CN207003921U - A kind of OSB floors with heat-transfer device - Google Patents
A kind of OSB floors with heat-transfer device Download PDFInfo
- Publication number
- CN207003921U CN207003921U CN201720916031.0U CN201720916031U CN207003921U CN 207003921 U CN207003921 U CN 207003921U CN 201720916031 U CN201720916031 U CN 201720916031U CN 207003921 U CN207003921 U CN 207003921U
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- osb
- floors
- heat
- transfer device
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Abstract
A kind of OSB floors with heat-transfer device, including mounting seat plate, OSB floors and heat-transfer device, the mounting seat plate is provided with one group of neck, the OSB floors include inner sandwich layer and decoration panel, the inner sandwich layer is bonded on the top surface of bedplate provided with one group of heating column by hole, the bottom surface of inner sandwich layer, and one group of heating column is connected by the bottom in hole with one group of neck, the decoration panel is provided with inner core plates docking recess, and amount slow-release plate installation neck is provided with the inner core plates docking recess；The utility model is reasonable in design, and heat-transfer device is integrated in OSB floors, greatly increases the thermal conductivity on OSB floors.And the intensity on floor is not influenceed, there is good practical value.
Description
Technical field
It the utility model is related to OSB technical field of floor, and in particular to a kind of OSB floors with heat-transfer device.
Background technology
At present, it is increasingly deficient with the forest reserves, and to be mostly solid wood be made on existing floor, is used as heat conducting floor
Seem not economical enough, and can reaches heat conduction purpose simultaneously in order to reach saving timber, generally between the top layer on floor and bottom
Provided with hollow out or loose conductive structure, although timber has been saved on this floor but its thermal conductivity is poor, while makes work
Skill is more complicated, and cost is high, and floor is also not sufficiently stable when in use, and it is existing interlayer loosening and floor cracking etc. easily occur
As.
Utility model content
The purpose of this utility model is primarily to be directed to above-mentioned technical problem, and provide a kind of OSB with heat-transfer device
Floor.
The utility model includes mounting seat plate, OSB floors and heat-transfer device, and the mounting seat plate is provided with one group of card
Groove, the OSB floors include inner sandwich layer and decoration panel, and the inner sandwich layer passes through hole, the bottom surface of inner sandwich layer provided with one group of heating column
It is bonded on the top surface of bedplate, and one group of heating column is connected by the bottom in hole with one group of neck, the decoration panel is provided with interior
Core plate docking recess, the inner core plates docking recess is interior to be provided with amount slow-release plate installation neck, and decoration panel spiral-lock is in inner sandwich layer
Upper surface, the heat-transfer device include one group of conducting copper plate, one group of heat conduction copper post and aluminium sheet, and one group of conducting copper plate is blocked respectively
In one group of neck of mounting seat plate, one group of heat conduction copper post is arranged on one group of heating column of inner sandwich layer by hole,
And bottom is docked with conducting copper plate respectively, the aluminium sheet docks with the upper surface of one group of heat conduction copper post, and positioned at the heat of decoration panel
In amount sustained release plate installation neck.
The bottom of heat conduction copper post is spirally connected with conducting copper plate.
The thickness of the conducting copper plate is 0.2-0.3mm.
The thickness of the aluminium sheet is 0.3-0.5mm.
The utility model has the advantages that：The utility model is reasonable in design, heat-transfer device is integrated in OSB floors, greatly
The thermal conductivity on big increase OSB floors.And the intensity on floor is not influenceed, there is good practical value.
Brief description of the drawings
Fig. 1 is structural representation of the present utility model.
Embodiment
As shown in drawings, the utility model includes mounting seat plate 1, OSB floors and heat-transfer device, the mounting seat plate
1 is provided with one group of neck, and the OSB floors include inner sandwich layer 2 and decoration panel 3, and the inner sandwich layer 2 passes through provided with one group of heating column
Hole, the bottom surface of inner sandwich layer 2 are bonded on the top surface of bedplate 1, and one group of heating column is connected by the bottom in hole with one group of neck,
The decoration panel 3 is provided with inner core plates docking recess, and amount slow-release plate installation neck, facing are provided with the inner core plates docking recess
The spiral-lock of plate 3 includes one group of conducting copper plate, 4, one groups of heat conduction copper posts 5 and aluminium sheet 6 in the upper surface of inner sandwich layer 2, the heat-transfer device,
One group of conducting copper plate 4 is installed in one group of neck of mounting seat plate 1 respectively, and one group of heat conduction copper post 5 is arranged on interior
One group of heating column of sandwich layer 2 is by hole, and bottom is docked with conducting copper plate 4 respectively, the aluminium sheet 6 and one group of heat conduction copper post 5
Upper surface docking, and positioned at decoration panel 3 amount slow-release plate installation neck in.
The bottom of heat conduction copper post 5 is spirally connected with conducting copper plate 4.
The thickness of the conducting copper plate 4 is 0.2-0.3mm.
The thickness of the aluminium sheet 6 is 0.3-0.5mm.
Working method and principle：The utility model using when be laid on the room with floor heating by mounting seat plate 1 is smooth
On ground, the heat that floor heating is sent absorbs collection by one group of conducting copper plate 4 first, because the thermal conductivity of copper material is preferable,
Heat can run through one group of heat conduction copper post 5 onward into aluminium sheet 6, because the specific heat capacity of aluminium material is more than copper again, therefore
Aluminium sheet 6 can store more heat, and constantly can dissipate heat to room by very thin decoration panel 3.
Claims (4)
1. a kind of OSB floors with heat-transfer device, it is characterised in that it includes mounting seat plate（1）, OSB floors and heat conduction dress
Put, the mounting seat plate（1）Provided with one group of neck, the OSB floors include inner sandwich layer（2）And decoration panel（3）, the inner core
Layer（2）Pass through hole, inner sandwich layer provided with one group of heating column（2）Bottom surface be bonded in bedplate（1）Top surface on, and one group of heating column
Connected by the bottom in hole with one group of neck, the decoration panel（3）Provided with inner core plates docking recess, the inner core plates docking recess
It is interior to be provided with amount slow-release plate installation neck, decoration panel（3）Spiral-lock is in inner sandwich layer（2）Upper surface, the heat-transfer device include one
Group conducting copper plate（4）, one group of heat conduction copper post（5）And aluminium sheet（6）, one group of conducting copper plate（4）Mounting seat is installed on respectively
Plate（1）One group of neck in, one group of heat conduction copper post（5）Installed in inner sandwich layer（2）One group of heating column by hole, and bottom
Portion respectively with conducting copper plate（4）Docking, the aluminium sheet（6）With one group of heat conduction copper post（5）Upper surface docking, and be located at decoration panel
（3）Amount slow-release plate installation neck in.
A kind of 2. OSB floors with heat-transfer device according to claim 1, it is characterised in that heat conduction copper post（5）Bottom
With conducting copper plate（4）It is spirally connected.
A kind of 3. OSB floors with heat-transfer device according to claim 1, it is characterised in that the conducting copper plate（4）'s
Thickness is 0.2-0.3mm.
A kind of 4. OSB floors with heat-transfer device according to claim 1, it is characterised in that the aluminium sheet（6）Thickness
For 0.3-0.5mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720916031.0U CN207003921U (en) | 2017-07-26 | 2017-07-26 | A kind of OSB floors with heat-transfer device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720916031.0U CN207003921U (en) | 2017-07-26 | 2017-07-26 | A kind of OSB floors with heat-transfer device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207003921U true CN207003921U (en) | 2018-02-13 |
Family
ID=61456050
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720916031.0U Active CN207003921U (en) | 2017-07-26 | 2017-07-26 | A kind of OSB floors with heat-transfer device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207003921U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109881863A (en) * | 2019-01-29 | 2019-06-14 | 沈库 | A kind of behaviour room spontaneous-heating type floor and its laying method |
-
2017
- 2017-07-26 CN CN201720916031.0U patent/CN207003921U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109881863A (en) * | 2019-01-29 | 2019-06-14 | 沈库 | A kind of behaviour room spontaneous-heating type floor and its laying method |
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