longitudinal profile);
Fig. 2 is a upward view of the present utility model.
Wherein: 1 surface material layer; 2 substrate layers; 3 interval troughs.
The specific embodiment
Embodiment: as shown in Figure 1, a kind of terrestrial heat composite floor comprises surface material layer 1, substrate layer 2, and described substrate layer 2 is provided with the interval trough 3 with respect to floor direction horizontally set, and described interval trough 3 vertically gos deep into substrate layer 2 inside by substrate layer 2 bottom surfaces.
In the present embodiment, entirely plate thickness is about 13.5mm, and the groove depth of interval trough 3 is about 8mm, and the groove width of interval trough 3 is about 1.2mm.
As shown in Figure 2, these interval trough 3 transversal slottings connect the floor, and in the present embodiment, the 5cm of being separated by is provided with an interval trough 3.
The solid wood chip of surface material layer 1 for having good ornamental wood grain, surface material layer solid wood chip thickness is 3mm.Substrate layer 2 is a multi-layer solid wood composite board, chooses the fast growing wood manufacturing, improves timber utilization rate, reduces cost.
The first floor solid wood chip grain direction of described surface material layer solid wood chip and multi-layer solid wood composite board is orthogonal; Each of described multi-layer solid wood composite board layer solid wood chip grain direction is intersected in length and breadth.Each layer wood chip is bonding by bonding adhesive.
Above embodiment is as just understanding explanation of the present utility model, rather than to restriction of the present utility model.As the sheet metal thickness of wherein mentioning, the concrete data of interval trough groove depth etc.
Certainly, terrestrial heat composite floor of the present utility model also can have multiple conversion and remodeling, is not limited to the concrete structure of above-mentioned embodiment.In a word, protection domain of the present utility model should comprise those conspicuous to those skilled in the art conversion or substitute and remodeling.

Claims (7)

1. a terrestrial heat composite floor comprises surface material layer (1), substrate layer (2), and it is characterized in that: described substrate layer (2) is provided with interval trough (3), and described interval trough (3) gos deep into substrate layer (2) inside by substrate layer (2) bottom surface.
2. terrestrial heat composite floor according to claim 1 is characterized in that: described interval trough (3) is with respect to floor direction horizontally set.
3. terrestrial heat composite floor according to claim 1 and 2 is characterized in that: the solid wood chip of described surface material layer (1) for having good ornamental wood grain, described substrate layer (2) is a multi-layer solid wood composite board.
4. terrestrial heat composite floor according to claim 3 is characterized in that: the first floor solid wood chip grain direction of described surface material layer solid wood chip and multi-layer solid wood composite board is orthogonal.
5. terrestrial heat composite floor according to claim 3 is characterized in that: each of described multi-layer solid wood composite board layer solid wood chip grain direction is orthogonal.
6. terrestrial heat composite floor according to claim 3 is characterized in that: described surface material layer solid wood chip thickness is 2mm to 4mm.
7. terrestrial heat composite floor according to claim 1 is characterized in that: can cut whole substrate layer (2) open when described interval trough (3) is the darkest.
CN 200520140148 2005-12-16 2005-12-16 Ground heating composite floor Expired - Fee Related CN2873931Y (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN 200520140148 CN2873931Y (en) 2005-12-16 2005-12-16 Ground heating composite floor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN 200520140148 CN2873931Y (en) 2005-12-16 2005-12-16 Ground heating composite floor

Publications (1)

Publication Number Publication Date
CN2873931Y true CN2873931Y (en) 2007-02-28

Family

ID=37780527

Family Applications (1)

Application Number Title Priority Date Filing Date
CN 200520140148 Expired - Fee Related CN2873931Y (en) 2005-12-16 2005-12-16 Ground heating composite floor

Country Status (1)

Country Link
CN (1) CN2873931Y (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102581911A (en) * 2012-03-29 2012-07-18 浙江福马地暖科技有限公司 Double-layer solid wood heating floor production method
CN102888976A (en) * 2012-10-26 2013-01-23 孙琇芳 Wood plastic energy-saving heated floor
WO2013060104A1 (en) * 2011-10-26 2013-05-02 广东盈然木业有限公司 Solid wood flooring for geothermal environment
CN103963373A (en) * 2014-05-06 2014-08-06 南京林业大学 Electric heating floor blank based on CLT (Cross-Laminated Timber) board and manufacturing method thereof
CN105751328A (en) * 2016-02-22 2016-07-13 冯士祥 Solid-wood board and processing technology for solving internal stress deformation of board itself
CN106677480A (en) * 2016-12-20 2017-05-17 苏州金威特工具有限公司 Thin double-layer solid wood heated floor with edge covered with metal

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013060104A1 (en) * 2011-10-26 2013-05-02 广东盈然木业有限公司 Solid wood flooring for geothermal environment
CN102581911A (en) * 2012-03-29 2012-07-18 浙江福马地暖科技有限公司 Double-layer solid wood heating floor production method
CN102888976A (en) * 2012-10-26 2013-01-23 孙琇芳 Wood plastic energy-saving heated floor
CN103963373A (en) * 2014-05-06 2014-08-06 南京林业大学 Electric heating floor blank based on CLT (Cross-Laminated Timber) board and manufacturing method thereof
CN103963373B (en) * 2014-05-06 2016-03-16 南京林业大学 A kind of electric heating floor blank based on CLT plate and manufacture method thereof
CN105751328A (en) * 2016-02-22 2016-07-13 冯士祥 Solid-wood board and processing technology for solving internal stress deformation of board itself
CN106677480A (en) * 2016-12-20 2017-05-17 苏州金威特工具有限公司 Thin double-layer solid wood heated floor with edge covered with metal

Similar Documents

Publication Publication Date Title
CN2873931Y (en) Ground heating composite floor
CN100371553C (en) Composite floor for heating
CN103266742A (en) Four-layer solid wood compound geothermal floor and manufacturing technique thereof
CN207846976U (en) A kind of Floor Heating
CN101736881B (en) Self-heating floorboard
CN203499206U (en) Aluminum-wood composite heating floor
CN2871713Y (en) Assembled geothermal floor
CN201148717Y (en) Terrestrial heat floor with heat conducting groove
CN201255464Y (en) Dry-type floor warming device
CN205065885U (en) Plate structure warms up room silicon wafer
CN108488889A (en) Embedded type Warm slice of electric heat
CN101962984A (en) Composite geothermal floor
CN201512916U (en) Insulating stone composite board
CN201620562U (en) Self-heating floor
CN203050039U (en) Heat conducting board structure of floor heating system
CN202064590U (en) Floor base material with heat conductive effect
CN101372863A (en) Two-layer charring solid wood terrestrial heat composite floor
CN206034801U (en) Heating panel
CN215368469U (en) Metal plate composite heating floor
CN201865290U (en) Geothermal floor capable of heat storage and slow heat release
CN207003921U (en) A kind of OSB floors with heat-transfer device
CN205976169U (en) Sloping roofing of self preservation temperature
CN210459867U (en) Building energy-saving floor
CN2714698Y (en) Composite wood floor
CN201059049Y (en) Multi-layer solid-wood composite heated floor

Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
C19 Lapse of patent right due to non-payment of the annual fee
CF01 Termination of patent right due to non-payment of annual fee